High Tg PCB
Mabhodhi edunhu anofanirwa kunge asingachinji murazvo uye haakwanise kupisa pane imwe tembiricha, asi anogona kungopfava. Iyo tembiricha yenzvimbo panguva ino inonzi tembiricha yegirazi (Tg point), uye kukosha uku kune hukama nekudzikama kweiyo PCB board. Iyo yakakwirira iyo TG kukosha, zviri nani kupikisa tembiricha yePCB
Kana tembiricha ichikwira kune imwe nzvimbo, iyo substrate inoshanduka kubva ku "girazi mamiriro" kuenda ku "rubber state", uye tembiricha iyi inonzi tembiricha yekuchinja kwegirazi yepepa (Tg). Mune mamwe mazwi, Tg ndiyo yakanyanya tembiricha (℃) iyo tembiricha ye substrate inochengetwa. Kureva kuti, zvakajairwa PCB substrate zvinhu hazvingoburitse deformation, kunyunguduka uye zvimwe zviitiko pakupisa kwakanyanya, asiwo kuderera kwakanyanya kwemakina uye magetsi zvivakwa.
Kuwedzera kweTg ye substrate kuchasimbisa nekuvandudza hunhu hweiyo yakadhindwa yedunhu bhodhi yekupisa kupisa, kunyorova kwehunyoro, kupikisa kwemakemikari, uye kugadzikana kwekudzivirira. Iyo yakakwirira iyo TG kukosha, zviri nani tembiricha uye zvimwe zvivakwa zvebhodhi, kunyanya mune inotungamira-isina kugadzira maitiro, yakakwira Tg inonyanya kushandiswa.
High Tg inoreva kupisa kwakanyanya. Nekukurumidza kusimukira kweindasitiri yemagetsi, kunyanya zvigadzirwa zvemagetsi zvinomiririrwa nemakomputa, budiriro yakanangana nekushanda kwepamusoro uye yakakwirira-yakawanda-yakawanda inoda yakakwira kupisa kwePCB substrate zvinhu sevimbiso yakakosha. Kubuda nekusimudzirwa kwepamusoro-density mounting technologies inomiririrwa neSMT neCMT yakaita kuti maPCB awedzere kutsamira parutsigiro rwekupisa kwekupisa kwema substrates maererano nemaburi madiki, matunhu akanaka, uye kuonda.
Naizvozvo, musiyano uripo pakati peyakajairwa FR-4 uye yakakwirira-Tg FR-4 ndeyokuti munzvimbo inopisa, kunyanya kana inopisa mushure mekunyorova kwemvura, iyo mechanical simba, dimensional kugadzikana, kunamatira, kunyura kwemvura, kuora kwekushisa, kuwedzera kwekushisa uye mamwe mamiriro ezvinhu akasiyana. High-Tg zvigadzirwa zviri pachena zviri nani pane zvakajairwa PCB substrate zvinhu.
Sei High-Tg PCB?
High Tg PCB, ndiko kuti, kana tembiricha ichikwira kune imwe nhanho, iyo substrate inoshanduka kubva ku "yakasimba" kuenda ku "rubber state", uye iyi tembiricha nzvimbo inonzi tembiricha yegirazi yekuchinja (Tg) yebhodhi redunhu.
Tg inomiririra tembiricha inodiwa kuti zvinhu zvichinje kubva pa “solid” kuenda pa “rubber state”, inoyerwa nemadhigirii celsius. Kazhinji, iyo Tg yezvinhu iri pamusoro pe130 ° C, nepo Tg yakakwirira kazhinji iri pamusoro pe170 ° C, uye yepakati Tg inenge 150 ° C. MaPCB ane Tg ye170°C kana kupfuura anowanzo kunzi high Tg PCBs.
