Vagadziri vePCB vekunze kwenyika vane layer 8 vakavandudza chitarisiko chemhando yepamusoro. Zvitupa zveIPC, maISO plaques, mapolished capacity decks — zviratidzo izvi zvinoita sezvine tariro uye zvinogara zvichivanza zvinoitika muchitoro. Gwaro iri rinokupa hurongwa hwekutenga kuti uongorore zvinhu zvekunze kwenyika zvichibva pauchapupu hwemaitiro, kwete zvinhu zvekutengesa.

Chii chinonzi PCB ine zvidimbu zvisere?

PCB ine mativi masere ibhodhi redunhu rakadhindwa rine mativi akawanda rine mativi masere emhangura anobatsira akaparadzaniswa nezvinhu zve dielectric — alternating prepreg ne core laminates — akaradzikwa pasi pekupisa nekumanikidzwa kuita chimiro chimwe chete chakasimba.

Kurongeka kwechikamu chechikamu chega chega kunoita kuti chikamu chega chega chishande:

•  L1 neL8 zviratidzo zvekunze zvinoratidzwa se microstrip traces
•  L2 neL7 ndege dzepasi
•  L3 neL6 zvinotakura zviratidzo zvinomhanya zvakanyanya semitsetse, zvakavharwa zvizere pakati pendege dzekutarisa kuti dzidzorwe
• L4 neL5 ingoro dzemagetsi dzakagadzirirwa, dzakabatana zvakasimba kuderedza ruzha rwechitima chemagetsi uye kutsigira kufambiswa kwemagetsi kwakasimba mukati mebhodhi.

MaPCB ane 8-Layer vs. 4-Layer uye 6-Layer

Kusvetuka kubva pamatanho matanhatu kuenda pamatanho masere kwakagadzirwa, kwete kuwedzera. Bhodhi rine matanho matanhatu rinokupa purani imwe yepasi uye purani imwe yesimba - yakakwana kumagadzirirwo ane kumhanya kuri pakati nepakati.

 Kuunganidzwa kwezvikamu zvisere kunowedzera imwe purani yepasi yakatsaurirwa uye imwe purani yemukati yechiratidzo. Iyo purani yepasi yakawedzerwa ndiyo inogonesa kudzvinyirirwa kweEMI kwakasimba, kuderedzwa kwemwaranzi yemagetsi ye15-20dB, uye kurongeka kwekudzora impedance mukati me5% kana kuti 8% kupfuura masisitimu edhijitari anomhanya zvakanyanya:

1. DDR4/5
2. PCIe Gen 3+
3. GigE
4. 28Gbps+ zviratidzo 

Izvi zvinodiwa kuti munhu akwanise kupasa EMC Certification.

Chiyero chinoshanda: kana dhizaini yako ichishandisa macircuit ane mafrequency akakwira kupfuura 1GHz, iine ma differential pairs ane kumhanya kwakanyanya seUSB, HDMI, kana PCIe, kana ichishanda munzvimbo ine EMI yakakwira, unoda ma layers masere. Pasi paizvozvo, ma layers matanhatu angangokwana uye anodhura zvishoma.

Dhizaini yePCB ine zvidimbu zvisere

Kugadziriswa kweStackup yeMatanho masere

Muchina wekugadzira wezvikamu zvisere unoshandisa mhangura ye1 oz pachikamu chimwe nechimwe pazvikamu zvisere zvese — chimiro che1/1/1/1/1/1/1 oz. Zvikamu zvekunze zvinomhanya paukobvu hwemhangura hwepasi pamwe nemhangura yekuputira. Zvikamu zvemukati zvinowanzo tanga pa0.5 oz zvisati zvaputirwa. Izvi zvinokosha nekuti kugoverwa kwemhangura isina kufanana pazvikamu zvinokonzera kupwanyika panguva yekuputira. 

Zvinhu zvakanaka zvinoenzanisa kuzara kwemhangura muzvikamu zvese, dzimwe nguva zvichiwedzera kudira kwemhangura kusingashande munzvimbo dzisina kusimba. Bvunza zvakananga kuti zvinhu izvi zvinogadzirisa sei kuenzana kwemhangura pamagadzirirwo asina kuenzana - mhinduro chaiyo igirini; kusajeka hakusi.

