Chinhu chine njodzi zvikuru pamusoro pePCB ine layer 6 hakusi kuoma kwekugadzira. Ipfungwa yekuti stackup ye "standard" yakanaka yakachengeteka. Pfungwa iyoyo yakadhura purojekiti imwe chete yemadhora zviuru gumi nezvitatu ($13,000), mazuva gumi nemasere ekunyorwa kwepurogiramu, uye demo yevatengi yakanonoka - zvese izvi nekuda kwekuti layer mbiri dzemukati dzesignal dzaive pedyo pasina plane pakati padzo.
Gwaro rega rega rekugadzira PCB ine layer 6 richakuudza kuti uwedzere layer kana bhodhi rako rine layer 4 razara. Zano iri raburitsa mhinduro dzinosvika chiuru dzakakundikana. Kuwanda kwe layer isarudzo yekuvaka magetsi ine kuvimbika kwesignali, mhedzisiro, uye mhedzisiro yemutengo wese iyo inowedzera nenzira iyo vazhinji vevagadziri ve layer 6 kekutanga vasingaone kusvika vatarisa nyaya isina kubudirira.
Bhodhi rePCB rine mativi matanhatu chii?
Tsanangudzo uye Chimiro Chekutanga
PCB ine mativi matanhatu ibhodhi redunhu rakadhindwa rakavakwa nematanda matanhatu emhangura anofambisa mhepo akasungirirwa pamwe chete nezvinhu zvinodzivirira kupisa. Matanho emhangura anotakura zviratidzo, anogovera simba, uye anopa mapuraneti ekutarisa emagetsi. Matanho emagetsi anoparadzanisa uye anochengetedza kupisa kwematanda emhangura kubva kune mumwe nemumwe. Matanho ese matanhatu akabatana nemagetsi kuburikidza nemaburi akaboorwa uye akaputirwa anonzi vias.
Kusiyana nebhodhi rine zvidimbu zviviri apo nzira dzese dzekufambiswa kwemagetsi uye kugoverwa kwesimba kwese kunofanirwa kugoverana nzvimbo mbiri dzekunze, bhodhi rine zvidimbu zvitanhatu rinobvumira zviratidzo kuti zviendeswe pazvikamu zvemukati zvakadzivirirwa nematanho ekutarisa, simba nevhu kuti zvigare muzvikamu zvemukati zvakatsaurirwa, uye zvikamu zvekunze kuti zvichengeterwe kubatana kwezvikamu uye zviratidzo zvinowanikwa nyore nyore.
Kusiyana Kwakaita PCB ine Zvikamu Zvitanhatu neMabhodhi ane Zvikamu Zviviri neZvikamu Zvina
| mamiriro | 2-Layer | 4-Layer | 6-Layer |
| Matanho ekufambisa | 2 | 2-3 | 3-4 |
| Ndege yepasi yakatsaurirwa | Aihwa | 1 zvakajairika | 1–2 zvakajairika |
| Ndege yemagetsi yakatsaurirwa | Aihwa | 1 zvakajairika | 1 zvakajairika |
| Kudzivirira zviratidzo zvemukati neEMI | hapana | Partial | Full |
| Kureruka kwekudzora impedance | Zvakaoma | eresera | Kugona |
| Kuparadzaniswa kwechiratidzo chakasanganiswa | Minimal | Ndege dzakapatsanurwa chete | Mapairi endege akasiyana anogoneka |
| Mutengo unowandisa kana kuti une mativi maviri | 1x | ~1.4–1.7x | ~1.8–2.2x yakatorwa; 2.8–3.5x yakamhara |
Zvikamu Zvikuru zvePCB ine Zvikamu Zvitanhatu
Chivako chacho chine zvikamu zvitatu zvepakati zvakasungirirwa nezvikamu zviviri zve prepreg, zvese zvakadzvanywa pasi pekupisa nekumanikidzwa. Zvikamu zvekunze zvinogamuchira lamination ye copper foil. Zvimedu zve copper zvinocherwa muchikamu chimwe nechimwe uchishandisa maitiro e photolithographic. Chifukidzo che solder chinoiswa kumeso ese ekunze kudzivirira zvimedu uye kugadzira ma pads anogona kusungirirwa. Kupedzwa kwepamusoro kunoiswa pa copper yakavhurika kudzivirira oxidation uye kugonesa soldering.
Tsananguro yePCB yezvikamu zvitanhatu
Chii chinonzi PCB Stackup?
Kugadzika kwesimbi ndiko kurongeka kwesimbi dzemhangura nedze dielectric dzinotsanangura hunhu hwemagetsi nehwemakanika hwebhodhi. Inoona impedance, capacitance pakati pemapuraneti, kupatsanurwa kwechiratidzo, kushanda zvakanaka kwekudzivirira kweEMI, uye kusasimba kwemakanika. Kukanganisa kugadzika kwesimbi ndicho chikonzero chikuru chekukundikana kwematanho matanhatu - nekuti haigoni kugadziriswa pasina kudzoreredzwa kwakazara.
Kugadziriswa kwePCB Stackup yeSta ...
