BGA Overview
BGA imhando yechip package, ipfupi yeBall Grid Array muChirungu. Mapini epasuru ibhora gidhi arrays pazasi pepakeji, uye mapini ane denderedzwa uye akarongwa mune grid-sepateni, nekudaro zita rekuti BGA.
Mazhinji mamaboard control machipisi anoshandisa iyi rudzi rwekurongedza tekinoroji, uye zvinhu zvacho zvakanyanya ceramic. Memory yakarongedzwa neBGA tekinoroji inogona kuwedzera ndangariro huwandu kaviri kana katatu pasina kushandura vhoriyamu. Kuenzaniswa neTSOP, BGA ine vhoriyamu diki, kupisa kuri nani, uye kushanda kwemagetsi.
BGA Package Pad Routing Dhizaini
1. Kufambisa pakati peBGA pads
Munguva yekugadzira, iyo BGA pad spacing isingasviki 10mil, uye nzira haibvumirwe pakati peBGA mbiri, nekuti mutsara wakafaranuka wekufamba unopfuura kugona kwekugadzira. Kana routing ichizoitwa, iyo BGA pad inogona kuderedzwa chete. Paunenge uchigadzira dhizaini yekugadzira, kuve nechokwadi chekuti nzvimbo yakakwana inocheka iyo BGA pad. Iyo padhi inochekwa kuita yakakosha chimiro, iyo inogona kukonzera isina kururama welding chinzvimbo mune inotevera welding.
2. Kuzadza via mupadhi neresin plugging
Kana iyo pad spacing yeBGA package iri diki uye waya haigone kufambiswa, via mune padhi inoda kugadzirwa, ndiko kuti, gomba rinoroverwa padhi uye waya inofambiswa kubva mukati memukati kana pasi pasi. Panguva ino, iyo via mupadhi inoda kuzadzwa neresin plugging uye electroplating. Kana iyo via mupedhi ikasatora resin plugging process, inotungamira mukusakisa welding panguva yewelding, nekuti pane gomba pakati pepadhi uye nzvimbo yewelding idiki, uye tini inodonha kubva mugomba.
3. BGA nzvimbo kuburikidza plugging
Iyo vias muBGA pad nzvimbo inowanzoda kuvharirwa. Kune iyo sampuli, tichifunga nezve mutengo uye kuomerwa kwekugadzira, iyo yekutanga vias yakafukidzwa nemafuta. Nzira yeku plugging ndeye inki plugging. Chakanakira plugging ndechekudzivirira kunze kwenyika mugomba kana kuchengetedza hupenyu hwesevhisi yeVia. Uye zvakare, kana iyo SMT chigamba ichidzoreredzwa, iyo via tin inokonzeresa pfupi pfupi kune rimwe divi.
4. Via mune padhi, HDI dhizaini
YeBGA machipi ane diki pini spacing, kana pini padhi isingagone kufambiswa nekuda kwemaitiro, zvinokurudzirwa kugadzira zvakananga via mupadhi. Semuenzaniso, iyo BGA chip yebhodhi mbozha nhare idiki, ine mapini mazhinji uye madiki mapini spacing, saka hazvibviri kufambisa waya kubva pakati pepini. Chete HDI bofu yakavigwa gomba wiring nzira inogona kushandiswa kugadzira iyo PCB. Iyo BGA pad inoroverwa negomba mundiro, mukati memukati inorohwa negomba rakavigwa, uye mukati memukati wakapetwa uye wakabatana.
BGA Welding Process Hunhu
1. Kudhinda solder paste
Chinangwa chekudhinda paste paste ndechekuisa zvakaenzana huwandu hwakakodzera hwesolder paste kumapadhi ePCB kuve nechokwadi chekuti zvigamba zvepatch uye mapadhi anowirirana ePCB anotengeswa zvakare kuti awane kubatanidza kwakanaka kwemagetsi uye simba rakakwana remagetsi. Kudhinda solder paste, tinoda kugadzira mesh yesimbi. Iyo solder paste inopfuura nepamazaru anoenzanirana epadhi yega yega pane mesh yesimbi, uye tini yakavharwa zvakaenzana padhi yega yega pasi pechiito cheiyo scraper kuti iwane yakanaka welding.
2. Kuiswa kwechigadzirwa
Kuiswa kwemudziyo kupeta, iko kushandisa muchina wekuisa kuisa nemazvo chip zvikamu panzvimbo inowirirana yePCB yakadhindwa nesolder paste kana chigamba glue. Michina yekumhanyisa-inomhanya yekuisa yakakodzera kukwirisa zvidiki uye zvihombe zvikamu: senge capacitors, resistors, nezvimwe, uye zvakare inogona kukwira zvimwe zvikamu zveIC. General-chinangwa chekuisa michina yakakodzera kukwirisa heterogeneous kana yakakwirira-chaiyo zvikamu: seQFP, BGA, SOT, SOP, PLCC, nezvimwewo.
3. Reflow soldering
Reflow soldering ndeyekunyungudutsa solder paste pane redunhu bhodhi padhi kuti uwane mechanic uye magetsi kubatana pakati peiyo yepamusoro-yakaiswa chikamu chesolder yekupedzisira uye PCB pad kuti igadzire dunhu remagetsi. Reflow soldering inzira yakakosha mukugadzirwa kweSMT. Inonzwisisika tembiricha curve kuseta ndiyo kiyi yekuve nechokwadi chemhando yereflow soldering. Tembiricha isina kufanira curve inokonzeresa hurema hwewelding senge isina kukwana soldering, kutonhora soldering, component warping, yakawandisa solder mabhora, etc. paPCB board, zvichikanganisa kunaka kwechigadzirwa.