Ukobvu hwebhodhi hwakajairwa hwekuvaka zvinhu zvine mativi masere hunosvika 1.6mm yemagetsi akajairika, 2.0mm yekushandiswa mumaindasitiri, uye 2.4mm yekugadzirwa kwakasimba. Simbisa ukobvu nejira rako usati wapedzisa kugadzira maGerber.

Kusarudza Zvinhu Zvinodiwa Pakugadzirira uye Zvinhu Zvinokosha

1. Nei High-Tg FR-4 iriyo Baseline

Standard FR-4 inonyorova panguva yekuyerera kwemvura isina lead. Kutsanangura Tg170 kunodzivirira kutsemuka kwebhareri uye maburi akavanzika anoburitsa kuneta kwebhodhi rema layer masere.

2. Dielectrics Inowanzo shandiswa Kakawanda

Pamagadzirirwo anodarika 1GHz, ma laminates akajairika anokundikana. Mashandisirwo anoda ma constants e dielectric akagadzikana uye ma tangents asina kurasikirwa zvakanyanya anofanira kushandisa zvinhu zvakakosha zvakaita seRogers 4350B , Arlon , kana Taconic kuti ave nechokwadi chekuti masaini akasimba panguva yekuchinja-chinja kwekushisa.

3. Kutsiva Prepreg 

MaFabs anogona kuchinjana chinyararire magiredhi eprepreg akatarwa kuti aderedze mitengo. Kuchinja kwema micron 15–30 muhurefu hwe dielectric kunogona kushandura impedance inodzorwa kusvika ku15%, zvichikonzera kutadza kushanda zvakanaka kwesystem kunyangwe vakapasa bvunzo dze flying probe.

4. Kusimbiswa kweStackup yeChigadzirwa Chakanangana Nechigadzirwa

Usapfuure pane zvinodiwa nehukobvu hwechinyakare. Ongororo yako yekutenga inofanira kunge iine makodhi ezvigadzirwa ane mazita ari pamufananidzo we stackup.

5. Kusimbisa Kutevedzera Zvinhu Zvine Chekuita Nechitupa

Rayira kuti chero chinhu chinotsiviwa chinoda mvumo yakanyorwa usati waisa lamination. Kusimbisa chivakwa kunoda kufananidza Material Discovery Certificates chaiyo nefaira reinjiniya rakatenderwa kudzivirira "kunyarara" kwekugadzirisa zvinhu muchitoro.

Kudzora Kusagadzikana muStackup

Impedance inodzorwa inosiyanisa bhodhi rinoshanda rine mativi masere nebhodhi rakakundikana. Semuenzaniso, rekutanga rinopfuura nekutarisa, nepo rechipiri richikundikana mumunda. Kune magadzirirwo anomhanya zvakanyanya, zviri nani kunanga 50 ohms yezviratidzo zvine magumo rimwe chete, 90 ohms ye USB differential pairs, 100 ohms yePCIe, Ethernet, uye HDMI. 

Kushivirira uku kwekugadzira kunowanzova plus kana minus 10 muzana; mambure akakosha anowanzova plus kana minus 5 muzana, uye mambure aya anoda imwe nzira yekushanda kubva kunyanzvi.

Maitiro Ekugadzira PCB Ane Zvikamu Zvisere, Danho Nedanho

Kunzwisisa nhanho imwe neimwe kunokubatsira kubvunza mibvunzo iri nani panguva yekuongorora, kubata matambudziko pakutanga kwekuongorora nyaya, uye kunyora maodha ekutenga anovhara mipata inoshandiswa nehunyanzvi.

Danho 1: Kugadzirira Mafaira Ekugadzira uye Kuongorora DFM

Kugadzira kunotanga nemafaira ako eGerber: zvidimbu zvemhangura, data rekuboorera, mask yekusolder, silkscreen, uye bhodhi. Chinhu chakanaka kwazvo chinoita ongororo yeDesign for Manufacturability isati yaburitswa mukugadzirwa:

1. Kutarisa mitemo yekutevera zvishoma uye nzvimbo
2. Zviyero zvemhete ye annular
3. Nzvimbo dzakavhurika kubva paburi kuenda kumhangura
4. Uye chiyero chechinhu chinopesana nekugona kwavo chaiko kwekuita. 