Kuunganidzwa kwakakodzera kwebhodhi rePCB rine machira matanhatu rine masaini ekumhanya kwakanyanya ipuratifomu ine macore matatu akafanana:
| rukoko | basa | Mareferensi / Zvinyorwa |
| L1 — Chiratidzo Chepamusoro | Nzira yekufambisa zvinhu parutivi, nzira yeBGA inobuda zvakanaka | Zvinotaurwa nezve L2 GND — microstrip |
| L2 — Ndege Yepasi | Simba reGND — nhoo huru yeEMI | Mareferensi L1 pamusoro uye L3 pazasi |
| L3 — Chiratidzo Chemukati | Mapairi ekusiyanisa ekumhanya kwepamusoro, impedance inodzorwa | Inotaurwa nezvayo paL2 iri pamusoro, L4 iri pazasi — stripline |
| L4 — Ndege yeSimba | Kugoverwa kwesimba rekutanga VCC, VDDIO, nezvimwewo. | Mareferensi L3 pamusoro uye L5 pazasi |
| L5 — Chiratidzo Chemukati | Nzira yechipiri yekufambisa, zviratidzo zvinomhanya zvishoma kana zvakaparadzana | Inotaurwa nezvayo paL4 iri pamusoro, L6 iri pazasi — stripline |
| L6 — Chiratidzo chePasi/Pasi | Kudzoserwa kweGND kwakasimba kana kuti nzira yekudzosera pasi | Inotaurwa nezvayo kuL5 iri pamusoro — microstrip |
Mhando dze6 Layer PCB Stackup Configurations
Haasi mabhodhi ese ePCB ane layer 6 anoshandisa layer shares dzakafanana. Magadzirirwo acho anofanira kutungamirirwa nedanho guru rekugadzira:
• SIG/GND/SIG/PWR/SIG/GND Yakajairika: Sarudzo yakanakisisa yekushandiswa kwese kwese. Masaini ese ane mareferensi ari pedyo. Akakodzera madhizaini mazhinji edhijitari akasiyana.
• High-Speed Stripline: Shandisa ma "critical differential pairs" ese ari paL3 neL5, uchichengetedza L1 neL6 kuti zvikwanise kubatanidza zvine speed yakaderera. Inodzivirira zvakanyanya EMI kune ma "interfaces" ari pasi pe5 Gbps.
• Mixed-Signal: Isa L3 kumasignali eanalog ane analog GND yakatsaurirwa paL2 uye analog power split paL4. Dhijitari inotora L5 neL6. Inodzivirira kubatana kweruzha rwedigital switching mu analog front-end.
• Kutarisa Kusimba Kwesimba: Mapurani maviri emagetsi akasiyana ane pakati pawo pakakora. Anowedzera kugona kweinterplane kune vanogadzirisa magetsi vane simba guru.
Kuunganidzwa Kuchakanganisa Kukura Kwako
Maitiro ekukundikana anowanzoonekwa mumagadzirirwo ekutanga e6-layer: SIG / GND / SIG / SIG / PWR / GND. Izvi zvinoisa L3 neL4 semasaini maviri ari pedyo nepakati nepakati pemagadzirirwo matete chete uye hapana referensi yeimwe neimwe. Mafungu ekudzoka pakuchinja kwemagetsi haana kwekuenda. Broadside crosstalk pakati peL3 neL4 haidzoreki. Purojekiti chaiyo ye2022 PCIe Gen2 ichishandisa iyi stackup yakaburitsa musiyano weimpedance we92–108 ohms pachinzvimbo che85-ohm target - zvichikonzera kutadza kwenzira pamabhodhi makumi mashanu akaungana.
Magadzirirwo eStackup ane Matunhu matanhatu Akanakisisa kana Akaipisisa
Bhodhi rine zvidimbu zvitanhatu rine muunganidzwa wakashata - kunyanya zvidimbu zviviri zviri pedyo pakati - zvinoburitsa EMI yakawanda kupfuura bhodhi rine zvidimbu zvina rakanyatsogadzirwa zvakanaka rine GND yakasimba paL2. Rutivi rweplane runopa nzira huru yekudzivirira EMI. Rutivi rwese rwesignali runofanira kunge ruri pedyo neplane kudivi rimwe chete; kuvigwa pakati pezvikwata zviviri kuri nani. Chimiro chakaipisisa ndeche chero kurongeka kunosiya chidimbu chesignali chisina referensi yeplane iri pedyo.
Zvinhu zveDielectric Zvinoshandiswa mu6 Layer PCB Stackups
| zvinhu | Dk | Kurasikirwa Tangent | Best For |
| FR-4 | 4.2-4.5 | 0.018-0.025 | Dhijitari yakajairika, <5 Gbps |
| Rogers RO4350B | 3.48 | 0.0037 | RF, >10 GHz, inodzorwa Drk |
| Isola FR408HR | 3.65 | 0.009 | Dhijitari inomhanya zvikuru, 5–25 Gbps |
| Panasonic Megatron 6 | 3.4 | 0.004 | Backplane, >25 Gbps SerDes |
6 Layer PCB Ukobvu uye Zviyero
Sarudzo dzeKukora kwePCB dzeStandard 6 Layer
Sarudzo dzakajairwa dzekukora dzakapedzwa dzemabhodhi ane layer matanhatu ndedze 1.0 mm, 1.2 mm, 1.6 mm, uye 2.0 mm. Ukobvu hwega hwega hunoda musanganiswa chaiwo wehukobvu hwepakati neprepreg kuti husvike pahurefu hwakapedzwa, izvo zvinokanganisa zvakananga nzvimbo ye dielectric pakati pe layer uye nekudaro kukosha kwe impedance kunogoneka.