Yakakwira yekupisa conductivity
Yakakwira Tg zvinhu zvine yakakwira thermal conductivity uye inogona kubvisa kupisa zvakanyanya. Ichi chivakwa chinobatsira kuvandudza kugadzikana uye kuvimbika kwemidziyo yemagetsi, kunyanya munzvimbo dzinopisa dzekushanda.
Kupisa kwakanyanya kupisa
Iyo yakakwirira iyo Tg kukosha, zviri nani kupikisa kupisa kwezvinhu. Yakakwirira Tg zvinhu zvinogona kuchengetedza kuita kwakanaka uye kugadzikana munzvimbo dzepamusoro-tembiricha uye dzakakodzera kune yakakwirira-tembiricha yekushanda nharaunda.
Yakanaka michina zvivakwa
High Tg zvinhu zvine simba rakawanda uye kuomarara uye zvinogona kumira zvakanyanya kushushikana kwemagetsi. Ichi chivakwa chinobvumira yakakwira Tg zvinhu kuchengetedza yakagadzikana kuita kunyangwe mumamiriro ezvinhu akaomarara.
Zvinhu zvakanaka zvemagetsi:
Yakakwira Tg zvinhu zvine yakaderera dielectric constants uye kurasikirwa tangents, iyo inobatsira kuvandudza chiratidzo chekufambisa kwemhando uye kuenderana kwemagetsi. Izvi zvinonyanya kukosha mu-high-frequency uye high-speed signal transmission applications.
Common High-Tg PCB Material
Items | nzira | IT-180ATC |
Tg (℃) | DSC | 175 |
T-288 (w/ 1oz Cu, min) | TMA | 20 |
Td-5%(℃) | TGA 5% kurasikirwa | 345 |
CTE (ppm/℃) | a1/a2 | 45/210 |
CTE (%), 50-260 ℃ | TMA | 2.7 |
Dk @ 1 GHz (RC 50%) | IPC TM-650 2.5.5.13 | 4.1 |
Df @ 1 GHz (RC 50%) | IPC TM-650 2.5.5.13 | 0.017 |
CTI (Volts) | IEC 60112 / UL 746 | CTI 3 (175-249) |
| Items | nzira | Condition | chikwata | Kukosha kwechimiro | |
|---|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.24.4 | DMA | ℃ | 200 | |
| Tg | TMA | ℃ | 170 | ||
| Td | IPC-TM-650 2.4.24.6 | 5% wt. kurasikirwa | ℃ | 350 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Pamberi peTg | ppm/℃ | 45 | |
| Mushure meTg | ppm/℃ | 210 | |||
| 50-260 ° C | % | 2.3 | |||
| T260 | IPC-TM-650 2.4.24.1 | TMA | ini | > 60 | |
| T288 | IPC-TM-650 2.4.24.1 | TMA | ini | 45 | |
| Kushushikana Kwemhepo | IPC-TM-650 2.4.13.1 | 288 ℃, solder dip | s | > 100 | |
| Kusagadzikana kweVolume | IPC-TM-650 2.5.17.1 | Mushure mekudzivirira hunyoro | MΩ.cm | 2.5E + 08 | |
| E-24/125 | MΩ.cm | 1.9E + 06 | |||
| Kumusoro Kugadziriswa | IPC-TM-650 2.5.17.1 | Mushure mekudzivirira hunyoro | MΩ | 3.3E + 07 | |
| E-24/125 | MΩ | 2.4E + 06 | |||
| Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 146 | |
| Dielectric Kuparara | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | > 45 | |
| Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1GHz | - | 4.6 | |
| IPC-TM-650 2.5.5.9 | 1MHz | - | 4.8 | ||
| Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1GHz | - | 0.015 | |
| IPC-TM-650 2.5.5.9 | 1MHz | - | 0.009 | ||
| Simba rePeel (1oz HTE foil yemhangura) | IPC-TM-650 2.4.8 | A | N / mm | - | |
| Mushure mekupisa Kushushikana 288 ℃,10s | N/mm[lb/in] | 1.25 [7.14] | |||
| 125 ° C | N / mm | - | |||
| Flexural Simba | LW | IPC-TM-650 2.4.4 | A | MPa | 530 |
| CW | IPC-TM-650 2.4.4 | A | MPa | 410 | |
| Kubvisa Mvura | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.07 | |
| CTI | IEC60112 | A | Rating | PLC 3 | |
| Kupisa | UL94 | C-48/23/50 | Rating | V-0 | |
| E-24/125 | Rating | V-0 | |||
Mashoko:
1. Pepa rezvinyorwa: IPC-4101/126, ndeyekutarisa kwako chete.
2. Yese yakajairika kukosha kunobva pane 1.6mm(16*2116) muenzaniso.
| Items | nzira | Condition | chikwata | Kukosha kwechimiro | |
|---|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 180 | |
| IPC-TM-650 2.4.24.4 | DMA | ℃ | 185 | ||
| Td | IPC-TM-650 2.4.24.6 | 5% wt. kurasikirwa | ℃ | 345 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Pamberi peTg | ppm/℃ | 45 | |
| Mushure meTg | ppm/℃ | 220 | |||
| 50-260 ° C | % | 2.8 | |||
| T260 | IPC-TM-650 2.4.24.1 | TMA | ini | 60 | |
| T288 | IPC-TM-650 2.4.24.1 | TMA | ini | 20 | |
| T300 | IPC-TM-650 2.4.24.1 | TMA | ini | 5 | |
| Kushushikana Kwemhepo | IPC-TM-650 2.4.13.1 | 288 ℃, solder dip | - | 100S Hapana Delamination | |
| Kusagadzikana kweVolume | IPC-TM-650 2.5.17.1 | Mushure mekudzivirira hunyoro | MΩ.cm | 2.2 X 108 | |
| E-24/125 | MΩ.cm | 4.5 X 106 | |||
| Kumusoro Kugadziriswa | IPC-TM-650 2.5.17.1 | Mushure mekudzivirira hunyoro | MΩ | 7.9 X 107 | |
| E-24/125 | MΩ | 1.7 X 106 | |||
| Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 100 | |
| Dielectric Kuparara | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | 63 | |
| Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1MHz | - | 4.8 | |
| IEC 61189-2-721 | 10GHz | - | - | ||
| Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1MHz | - | 0.013 | |
| IEC 61189-2-721 | 10GHz | - | - | ||
| Simba rePeel (1Oz HTE foil yemhangura) | IPC-TM-650 2.4.8 | A | N / mm | - | |
| Mushure mekupisa Kushushikana 288 ℃,10s | N / mm | 1.38 | |||
| 125 ° C | N / mm | 1.07 | |||
| Flexural Simba | LW | IPC-TM-650 2.4.4 | A | MPa | 562 |
| CW | IPC-TM-650 2.4.4 | A | MPa | 518 | |
| Kubvisa Mvura | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.10 | |
| CTI | IEC60112 | A | Rating | PLC 3 | |
| Kupisa | UL94 | C-48/23/50 | Rating | V-0 | |
| E-24/125 | Rating | V-0 | |||
Mashoko:
- Pepa rakatsanangurwa: IPC-4101/126, nderereferensi yako chete.
- Yese yakajairika kukosha yakavakirwa pamuenzaniso we1.6mm, nepo Tg iri yemuenzaniso≥0.50mm.