4. X-Ray kuongorora
X-Ray inogona kutarisa anenge ese maitiro akaremara. Kuburikidza nemaonero maitiro eX-Ray, chimiro chejoint solder chinogona kutariswa uye kuenzaniswa neyakajairwa chimiro mu library library kuti utonge kunaka kweiyo solder joint. Izvi zvinonyanya kubatsira kune solder kubatana kuongorora kweBGA uye DCA zvikamu. Basa rekuongorora X-Ray harigone kudzoserwa, sezvo risingade bvunzo mold. Nekudaro, chakashata ndechekuti mutengo wekuongorora X-Ray parizvino unodhura zvakanyanya.
Zvikonzero zveUrombo BGA Welding
1. Makomba asina kugadziriswa BGA pedhi
Pane maburi pamapedhi eBGA welding. Munguva yewelding process, solder mabhora anogona kurasika pamwe chete ne solder. Nekuda kwekushaikwa kweiyo yakakodzera yekudzivirira welding process muPCB kugadzirwa, solder uye solder mabhora anogona kupukunyuka nepamakomba ari pedyo newelding board, zvichikonzera kurasikirwa kwemabhora ekutengesa.
2. Mapedhi akasiyana-siyana
Saizi dzakasiyana dzeBGA solder pads dzinogona kukanganisa kunaka kwegoho reiyo welding process. Iyo inotungamira-kunze waya yeBGA pad haifanirwe kudarika 50% yedhayamita yepadhi, uye iyo inotungamira-kunze waya yemagetsi padhi haifanirwe kunge isingasviki 0.1mm. Inofanirawo kuve yakakora kudzivirira iyo welding pad kubva pakukanganisa. Pamusoro pezvo, hwindo rekuvharisa welding harifanirwe kunge rakakura kupfuura 0.05mm, uye kuvhura pamusoro pemhangura kunofanirwa kufanana nehukuru hwedunhu PAD. Zvikasadaro, iyo BGA Mapedhi ichaitwa muhukuru hwakasiyana, izvo zvinogona kukonzera nyaya panguva yewelding process.
zvinoshamisapcb DFM Services Nezve BGA Chip Welding Solution
1. Packaged Pad-in-Pad Hole
amazingpcb DFM Services one-click ongororo inoona kana paine padhi-mu-pedhi gomba mudhizaini faira, uye inosimudzira mugadziri wedhizaini kana padhi-mu-pedhi gomba richida kugadziridzwa. Dhizaini yemapadhi-mu-pad maburi anowanzo kudziviswa nekuda kwemutengo wepamusoro wekugadzira. Kana iyo pad-in-pad gomba inogona kuchinjirwa kune yakajairika gomba, mutengo wechigadzirwa unogona kuderedzwa. Pamusoro pezvo, sisitimu inozivisa fekitori yekugadzira bhodhi kuti padhi-mu-pad gomba dhizaini inoda kuzadzwa neresin, uye kuti padhi-mu-pad-gomba maitiro ekugadzira inofanira kushandiswa.
2. Pad-to-pini ratio
wonderfulpcb DFM Services musangano wongororo inoona saizi reshiyo yeBGA padhi mudhizaini faira inoenderana nepini chaiyo yekushandisa. Kana Pedhi dhayamita iri isingasviki 20% pamusoro BGA pini, zvinogona kutungamirira murombo welding. Sezvineiwo, kana yakakura kupfuura 25%, iyo wiring nzvimbo inova diki. Mumamiriro ezvinhu akadaro, injinjini yekugadzira inoda kugadzirisa chiyero chepadhi kune BGA pini dhayamita.
amazingpcb DFM Services inopa BGA pad solderability mhinduro, kubatsira vashandisi kuongorora solderability yeBGA dhizaini mafaera isati yagadzirwa. Izvi zvinobatsira kudzivirira solderability matambudziko panguva gungano, uye nechokwadi BGA machipisi kusangana solderability kunaka goho zviyero.
BGA Welding Process Hunhu
1. Kudhinda solder paste
Chinangwa chekudhinda paste paste ndechekuisa zvakaenzana huwandu hwakakodzera hwesolder paste kumapadhi ePCB kuve nechokwadi chekuti zvigamba zvepatch uye mapadhi anowirirana ePCB anotengeswa zvakare kuti awane kubatanidza kwakanaka kwemagetsi uye simba rakakwana remagetsi. Kudhinda solder paste, mesh yesimbi inoshandiswa. Iyo solder paste inopfuura nepamazaru anoenzanirana epadhi yega yega pane mesh yesimbi, uye tini yakavharwa zvakaenzana padhi yega yega pasi pechiito cheiyo scraper kuti iwane yakanaka welding.
2. Kuiswa kwechigadzirwa
Kuiswa kwemudziyo kupeta, kunosanganisira kushandisa muchina wekuisa kuti unyatsoisa chip zvikamu panzvimbo inowirirana yePCB pamusoro, iyo inodhindwa nesolder paste kana chigamba glue. Michina yekumhanyisa-yepamusoro yekuisa yakakodzera kukwirisa zvidiki uye zvihombe zvikamu, senge capacitor, resistors, uye zvimwe zvikamu zveIC. General-chinangwa chekuisa michina yakakodzera kukwirisa heterogeneous kana yakakwirira-chaiyo zvikamu, seQFP, BGA, SOT, SOP, PLCC, nezvimwewo.