Sei 1.6mm iri iyo yakanyanya kuwanda
Chivakwa che1.6 mm chinonyanya kushandiswa mumagadzirirwo e6-layer nekuti chinokwana musanganiswa wepakati nepamberi unogadzira symmetric stackup isina maodha chaiwo ezvinhu. Ndiyo inowanikwa nguva dzose pazvigadzirwa zvemabhizinesi, zvichireva kuti nguva dzekutengesa dzinopfupika uye mitengo ndiyo inonyanya kukwikwidzana. Kune akawanda magadzirirwo edhijitari uye masaini akasanganiswa asina zvirambidzo zvekuvhara zvine simba, 1.6 mm ndiyo nzvimbo chaiyo yekutanga.
Maitiro Ekusarudza Ukobvu Hwakakodzera hwePCB
Zvivakwa zvakatetepa zvinoda zvikamu zvakatetepa zve dielectric, izvo zvinoderedza nzvimbo iri pakati pemapurane ari pedyo nezvikamu zvechiratidzo. Izvi zvinowedzera kugona kwe interplane asi zvinoita kuti kutonga kwe impedance kuve kwakaoma pasina stackup yakagadzirwa. Muenzaniso chaiwo weprojekiti: kutsanangura controlled impedance pabhodhi re 1.2 mm kwakamanikidza shanduko kuenda ku 1.6 mm nekuti ukobvu hwe dielectric hunodiwa hwe 85-ohm differential pairs hwakanga husina kukwana mukati me thinner build - zvichikanganisa clearance ye mechanical enclosure. Gara uchisimbisa zvirambidzo zve enclosure usati wakiya stackup.
Huremu hwemhangura uye Upamhi hweTrace
Mabhodhi mazhinji ane mativi matanhatu anoshandisa mhangura ye 1 oz pamatanda ekunze uye mhangura ye 0.5 oz pamatanda emukati senzira yekutanga. Mhangura inorema inowanikwa pakushandisa magetsi ane simba asi inoda nzvimbo yakakura yekutevera uye shoma kuburikidza nekugadzirisa ring ye annular. Upamhi hushoma hwetrace pamatanho akajairwa e6-layer hunowanzova 3–4 mil ekunze, 3.5–4 mil yemukati; nzvimbo shoma inoratidza izvi. Kufamba kweBGA kunowanzoda nzvimbo yetrace ye 3/3 mil pa 0.8 mm pitch.
6 Layer PCB vs 4 Layer PCB: Nguva Yekusimudzira
Pfungwa Isina Njodzi Zvikuru
Chikonzero chinowanzo shandiswa pamatanho matanhatu: kufambisa zvinhu kwakaoma pabhodhi rine matanho mana. Kuwanda kwematanho hakusi kufambisa zvinhu. Bhodhi rine matanho mana rine SI yakanaka riri nani pane bhodhi rine matanho matanhatu rine mutsetse wakatyoka. Kuwedzera matanho ekudzivirira dambudziko rekufambisa zvinhu kunowanzo fambisa dambudziko racho zvakadzama mubhodhi uko kwakaoma kugadzirisa dambudziko.
Zvinhu Chaizvo Zvinokonzera Kutamira kuZvikamu Zvitanhatu
Sarudzo yekuenda kumatanho matanhatu inofanira kutungamirirwa nemiganhu chaiyo yemagetsi, inozivikanwa, iyo isingagoni kugadziriswa pamatanho mana:
• Wapedza mukana wekutarisa masaini akakosha — chiratidzo chega chega chinomhanya zvakanyanya chinoda kudzoka panzvimbo iri pedyo, uye stack yako ye4-layer haigone kuipa.
• Panguva imwe chete unoda nzira dzakawanda dzekudzoka dzakazvimiririra: madhijitari, analog, uye RF domains angabatana zvinoparadza kana mukashandisa imwe chete.
• Uri kutumira ma "differential pairs" anopfuura 8 kusvika ku10 ane kumhanya kwepamusoro-soro kupfuura 500 MHz edge rate kubva kuBGA uko "escape" inoshandisa ma "layers" ese ari maviri ekunze, pasina kana chiratidzo chezviratidzo zvemukati.
• Unoda inductance yakatsaurirwa yekupararira kweplane yemagetsi iyo mapuraneti akapatsanurwa pabhodhi rine nhurikidzwa ina asingagoni kuwanikwa.
Kana PCB ine 4 Layer ichiri yakakwana
Bhodhi rakakora rine masaini ari pasi pe50 MHz rinogona kugara pazvikamu zvina nekusingaperi rine fanout yakarongeka, orthogonal routing, uye kuburikidza ne optimization. Mazhinji maIoT nemabhodhi ekudzora maindasitiri ane speed yakaderera anoiswa muzvikamu zvitanhatu kana ongororo ye routing uye kugadzirisa nzvimbo yezvikamu kuchigadzirisa dambudziko rezvikamu zvina zvakanaka.