Chinhu chinoshamisa chisina kumbobvira chaderedza dhizaini ine mhinduro yeDFM chinogadzirisa kumhanya kwechinhu ichi nemari yako.

Danho rechipiri: Kugadzirira Zvinhu uye Kufungidzira Rutivi Rwemukati

Iyo yakagadzirwa zvakanaka inocheka laminate yakaputirwa nemhangura kuita saizi yemapaneru, inoisa photoresist, inoiburitsa kuburikidza ne photomask pasi pechiedza cheUV, yobva yabvisa mhangura isingadiwe kuti igadzire mapatani edunhu remukati. Kunyatsojeka padanho iri kunosarudza kunaka kwekunyoresa muchikamu chose. Kusarongeka pano kunobatanidzwa kuburikidza nechikamu chimwe nechimwe chinotevera - hachizvigadzirise chega.

Danho rechitatu: Ongororo yeOtomatiki yeInner Layers

AOI inoenzanisa jira rega rega remukati rakachekwa nedata rako reGerber uye inoratidza mapfupi, maburi, uye kusagadzikana kwemhangura. Danho iri rinomhanya risati raiswa lamination nekuda kwechimwe chikonzero: kana wangoisa lamination mujira, zvikanganiso zvemukati zvinova zvechigarire uye zvisingaonekwe. Zvinhu zvinodarika kana kuenzanisa AOI yemukati zvinotamba negoho rako. Bvunza zvakananga kana AOI ichibata 100% yekuvhara jira remukati rerudzi rwako rwe stackup.

Danho rechina: Kuisa Layer Stackup uye Lamination

Lamination ndiyo nzvimbo iyo kugadzirwa kwezvikamu zvisere kunowana hunyanzvi hwayo hwakakosha. Zvikamu zvemukati zvinorapwa ne oxide kana imwe nzira ye oxide kuti zvinatsiridzwe kunamira kune prepreg. Zvadaro stackup yakazara inounganidzwa: 

• foil yemhangura, gadzirira
•  musimboti, gadzirira
• moyo 

Rutivi rumwe nerumwe rwakanyoreswa nemazvo uchishandisa optical punch alignment kana X-ray targets — rwobva rwadzvanywa ne hydraulic lamination press pasi pekupisa kwakadzora uye ma pressure profiles.

Danho rechishanu: Kuboora — Michina neLaser

Mushure mekuiswa kwelamination, chinhu chinogadzirwa chinoona nzvimbo dzekunyoresa X-ray uye chinotanga kuboora. Maburi anoburitswa nepakati anopinda muzvikamu zvese zvisere. Maburi anoburitswa nemaziso anobatanidza chikamu chekunze kune zvikamu zvemukati zvakananga. Maburi anovigwa anobatanidza zvikamu zvemukati chete uye haaonekwe kubva kumativi ese ari maviri. Kuboora neLaser kunogadzira ma microvia eHDI dhizaini ine BGA routing yakawanda.

Kuburikidza neaspect ratio — ukobvu hwebhodhi hwakakamurwa nedhayamita remaburi — zvinofanotaura zvakananga kuoma kweplating. Kupfuura 10:1, copper plating mubarrel inova isingavimbike uye njodzi yekushaya chinhu inokwira zvakanyanya. Advanced fabs inoshambadza kusvika ku16:1 aspect ratio kugona, asi zvirevo zvekugona zvinoda data rema coupon kuti zviongororwe. High-aspect-ratio vias dzakavigwa uye dzakapofumara pamabasa ekukurumidzira ndipo panokundikana marginal fabs nguva dzose.

Danho rechitanhatu: Kuputirwa kweMaburi neCopper Plating

Kuisa mhangura mumakemikari kunoisa mhangura mumadziro emaburi, zvichiteverwa ne electroplating kuti mhangura isvike pakukora kwayo. IPC shoma yemhangura inoputirwa nepakati i25 microns, 20 microns shoma. 

Kugadzira madziro ebhari pasi pemaplate kuti kukurumidze kutenderera kwebhavhu rekugezera — mapuranga anopasa bvunzo dzekutanga dzemagetsi uye anokundikana pasi pekupisa kwemhepo mumunda. Bvisa chikamu chekutanga chechinyorwa chako kuti uone ukobvu hweplati zvakananga. Danho rimwe chete iroro rinobata zvikanganiso zvakajairika mukugadzirwa kwekunze kwenzvimbo 8-layer.

