Rigid-Flex PCB Manufacturer

Wonderful PCB provides Rigid-Flex PCB Manufacturing and Assembly with Fast Delivery and Competitive Prices.

Rigid-Flex PCB Stackup

See the left 4 Layers and 6 Layers Rigid-Flex PCB Stackup, you can clearly see the difference from Rigid PCB and Flexible PCB. Meanwhile you can click to see the Flexible PCB Stackup.

If you have any questions about Rigid-Flex Stackup, or design, manufacturing questions, don’t to contact for help.

Typical Material of Rigid-Flex PCB

Rigid-Flex PCB is made of two parts, which is flexible PCB and Rigid PCB. so the material includes flexible PCB material and Rigid PCB material. The common Rigid PCB board material is FR4, but for hybrid Rigid-Flex PCb, the rigid PCB also can be metal core PCB, rf PCB, and other PCB material. The following just list FR4 as Rigid PCB board material.

Material for Rigid PCB

Material for Flexible PCB

Material for Rigid PCB

Material for rigid PCBs	Tg	CTE-z (T<Tg)	εr, Dk- Permittivity	Dk Loss Tangent	Electric Strength	Surface Resistivity	Tracking resistance CTI	Td value	Peel strength
	°C	ppm/°C	@1GHz	@1GHz	KV/mm	MO	PLC	°C	N/mm
ISOLA Duraver DE104 Standard FR4	135°	70	4,4	0,020	54	1,0 x 10^6	2	315°	1,6
Shengyi S1141 FR4 alternative	140°	65	4,6*	0,015*	60	5,4 x 10^7	3	310°	1,8
ISOLA Duraver DE104 KF FR4 tracking resistant	135°	45	4,6 – 4,9	0,020*	39	1,0 x 10^6	1	315°	1,6
ISOLA DE156 FR4 halogen-free	155°	45	4,0	0,016	36	4,0 x 10^6	–	390°	1,4
ISOLA IS400 FR4 MidTg	150°	50	4,0**	0,020	48	3,0 x 10^6	3	330°	1,4
ITEQ IT-158 FR4 MidTg alternative	155°	60	4,3	0,016	60	1,0 x 10^10	–	345°	1,7
ITEQ IT-180A FR4 HTg	175°	45	4,4	0,015	45	3,0 x 10^10	–	345°	1,4
Shengyi S1000-2 FR4 HTg alternative	180°	45	4,8*	0,013*	63	7,9 x 10^7	3	345°	1,4
ISOLA IS410 FR4 HTg, CAF-Enhanced	180°	55	4,0	0,019	44	8,0 x 10^6	3	350°	1,2
ISOLA IS420 FR4 HTg, CAF-Enhanced alt.	170°	45	4,0	0,016	54	3,0 x 10^6	3	350°	1,3

Material for Flexible PCB

Material for flexible PCBs	Recommended max. operating temperature	Copper type	Tg	Ԑr, Dk- Permittivity	CTE-z (T<Tg)	Electric Strength	Surface resistivity	Peel strength
	°C	*	°C	@1MHz	ppm/°C	KV/mm	MΩ	N/mm
Polyimide + Adhesive
Shengyi SF305	105°	Rolled Copper	–	3,6	21	–	1 x 10^5	1,1
Polyimide
DuPont Pyralux AP	180°	Rolled Copper	220	3,4	25	256	1 x 10^10	1.8
Panasonic RF775	130°	Electrolytically Deposited Coppe	343	3,2	–	276	1 x 10^8	1,7
Thinflex W-05050	105°	Electrolytically Deposited Coppe	350	3,3	24	216	1 x 10^5	0.6
PI Coverlay
Shengyi SF305	105°	–	–	–	–	–	3 x 10^6	–
DuPont Pyralux FR	180°	–	–	3.5	–	138	1 x 10^7	–
Adhesive tape
3M 9077	150°	–	–	–	–	–	–	–

Typical Rigid-Flex PCB Manufacturing Flow Chart

Rigid-Flex PCB Manufacturing Capability

Feature	Capability
Quality Grade	Standard IPC 2
Number of Layers	2 – 30layers
Order Quantity	1pc – 10000+pcs
Build Time	2days – 5weeks
Material	Polyimide, High Tg polyimide, FR4, High Tg FR4
Material Brand	Shengyi, Ventec, ITEQ, Rogers, Panasonic, Dupont, Taiflex
Board Size	Min 6mm x 6mm Max 500mm x 1,000mm
Board Thickness	0.08mm – 5.0mm
Copper Weight (Finished)	0.5oz – 4.0oz
Min Tracing/Spacing	0.04mm/0.04mm
Solder Mask Sides	As per the file
Solder Mask Color	Green, White, Blue, Black, Red, Yellow
Silkscreen Sides	As per the file
Silkscreen Color	White, Black, Yellow
Surface Finish	HASL – Hot air solder leveling Lead – free HASL – RoHS ENIG – RoHS
Min Annular Ring	4mil
Min Drilling Hole Diameter	Laser Drilled: 3mil, Mechanical Drilled: 4 mil;
Max Mechanical Through Hole Aspect Ratio	14:1
Min Single-ended Impedance Tolerance Min Differential Impedance Tolerance	±8%
Min Soldermask Bridge	0.07 mm
Min BGA Pitch	0.45 mm
Other Techniques	HDI Gold fingers Stiffener