Kuenzanisa Mutengo: 4 Layer vs 6 Layer PCB
Mutengo webhodhi rine zvidimbu zvitanhatu unowanzo kuve wakapetwa ka1.8 kusvika ka2.2 kupfuura bhodhi rine zvidimbu zvina zvakaenzana nehukuru hwakaenzana uye huremu hwemhangura. Iyi ndiyo nhamba inoonekwa muRFQs. Mutengo wekuwedzera mutengo chaiwo — mushure mekuverenga ma prototype respins, vhoriyamu yakagadziriswa ye yield, uye NRE yekusimbisa chikamu — unomhanya ka2.8 kusvika ka3.5 kupfuura mutengo we zvidimbu zvina. Imwe projekiti yekugadzira ya2023 yakatorwa pamadhora gumi nemasere payuniti pazvidimbu mazana mashanu yakawana pamadhora makumi matanhatu nemaviri payuniti mushure me resin mbiri uye kurasikirwa kwezvibereko. Bhajeti yemuwedzere chaiwo, kwete uyo akatorwa.
Mitemo 6 yeKugadzira PCB
Maitiro Akanakisisa Ekufambisa Zviratidzo
Dzorera ma "high-speed differential pairs" pa "inner signal layers" apo anovigwa pakati pe "plane layers". "Inner stripline routing" inopa EMI shield iri nani uye "factual impedance" iri nani kupfuura "outer microstrip". Dzivisa kuendesa ma "critical signals" pa "outer layers" kunze kwekunge dhizaini yacho isina nzira yekuendesa ma "inner layer routing" - ma "outer signals" anopenya zviri nyore uye anogona kukuvara zvakanyanya nekuda kwe "assembly".
Shandisa nzira dzekufambisa dzakatenderedza pakati pezvikamu zvechiratidzo zviri pedyo. Kana L1 ichifamba zvakanyanya mugwara reX, L3 inofanira kufamba zvakanyanya mugwara reY. Izvi zvinoderedza crosstalk yekupinda nekubuda pakuchinja kwezvikamu uye zvinoita kuti routing inodzorwa ne impedance ive nyore kuwana nekushandisa ma "trace geometries" akafanana.
Simba uye Ground Ndege Dhizaini
Simba rebhodhi rine zvidimbu zvitanhatu rinobva pakubatana kwakasimba pakati pePWR neGND plane pair. Wedzera izvi nekuchengeta dielectric iri pakati peL4 neGND iri pedyo yakatetepa sezvinobvumirwa nekugadzirwa - 4 kusvika 6 mil prepreg muchimiro chakajairwa. Isa ma capacitor ekuparadzanisa mukati me200 mil yepini yega yega yeIC power, ne via kuenda ku power plane uye via kuenda ku ground plane yakaiswa zvakaenzana kumativi ese emuviri we capacitor. Dzivisa kuendesa zviratidzo kuburikidza nekupatsanurwa mu power plane - kudzoka kwemagetsi kunofanira kuyambuka kupatsanurwa, zvichigadzira loop inopenya.
Kudzora Kusapindirana muPCB dzeLayer 6
Kudzorwa kweimpedance mubhodhi rine zvidimbu zvitanhatu kunoenderana nehukobvu hwe dielectric huri pakati pechiratidzo cheimpedance nereferensi yayo iri pedyo, upamhi hwetrace, uye dielectric constant yezvinhu. Zvikamu zvemukati zve stripline zvinokwanisa kushivirira impedance zvakanyanya kupfuura zvikamu zvekunze zve microstrip nekuti zvakadzivirirwa kubva kumigumisiro yepamusoro uye kusiyana kwe lamination kunowirirana pakati pechivakwa.
Nyanzvi: musiyano we 0.5 mil muhukobvu hwe prepreg — mukati menguva yekugadzirwa kwe fab yakajairika — inochinja mutsetse we stripline we 50-ohm kuenda ku 58 ohms. Pa 8 Gbps, izvi zvinovhara ziso. Nguva dzose simbisa data re impedance test coupon pane build yekutanga chinyorwa, kwete chete stackup specification.
Kudzora impedance hakusi nguva dzose kwakakodzera. Dhizaini yemuchina wekurapa we2024 yaive neUSB 3.2 Gen1 pa5 Gbps pamatanho ari pasi pe40 mm nekuchinjana kwematanho maviri chete. Kutsanangura kudzorwa kwe impedance kwaizowedzera 38% pamutengo wekugadzira, kuwedzera nguva yekutungamira nemavhiki matatu, uye kumanikidza bhodhi rakakora rakatyora nzvimbo yakavharirwa. Bhodhi rakavakwa pa stackup yakajairwa ine nzvimbo ye7/7 mil trace-space, series damping resistors, uye urefu hunoenderana ne5 mm. Yakapfuura EMC uye functional validation pakutenderera kwekutanga. Kudzora kudzorwa kwe impedance kwakakosha kune >10 Gbps, matanho anopfuura 150 mm, uye multi-transition BGA routes - kwete kune ese ma differential pair.
Kuburikidza neMarudzi Anoshandiswa mu6 Layer PCBs
• Hole Rinopfurwa: Rakajairika kuburikidza nekubatanidza machira ese matanhatu. Mutengo wakaderera, unowanikwa pasi rose. Nekuburikidza nestub pasi pechikamu chekupedzisira chakashandiswa kunoita kuti pave neresonance iri pamusoro pe3 GHz — shandisa back-drilling kana izvi zvichikosha.
• Mabhandi Akapfava: Batanidza jira rekunze nejira remukati chete. Bvisa ne stub. Zvinodiwa kuti BGA ibude zvakanaka pamabhodhi akakora. Wedzera 25–40% pamutengo we fab.