Nhanho yechisere: Outer Layer Imaging uye Etching

Kufungidzira pamusoro pechinhu chekunze kunoratidza maitiro echikamu chemukati chebhodhi rakanyatsoiswa laminated: kushandiswa kwesimba rekudzivirira firimu rakaoma, kuratidzwa kweUV, kugadzirwa, kuchekwa kwekusarudza. Zvinobuda pamutsetse wekucheka zvinosarudza maitiro ako ekutevera uye, zvakare, kukosha kwako kwekupedzisira kweimpedance.

 Kugadzirisa mavanga — kuwedzera mavanga eganda zvishoma kuti zvionekwe semavanga eganda panguva yekucheka — inzira yakajairika kune nyanzvi dzekugadzira mavanga. Kana nyanzvi yekugadzira mavanga isingakwanise kutsanangura kuti inoshandisa sei kupatsanura mavanga eganda pahupamhi hwemavanga ako, mhedzisiro yako yekudzora impedance ichadonha.

Nhanho 8: Solder Mask Application

Chipfeko ichi chinoisa chifukidzo cheLPI solder, chinochiisa pachena uye chinochigadzira kuti chivhurwe mapedhi nemavias, ipapo UV inorapa chifukidzo chacho. Kutevedzera IPC-SM-840 kunodzora mashandiro echifukidzo chesolder. Sarudzo dzemavara — girini, dema, bhuruu, tsvuku — hadzikanganisi mashandiro emagetsi, asi chifukidzo chesolder nhema chinoita kuti kuongorora kwemaziso kuve kwakaoma panguva yekuunganidza. Taura zvichienderana nezvinodiwa nekuunganidza kwako.

Nhanho 9: Surface Pedzisa

ENIG ndiyo purani yepamusoro inoshandiswa muzvikamu zvisere. Inopa mapedhi akati sandara, anogona kusundwa, anodzivirira oxidation akakodzera maBGA anotsvedzerera uye akabatanidzwa akavimbika. HASL inoshanda kumagadzirirwo anodhura zvishoma asina zvikamu zvinotsvedzerera. Kunyudza Sirivha, Kunyudza Tin, uye OSP zvinoenderana nemashandisirwo chaiwo. ENEPIG inowedzera palladium layer pakati penickel negoridhe kune mashandisirwo anoda tambo pamwe chete nekunyudza.

Matanho 10 ne11: Kugadzira Silkscreen neBhodhi

Kudhinda silkscreen kunowedzera zviratidzo zvezvikamu uye zviratidzo zvemabhodhi kuburikidza ne inkjet kana screen printing. Kuronga kweCNC kana V-scoring kunobatanidza mabhodhi ega ega kubva pane panel. Kudhinda V-scoring pamabhodhi e8-layer multilayer kunounza kushushikana pamutsetse wekucheka. 

Munzvimbo dzinotenderera kana kuti dzinodedera, kushushikana ikoko kunogadzira zvidimbu zvidiki - nzira dzinopinda hunyoro dzinoita kuti filament ikure pakati pezvikamu. Bvunza nyanzvi yako zvakajeka kuti ndeipi nzira yekubvisa mapaneti yavanoshandisa pahukuru hwebhodhi rako uye kuti maitiro avo ekurwisa CAF anosanganisira chii.

Rondedzero dzeKutsvaga Zvinhu Dzinokundikana Mumunda Hadzina Kuwanikwa Zvakakwana

Heino kukundikana kwakachinja maitiro emunyori uyu ekuongorora mapurogiramu ane layer 8.

1. Nei IPC Kirasi 3 Isiri Guarantee Yemunda

Magadzirirwo ekutarisa akajairika anovimba nezvitupa zvakaita seIPC Class 3 kana ISO 9001. Zvisinei, sezvinoratidzwa nenyaya yako, bhodhi rinogona kusangana nezvinodiwa zvese zvakagadziriswa asi richichengetedza zvikanganiso zvakavanzika. Kutenga kunowanzo kukanganisa kuzvizivisa kwemhando yechinhu kana paine kusimbiswa kwemamiriro ezvinhu ane kushushikana kwakanyanya.