Tsanangudzo: C=Humidity conditioning, D=Immersion conditioning mumvura ine distilled, E=Temperature conditioning
Dijiti rekutanga rinotevera tsamba rinotaridza nguva yepreconditioning mumaawa, yechipiri digit tembiricha yepreconditioning mu ℃ uye digit yechitatu hunyoro hunoenderana.
| Items | nzira | Condition | chikwata | Kukosha kwechimiro | |
|---|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 180 | |
| IPC-TM-650 2.4.24.4 | DMA | ℃ | 185 | ||
| Td | IPC-TM-650 2.4.24.6 | 5% wt. kurasikirwa | ℃ | 355 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Pamberi peTg | ppm/℃ | 41 | |
| Mushure meTg | ppm/℃ | 208 | |||
| 50-260 ° C | % | 2.4 | |||
| T260 | IPC-TM-650 2.4.24.1 | TMA | ini | > 60 | |
| T288 | IPC-TM-650 2.4.24.1 | TMA | ini | 30 | |
| T300 | IPC-TM-650 2.4.24.1 | TMA | ini | 15 | |
| Kushushikana Kwemhepo | IPC-TM-650 2.4.13.1 | 288 ℃, solder dip | s | > 100 | |
| Kusagadzikana kweVolume | IPC-TM-650 2.5.17.1 | Mushure mekudzivirira hunyoro | MΩ.cm | 8.7 E+08 | |
| E-24/125 | MΩ.cm | 7.2 E+06 | |||
| Kumusoro Kugadziriswa | IPC-TM-650 2.5.17.1 | Mushure mekudzivirira hunyoro | MΩ | 2.2 E+07 | |
| E-24/125 | MΩ | 8.6 E+06 | |||
| Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 133 | |
| Dielectric Kuparara | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | > 45 | |
| Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1GHz | - | 4.6 | |
| IPC-TM-650 2.5.5.9 | 1MHz | - | 4.9 | ||
| Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1GHz | - | 0.018 | |
| IPC-TM-650 2.5.5.9 | 1MHz | - | 0.015 | ||
| Simba rePeel (1oz HTE foil yemhangura) | IPC-TM-650 2.4.8 | A | N / mm | - | |
| Mushure mekupisa Kushushikana 288 ℃,10s | N/mm[lb/in] | 1.3 [7.43] | |||
| 125 ° C | N / mm | ||||
| Flexural Simba | LW | IPC-TM-650 2.4.4 | A | MPa | 567 |
| CW | IPC-TM-650 2.4.4 | A | MPa | 442 | |
| Kubvisa Mvura | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.08 | |
| CTI | IEC60112 | A | Rating | PLC 3 | |
| Kupisa | UL94 | C-48/23/50 | Rating | V-0 | |
| E-24/125 | Rating | V-0 | |||
Mashoko:
1. Pepa rezvinyorwa: IPC-4101/126, ndeyekutarisa kwako chete.
2. Yese yakajairika kukosha kunobva pane 1.6mm(8*7628) muenzaniso.
| pfuma | Tsika Dzakanaka |
|---|---|
| Tg (DMA) | 190 ° C |
| Tg (DSC) | 180 ° C |
| Tg (TMA) | 170 ° C |
| Td (TGA) | 340 ° C |
| CTE z-axis (50 kusvika 260 °C) | 2.7% |
| T-260/ T288 | >60 min/ >15 min |
| Mvumo @1GHz(RC 50%) | 4.3 |
| Kurasika Tangent @1GHz(RC 50%) | 0.018 |
- Zvibvumirano zveIndasitiri
- IPC-4101E Rudzi rwezita : /98, /99, /101, /126
- IPC-4101E/126 Validation Services QPL Certified
- UL Dhizaini - ANSI Giredhi: FR-4.0
- UL Faira Nhamba: E189572
- Kupisa Chiyero: 94V-0
- Yakanyanya Kushanda Tembiricha: 130°C
- Kuwanika kwakajairika
- Ukobvu: 0.002"[0.05mm] kusvika 0.062"[1.58mm], inowanikwa mushizha kana papepa fomu
- Copper Foil Cladding: 1/8 kusvika 12oz (HTE) yekuvaka-up; 1/8 kusvika 3oz (HTE) yemativi maviri uye H kusvika 2oz (MLS)
- Prepregs: Inowanikwa mupumburu kana panhizha fomu
- Girazi Zvitaera: 106, 1080, 2113, 2116, 1506 uye 7628 nezvimwe.