• Mavhiya Akavigwa: Batanidza zvidimbu zvemukati chete, zvisingaonekwe kubva pamusoro pebhodhi. Zvinoshandiswa mukugadzirwa kweHDI kwakawanda. Zvinowedzera mari zvakanyanya; zvinoda lamination yakatevedzana.
• Via-in-Pad: Inoboorwa zvakananga nepadhi reSMD. Inobvumira BGA pitch yakasimba. Inofanira kuzadzwa uye kuvharwa kuti solder isatsvedze panguva yekudzoreredza mvura. Yakajairika ye 0.5 mm pitch BGA.
Kufunga Nezvekugadzira EMI neEMC
Nzira huru yeEMI mubhodhi redhijitari rine zvidimbu zvitanhatu idenderedzwa rinoumbwa pakati pechiratidzo chechiratidzo nenzira yaro yekudzoka kwemagetsi panzvimbo iri pedyo. Deredza denderedzwa iri nekusambofa wakaisa chiratidzo chechiratidzo panzvimbo yakakamurwa kana pamusoro penzvimbo iri mudenderedzwa rechiratidzo. Shandisa kuburikidza nekusona — zvidimbu zvepasi zvakaiswa panguva dzakajairwa kutenderedza denderedzwa rebhodhi uye pakati penzvimbo dzezviratidzo — kugadzira nzira dzekudzoka dzisina kupindira zvakanyanya pakuchinjika kwezvikamu. Isa zvidimbu zvekusona mukati me200 mil yechiratidzo chega chega kuburikidza nenet inomhanya zvakanyanya.
Kutarisira Kupisa muDhizaini yePCB yezvikamu zvitanhatu
Isa ma "thermal vias" mu "grid pattern" pasi pezvikamu zve "pad" zvakavhurika zvinobatanidza "top-side pad" zvakananga kuma "inner GND planes". "Grid" ine dhayamita ye0.3 mm pa 0.6 mm pitch inopa kupararira kwe "thermal" mu "inner copper mass". Kune zvikamu zvine simba guru, ma "inner PWR" ne "GND planes" anoshanda se "heat spreaders" anoparadzira "thermal load" asati asvika kumucheto wePCB kana "external heat sink".
Maitiro Ekugadzira PCB Akarongwa 6
Nhanho neNhanho: Magadzirirwo ePCB ine Zvikamu Zvitanhatu
• Danho 1 — Kugadzirira mukati memukati: Zvikamu zviviri zvemukati memukati zvinoputirwa nefoil yemhangura, zvinoratidzwa nemuenzaniso wedunhu nenzira ye photolithographic, uye zvinochekwa kuti zvisiye chete zvisaririra zvemhangura zvakagadzirwa.
• Danho rechipiri — Kurapa oxide: Nzvimbo dzemukati dzemhangura dzinoiswa mishonga yemakemikari kuti dzivandudze kunamira pakati pemhangura ne prepreg panguva yekunyungudika.
• Danho rechitatu — Lamination: Matanda ese — macores, ma prepreg sheets, uye ma outer copper foils — anorongwa zvakanaka uye anodzvanywa pasi pekupisa nekumanikidzwa kusvika prepreg resin yayerera uye yapora.
• Danho rechina — Kuboora: Kuboora nekushandisa michina kunogadzira maburi ePTH vias nemaburi ezvikamu. Kuboora neLaser kunogadzira mabhurugwa madiki eHDI. Kuburikidza nekururama kwenzvimbo padanho iri kunosarudza hunhu hwekunyoresa kubva pachikamu kuenda pane chimwe.
• Danho rechishanu — Kuputira mhangura: Maburi akaboorwa anoputirwa nemhangura isina electrolyte ichiteverwa nemhangura yeelectrolytic kuti iungane kuburikidza neukobvu hwemadziro.
• Danho 6 — Kucheka kwekunze: Foil yemhangura yekunze inogadzirwa nemapatani uye inochekwa kuti igadzire mapedhi, mapadhi, uye mapurani eL1 neL6.
• Danho rechinomwe — Kuisa chifukidzo chesolder: Chifukidzo chesolder chinotorwa nemufananidzo wemvura chinoiswa, chinoonekwa, uye chinogadzirwa kuti chivhare zvisaririra ukuwo mapedhi achisiyiwa ari pachena.
• Danho rechisere — Kupedzisa pamusoro: Kupedzisa pamusoro kunoiswa pamapedhi emhangura akavhurika.
• Danho rechi9 — Kuedza nekuongorora: Kuenderera mberi kwemagetsi uye kuyedzwa kwekupatsanurwa, AOI, kuongorora zvikamu zvakasiyana, kusimbiswa kweimpedance pamakuponi ekuyedza.
Dambudziko reKushivirira Kunyoresa — Nei Richikosha Kupfuura Pepa Reruzivo
Matanda epakati anowanzo chengeta kunyoreswa kwelayer-to-layer pa ±0.075–0.1 mm pazvivakwa zve6-layer, zvichienzaniswa ne ±0.05 mm pa4-layer. Pa0.15 mm kuburikidza nehukuru, kubvumidzwa uku kwekunyoresa kunogona kufambisa via annular ring kusvika kumucheto wekutevedzera zvishoma kweIPC Class 2. Mabhodhi anopasa bvunzo dzemagetsi dzinobhururuka-probe anogona kunge aine ma via asina kusimba echimiro ayo anokundikana pasi pekumanikidzwa kwe thermal cycling mumunda. Iri ndiro dambudziko rakavanzika re goeth risingaonekwe kusvika pakugadzirwa kwehuwandu.