2. Njodzi dzeKubvisa maPaneti

Rondedzero dzinoongorora laminate isingapindi CAF asi dzinofuratira nzira yekuparadzanisa michina. Kunyange zvazvo V-scoring ichidhura zvishoma, zvinokwidza stress zvinounza zvinogona kubvisa hunhu hwezvinhu zvepamusoro. Ongororo dzinofanira kuchinja kubva kuZvinhu zvakashandiswa? kuenda kuKugadzirwa kwakapedzwa kwakaitwa sei?

3. Kuedza Kupisa Kwemhepo vs. Kuedza Kusingachinji

Flying probe neAOI zvinongobata zvikanganiso zve "kufa kwevacheche". Havakwanise kufanotaura kuti kuputika kudiki kunobva mukubvisa mapaneti kuchapararira sei pasi pe60°C tembiricha. Ongororo yekutenga isingatariswe nedata reEnvironmental Stress Screening inonyanya kushamisika nezvehupenyu hwemunda.

4. Kubviswa kweTier 2

Kukundikana kwacho kwakakonzerwa nekushandisa zviratidzo zvekutenga zvemazuva ese pakushandisa marobhoti akavimbika zvikuru. Musoro uyu unotarisa kudiwa kwekuongorora marobhoti zvakanangana nekushandisa—apo runyorwa rwekutarisa ruchichinja zvichienderana nemafambiro ekudengenyeka uye hunyoro hwenzvimbo yekushandisa.

5. Mari Yakavanzika yeMutengo weYuniti

Nyaya yako inoratidza kuti kurasikirwa katatu pakugadzirisa garandi kunopfuura chero mari yekutanga inochengetwa kubva pakugadzira zvinhu zvakachipa kana kuti kugadzirisa zvinhu zviri nyore. Misoro pano inofanira kutarisa pamuenzaniso weTotal Cost of Ownership, kushandura kutenga kubva pa "mutengo pabhodhi" kuenda ku "mutengo pagore rakashandiswa."

Kuburikidza nemhando mukugadzira PCB ine 8-Layer

Kuburikidza neHole Vias

Maburi anopinza maburi anopinda muzvikamu zvese zvisere uye anobatanidza chero chikamu kune chimwe. Anoda kuboorwa kamwe chete uye plating imwe chete, zvichiita kuti ave ekubatanidza anodhura zvakanyanya. Shandisa iwo senzira yako yekutanga kunze kwekunge huwandu hwema routing huchimanikidza zvimwe.

Mapofu uye Akavigwa Vias

Ma "blind vias" anobatanidza chikamu chekunze kune chimwe kana kupfuura chikamu chemukati chisina kupinda zvizere. Ma "vias" akavigwa anobatanidza chikamu chemukati chete uye haaonekwe kubva kumativi ese ari maviri. Mhando dzese dziri mbiri dzinoda mamwe maitiro e "lamination", izvo zvinowedzera kuomarara kwemaitiro uye mutengo.

Zvakanyanya kukosha: mainjiniya mazhinji ekune dzimwe nyika anoti haana ruzivo rwakakwana uye akavigwa kuburikidza nehunyanzvi anoendesa maodha aya kumitsara ine huwandu hwakaderera pasina maitiro akafanana neaya anodzora mitsetse yavo yakajairwa ine zvidimbu zvakawanda. Kudonha kwemhedzisiro pakugadzira kwakaomarara kusina ruzivo pamidziyo yepakati petier - bvunza data remhedzisiro pane yako chaiyo via configuration usati waisa vhoriyamu.

Microvias uye Via-in-Pad

Ma microvia — maburi akaboorwa nelaser pasi pema microns 150 — anogonesa magadzirirwo eHDI uye nzira yeBGA inorongedzwa zvakanaka. Via-in-pad inoisa via zvakananga pasi pe component pad kuchengetedza nzvimbo yerongedzo, asi inoda kuzadza nekuvhara via kudzivirira solder wicking panguva yekuunganidza. 

Bvunza kuti ndeipi michina inoshandiswa nelaser drill uye kuti microvia registration yavo inosiyana sei. Izvi zvinoparadzanisa michina yepamusoro kubva kuzvitoro zvevolume nekukurumidza kupfuura chero certification audit. 