Pamusoro Pedzisa Sarudzo
| pamusoro Finish | Best Application | Kufunga Kwakakosha |
| ENIG | BGA yakapfava, waya yekubatanidza | Njodzi yepedhi nhema kana ukobvu hweNi/Au husina kudzorwa |
| HASL Inotungamira-Yemahara | Inodhura zvakanyanya, inodarika maburi akawanda | Nzvimbo isina kuenzana iri pa <0.5mm SMD |
| OSP | SMD ine vhoriyamu yakawanda, inoyerera kamwe chete | Nguva yekushanda pasherufu pasi pemwedzi gumi nemiviri; haishande zvakanaka pakugadzirisazve |
| Kunyudza Sirivha | Mashandisirwo eRF ane mafrequency akakwira, >10 GHz | Inodzivirira ganda kubva mukusviba; inoda kuchengetwa kwakanyatsonaka |
| Kunyudza Tin | Zvishandiso zvekubatanidza zvinodzvanywa nepress-fit | Njodzi yetsvina yetin kana isina kutsanangurwa zvakanaka |
Quality Testing uye Inspection
Otomatiki Optical Inspection inoongorora ma layers ese matanhatu mushure mekucheka uye mushure mekuunganidza kuti ione kuvhurika, mashoti, uye zvinhu zvisipo. Kuyedzwa kwemagetsi ekufambisa kana kuti bed-of-nails kunosimbisa kuenderera mberi uye kupatsanurwa pane neti yega yega. Kune magadzirirwo eimpedance anodzorwa, makuponi ekuyedza akaiswa pachikamu chepaneru anopatsanurwa uye anoyerwa neTDR kuti aone kuti impedance yakavakwa sei inopesana nezvinodiwa. Kuongorora kwechikamu kunoitwa pamabhodhi emuenzaniso kubva pachikamu chimwe nechimwe kuti vaone ukobvu hwe dielectric, kufanana kwe copper plating, uye kuburikidza nekururama kwekunyoresa.
Zvinhu Zvitanhatu Zvinokonzera Mutengo wePCB
Chii Chinosarudza Mutengo wePCB ine Zvikamu Zvitanhatu?
Mutengo weyuniti yakataurwa unoenderana nehukuru hwebhodhi, huremu hwemhangura, kusarudzwa kwezvinhu, kuburikidza nekuomarara, kupedzwa kwenzvimbo, uye huwandu hwekurongeka. Imwe neimwe yeiyi variables inoonekwa muRFQ. Izvo zvisingaonekwe - uye zvinonyanya kukosha pamutengo wepurojekiti yese - ndeye yield, respin probability, uye process verification NRE.
| Mutyairi wemutengo | Mutengo Wakataurwa | Mhedzisiro Yemutengo Wakavanzika / Wekudonha Kwevhu |
| Saizi yebhodhi | Mutengo wakananga — pachikamu chepaneru | Zvakaderera — zvinofungidzirwa |
| zvinhu | Kuwedzera ka2–5 kune nyanzvi | Nguva dzepakati nepakati — nguva dzebasa rehunyanzvi dzinogona kuwedzera |
| Via type | +25–40% ye blind vias | Pakati nepakati — inoderedzwa nekuwanda kwevanhu vanochengetedza zvinhu |
| Surface kupera | +$0.50–2.00/yuniti yeENIG | Zvakaderera — zvinofungidzirwa |
| Raira huwandu | Dhisikaundi yevhoriyamu yakajairika | Zvakaderera — zvinofungidzirwa |
| Kushivirira kunyoreswa kwezvikamu | Hazvionekwi muRFQ | HIGH — inokonzeresa kurasikirwa kwegoho pahuwandu |
| Kusiyana kweukobvu hweDielectric | Hazvionekwi muRFQ | HIGH — madhiraivha eSI anotenderera |
| Kuponi yeImpedance NRE | Dzimwe nguva zvinotaurwa, kazhinji hazviiti | HIGH — yakawedzerwa chinyararire paodha yechipiri kusvika yechitatu |
| Kusimbiswa kwezvikamu zvakasiyana | Dzimwe nguva zvinotaurwa, kazhinji hazviiti | HIGH — inodiwa mushure mechiitiko chipi zvacho chekukohwa |
Mutengo Wechokwadi Unowedzera - Zvinofanira Kuzivikanwa Nekutenga
Chiyero chenyika chaiyo kubva pakutevera kugadzirwa: bhodhi rine zvidimbu zvitanhatu rakatorwa pa1.8 kusvika 2.2 kakawanda kupfuura bhodhi rine zvidimbu zvina rinowira pa2.8 kusvika 3.5 kakawanda kana kurasikirwa negoho, NRE, uye mari yekusimbisa maitiro zvichibatanidzwa. Goho rekutanga pamhando dzepakati dzeAsia pakuvaka kwezvidimbu zvitanhatu rinosvika 70 kusvika 85 muzana, zvichienzaniswa ne95 muzana kana kupfuura kune zvidimbu zvina. Musiyano wehuwandu hwezvimedu zvechinyakare wega unowedzera 10 kusvika 25 muzana pamutengo unoshanda weyuniti muhuwandu.
Maitiro Ekuderedza Mitengo yePCB ye6 Layer Pasina Kukanganisa Hunhu
• Gadzirisa stackup yako: Shandisa chivakwa chefab chine nhanho nhanhatu chero pazvinobvumirwa nezvinodiwa nesignali yako. Stackup dzakagadzirwa dzinowedzera mari yekugadzirisa uye dzinowedzera nguva yekuisa.
• Enzanisa saizi nechinhu chinotapira chembatya: Kugadzira nedhayamita pa 0.2 mm kana kupfuura kunodzivisa kuomeswa kwesimbi kunokonzera kurasikirwa kwegoho uye mutengo.
• Kudanwa kweimpedance inodzorwa nekuchengetedza: Isa chete kumachira nemambure anonyatsoda. Kudanwa kweimpedance inodzorwa nekuchengetedza pachira chimwe nechimwe kunowedzera mari yakanaka uye nguva yekutungamirira pasina rubatsiro pamambure anomhanyisa zvishoma.
• Shandisa nzvimbo yekusimbisa usati wagadzira: 50 kusvika ku100 mapuranga ane saizi yakazara yepaneru usati waisa vhoriyamu. Mutengo wekushandisa nzvimbo yekusimbisa nguva dzose wakaderera pane mutengo we20 kusvika ku30 muzana wezvimedu zvechinyakare pamutengo wekutanga wevhoriyamu.
Mashandisirwo e6 Layer PCB Boards
Mutengo wepamusoro we6-layer unonzwisisika kana zvinodiwa zvemagetsi zvisingakwanise kuzadzikiswa pama layer mashoma. Maapplications ane chimiro chakafanana: ma multiple high-speed serial interfaces, mixed-signal domains anoda kupatsanurwa kwemuviri, kana kuti component densities zvinoita kuti 4-layer routing isashande pasina kukanganisa masignal trusture.
• Makombiyuta anomhanya zvakanyanya uye server hardware: PCIe Gen3/4, DDR4/5, 25G Ethernet interfaces uko kudzora impedance uye kuenderera mberi kwe plane panguva yega yega yekuchinja zviri zvinosungirwa, kwete sarudzo.
• Midziyo yekutaurirana: Ma "multi-port routers", ma "switch", uye ma "base station modules" uko ma "high-speed serial links" anoshanda pamwe chete ne "analog power management" uye "RF front-ends" pabhodhi rimwe chete.
• Midziyo yekuongorora chirwere: Maseketi ekumberi kwe-analog anoda kuparadzaniswa kubva kuma domain ekugadzirisa edhijitari, ane ma plane pairs akagadzirirwa domain yega yega yesignal kudzivirira kushandura ruzha.
• Automotive ADAS uye infotainment: Mavhidhiyo anomhanyisa, CAN/LIN, uye RF zviri pamwe chete pabhodhi rimwe chete zvine zvinodiwa zvakasimba zveEMC uye tembiricha yakakura.
• Masisitimu ekudzora maindasitiri: Magadzirirwo emavoltage akasiyana-siyana ane nzira dzekuyera analog dzakaparadzana, maPWM anobuda ane simba guru, uye nzira dzekutaurirana pabhodhi rimwe chete.
• Ndege nedziviriro: Mashandisirwo apo muripo wemutengo uri wechipiri kana tichienzanisa nekuvimbika kwechiratidzo, kuvimbika kwekupisa, uye zvinodiwa zvehupenyu hurefu.
PCB ine mativi matanhatu haisi bhodhi rine mativi mana chete rine nzvimbo yakawanda yekufambisa zvinhu. Ipuratifomu yemagetsi yakasiyana zvachose ine zvirambidzo zvakananga pakuisa zvinhu, kudzosa magetsi, kudzora impedance, uye mhando yemaitiro ekugadzira. Sarudzo dzinoitwa usati waisa chinhu chimwe chete — stackup configuration, dielectric material, via strategy, vendor selection — dzinoona kana dhizaini yacho ichibudirira pakutanga kana kuti ichiva chidzidzo chinodhura.
Mutengo chaiwo webhodhi rine zvidimbu zvitanhatu hausi mutengo wepayuniti imwe neimwe paRFQ. Imari yose yemutengo wakataurwa, mutengo we respin unotarisirwa, mwero wezvimedu zvakagadziriswa muhuwandu, uye NRE yekuvongorora maitiro hazvionekwi kusvika pamutengo wechipiri. Bhajeti ye2.8 kusvika 3.5 yakaenzana ne4-layer senhamba yekuronga, uye simbisa kugona kwemutengesi nedata chairo usati wazvipira kuvhoriyamu.