Zvinhu Zvinoshandiswa Mukugadzira PCB Yezvikamu Zvisere

Substrate Zvishandiso

High-Tg FR-4 ndiyo nzira yekutanga yemabhodhi ane zvidimbu zvisere anopinda mumusangano usina lead kana munzvimbo dzakaoma. Kune mafrequency ezviratidzo ari pamusoro pe1GHz, tsanangura Rogers 4350B, ARLON 85N, kana TACONIC TLX kuti pave nekurasikirwa kwakaderera kwe dielectric uye stable Dk pakupisa. 

Zvigadziko zvesimbi neceramic zvinobata mashandisirwo emagetsi ekupisa ane simba guru. Chero nguva paunoona chinhu chakanaka chichitaura nezve FR-4 yebhodhi rine zvidimbu zvisere chichipinda mukushandiswa kunoda kupisa kwakanyanya, dzokera shure.

Magiredhi eCopper Foil

Mhangura yemagetsi inofukidza akawanda emagadzirirwo ane mativi masere. Magadzirirwo anomhanya pamusoro pe10GHz anobatsirwa nefoil yakagadziriswa ne reverse kana mhangura isina chimiro chakanyanya, izvo zvinoderedza kuomarara kwepamusoro uye zvinoderedza kurasikirwa kwechiratidzo pahuwandu hwepamusoro. Izvi zvinongonyanya kukosha pahuwandu hwepamusoro - asi kana zvichikosha pakugadzira kwako, simbisa kuti yakagadzirwa zvakanaka, nekuti mazhinji haafambi neRTF nguva dzose.

Sarudzo dzekugadzirira pamuviri

Shengyi S1000HB ndiyo inonyanya kushandiswa muzvigadzirwa zvemhando yepamusoro zveChinese. Isola 370HR ndiyo yakajairika muNorth America neEurope. Prepreg inofanirwa kuenderana nehukuru hwekuwedzera kwekupisa kwechinhu chikuru.

 Kusawirirana kweCTE pakati pe prepreg ne core kunoita kuti pave nenjodzi ye delamination pasi pekumanikidzwa kwekupisa. Ndosaka kugamuchira zvinhu zvakafanana zvisina kuenzana pasina kuongororwa kweinjiniya kusingagamuchirwi pane chero chirongwa che 8-layer.

Mubvunzo Mumwe Chete Usingabvunzwe Nevanotarisira Kutenga Zvinhu

Mushure memakore akawanda ekuona zvikwata zvekutenga zvichiongorora vagadziri vePCB vekune dzimwe nyika, mubvunzo mumwe chete haumbofi wakaonekwa panguva yeRFQ kana odhiti:

"Ungandiratidza here mwedzi mitatu yekupedzisira yeruzivo rwako rwekunyoresa mukati kubva pa optical punch yako kana X-ray, kusanganisira huwandu hwezvakachekwa zvakapatsanurwa zvichienderana nerudzi rwe stackup?"

1. Kudzora Maitiro Ekuverenga Nhamba 

Musoro uyu unotarisa musiyano wepfungwa nekushanda pakati pezvinhu zvitsva. Rondedzero yekutenga inofanira kusiyanisa pakati penzvimbo inoongorora data renguva chaiyo neinoshandisa fungidziro dzemhando yepamusoro. Inosimbisa kukosha kwekukumbira machati eSPC asina kugadzirwa pane mishumo pfupiso yakarongwa.

2. Kushivirira Kunyoresa 

Kushivirira kunonzi 75 mm hakuna zvakunoreva pasina mamiriro ezvinhu. Chikamu chino chinoongorora kuti avhareji yenhamba dzekunyoresa dzinovanza sei zvinhu zvisingakonzeri kupfupika kwemapfupi muzvivakwa zve 8-layer zvine density yakakura. Izvi zvinomanikidza kuongororwa kwehunyanzvi hwekugadzira kwe automated optical alignment ability ye fab .

3. Kuburitsa pachena kwezvibereko

Mishumo yakajairika inowanzo viga huwandu hwezvimedu zvezvimedu zvezvikamu zvisere mukati medata regoho rakajairika. Musoro uyu unoburitsa pachena tsika yekuvanza kutadza muzvikamu zve "kugadzirisazve", izvo zvinovhara kugadzikana kwechokwadi kwemutsetse wekugadzira uye zvinodzivirira kuongororwa kwakarurama kwengozi dzezvikamu zvakaoma.

4. Tier-1 Reality vs. Mid-Tier Marketing

Pane "musiyano wekukura" wakanyorwa pakati pemakambani ekugadzira mota eTier-1 nevatengesi vepakati nepakati. Nekusiyanisa mubereko we90-95% wezvivakwa zvepamusoro uchienzaniswa negoho rechokwadi re75-85% resarudzo dzebhajeti, chikamu chino chinopa hurongwa hwekuongorora mutengo unoshanda weyuniti.

5. Kuyera kweAspect uye Kudzora Impedance

Kuoma kwehunyanzvi kunokwira zvisina kurongeka. Musoro uyu unotarisa kuti zvinodiwa pakugadzira zvinhu zvakasiyana-siyana. Unotsanangura kuti sei runyorwa rwekutenga zvinhu rwakajairwa ruchikundikana kana ruchibata magadzirirwo ese ane mativi masere sezvinhu zvinotengeswa.

Munhu Anonyatso Kudzora Zvinoitika kuOdha Yako

1. Vamiririri veVatengesi vs. Vatungamiriri veMusangano

Hurukuro dzinowanzo pera nevashandi vekutengesa, asi mashandiro ehunyanzvi anoenderana nemaneja wekugadzira. Musoro uyu unoratidza kuti nei hurukuro dzemutengo nenguva yekutungamira zvinhu dzichiparadzaniswa kubva pakukosha kwepasi, kurodha tambo, uye kuyera michina.

2. Ndiani Anosarudza Chinhu Chinonyanya Kukosha Mumutsetse Wako?

Munzvimbo dzine vanhu vakawanda, Mutungamiriri weWorkshop ndiye anosarudza kuti ndeapi maodha anopiwa lamination press uye ndeapi anomirira Muvhuro. Kugadzira link yehunyanzvi pano kunoita kuti mabuild ako ane 8-layer asakanganiswa kana simba rekugadzira rawedzera.

3. Kusangana neMutungamiriri weKugadzira

Ongororo dzakajairwa dzinotarisa paManeja weUnhu, asi timu yekugadzira inodzora zvinhu zvinogadzira hunhu. Chikamu chino chinotsigira kusangana zvakananga nechitoro kuti pave nemusiyano uripo pakati pemaitiro edzidziso ari papepa uye basa remushandi panguva chaiyo.

4. Kuderedza Njodzi Munguva Yechokwadi

Uchishandisa chidzidzo chako cheGuangdong lamination void, musoro uyu unoratidza kuti hukama hwakananga hunodarika sei kunonoka kwemaawa makumi maviri nemana kwekutaurirana kwevatengesi chete. Unoratidza kuti mhinduro dzehunyanzvi dzinokurumidza sei—dzakadai sekugamuchira mifananidzo yezvikanganiso pakati pehusiku—dzinogona kuchengetedza nguva yekupedzisira yekuburitswa kwechigadzirwa.

5. Kutarisirwa Kwemabasa Nedzidziso muzvirongwa zveMatunhu Masere

Izvi zvinogumisa kuti musiyano wezvinobuda wakajeka: mutsetse wakananga kumunhu ari kutonga pepanhau unoshandura kugadzirisa zvinhu usiku humwe pane kunonoka kwemavhiki maviri. Zvinotamisa kutenga kubva pa "kutarisira kontrakiti" kuenda pakutarisira chokwadi chekugadzira.

Izvi Zvinorevei Pakuongorora Kwako Kunotevera

Kuomarara kwekugadzira maPCB ane layer masere ndekwechokwadi. Zvinhu zvepakati zvekunze kwenyika zvinogadzirisa mhedzisiro, kwete kuvimbika kwako. Ongorora humbowo hwemaitiro - marogi ekunyoresa emukati, data replating rezvikamu zvakasiyana, mazita eprepreg specs, nhamba dzezvibodzwa zvechokwadi. Vaka hukama mukati mefekitori, kwete nechikwata chekutengesa chete. Sarudzo dzekutenga dzinosiya basa iri dzinoonekwa sekukundikana kwemunda, kwete zvinhu zviri pamutsetse wemutengo.