PCB ine zvikamu zvitanhatu yakakodzera purojekiti yako here?
| Chinodiwa chechiratidzo | Muganho wekuisa zvinhu muchikwata | Nyaya |
| <50 MHz, kuwanda kuri pakati nepakati | Hapana chinodiwa chekumhanya kwendege ine referensi yepamusoro | Gara pazvikamu zvina, tanga wagadzirisa marongerwo acho |
| 500 MHz–5 Gbps, BGA, chiratidzo chakasanganiswa | Unoda mapeya endege akazvimiririra padunhu rega rega | 6 layers — shandisa symmetric 3-core build |
| >5 Gbps SerDes, backplane | Kudzora kwakasimba kwe impedance, zvinhu zvishoma-kurasikirwa | Zvikamu zvitanhatu zvishoma — funga nezve dielectric yakakosha |
| RF + kugara pamwe chete kwedhijitari | Madhomini eGND akaparadzana anodiwa | Zvikamu zvitanhatu — analog/RF plane pair yakatsaurirwa |
Kurumidza Kutarisa: Nhamba Dzinokosha
| Metric | ukoshi |
| Mutengo wekuwedzera wakataurwa nezvawo uchienzaniswa ne4-layer | 1.8x–2.2x |
| Muchina wekuwedzera mutengo chaiwo wekutenga zvinhu | 2.8x–3.5x |
| Kubudirira kwekutanga — 6-layer, mid-tier fab | 70 - 85% |
| Kubudirira kwekutanga — 4-layer, mid-tier fab | 95% + |
| Kushivirira kunyoreswa kwezvikamu — zvakajairika zvezvikamu zvitanhatu | ± 0.075–0.1 mm |
| Kusiyana kweukobvu hwe dielectric — zvakajairika | ±0.8 miriyoni |
| Nzvimbo/nzvimbo yakajairika — maitiro akajairwa ematanho matanhatu | 3–4 miriyoni / 3–4 miriyoni |
| PCIe Gen2 respin (purojekiti chaiyo, 2022) | $13,000 + pepa remazuva gumi nemasere |
| Chishandiso chekurapa: impedance inodzorwa vs mutengo wakajairika | $11.40 vs $8.25/bhodhi + kunonoka kwemavhiki matatu |
| Muganho wepakati dzinomhanya zvakanyanya wekufunga nezvezvikamu zvitanhatu | >8–10 differential pairs >500 MHz edge rate |
Mibvunzo Inowanzo bvunzwa Nezve 6 Layer PCB Boards
Kobvu hwakajairwa hwePCB ine mativi matanhatu hwakaita sei?
Ukobvu hwakanyanya kupedzwa i1.6 mm, hunoshandiswa nevakawanda vezvigadzirwa zvekutengesa sechivakwa chavo chepakutanga chine mativi matanhatu. 1.0 mm ne1.2 mm zviripo pakushandisa nzvimbo dzakamanikana asi zvinoda kuongororwa kwakagadzirwa. 2.0 mm inoshandiswa muzvishandiso zve backplane uye zvine simba guru. Simbisa zvirambidzo zvako zvekuvhara usati wataura ukobvu - kurira kwe impedance kunodzorwa kunogona kumanikidza bhodhi kuti riite gobvu kupfuura rinenge rakamboshandiswa.
Ndeipi gadziriro ye stackup yakanakira masaini ekumhanya kwepamusoro?
Kuvaka kwakafanana kwe3-core kune configuration yeSIG / GND / SIG / PWR / SIG / GND kunoita kuti signal layer yega yega ive nereferensi yakananga. Shandisa ma differential pairs anonyanya kukosha paL3 kuti uchengetedze EMI zvakanaka uye kuti usanyanya kufungidzirwa. Dzivisa chero stackup inoisa masignal layer maviri ari pedyo nepedyo pasina plane pakati pawo.
PCB ine mativi matanhatu inodhura marii?
Mutengo weyuniti yakataurwa kazhinji unowanzo kuve wakapetwa ka1.8 kusvika ka2.2 kupfuura bhodhi rine mativi mana. Mutengo chaiwo wekunyika — kusanganisira ma prototype respins, yield-adjusted scrap in volume, uye process verification NRE — unosvika ka2.8 kusvika ka3.5 kupfuura wakaenzana ne4-layer. Purojekiti yakataurwa pa$18 payuniti yakawana $62 inoshanda payuniti mushure mezviitiko zvekukohwa uye maresini maviri. Bhajeti yekuwedzera kwevhu, kwete mutengo wakataurwa.
Impedance inodzorwa inozodiwa rini pabhodhi rine nhurikidzwa nhanhatu?
Kudzora kupindirana kunodiwa kune masaini ari pamusoro pe1 Gbps ane hurefu hwetrace hunopfuura 100 kusvika 150 mm, kana kune chero multi-gigabit interface ine BGA escape routing inosanganisira multiple layer transitions. Hazvidiwi nguva dzose kuti matrace mapfupi ashande nekumhanya kuri pakati nepakati — dhizaini yeUSB 3.2 Gen1 ine matrace ari pasi pe40 mm inogona kusimbiswa neTDR measurement pamabhodhi ekutanga uye inogona kupfuura pasina mvumo yepamutemo yekupinda, zvichichengetedza mari yakanaka uye nguva yekutanga.
Mubvunzo upi unonyanya kukosha wekubvunza mutengesi wePCB usati waraira bhodhi rine mativi matanhatu?
Bvunza kuti vazive kuti vanozokwanisa here kunyora zvinhu zvakasiyana-siyana uye kuti vane hunyanzvi hwakasiyana-siyana sei pamhando dzakasiyana-siyana, zvichienderana nedata remhando dzakasiyana-siyana kubva pane imwe nzvimbo yazvino yakafanana. Mutengesi anopindura neIPC class references panzvimbo pemanhamba chaiwo mutengesi ane maitiro ausingafaniri kuvimba nawo pasina mvumo yekusimbisa yakazvimirira.
Ndingashandura dhizaini yangu yezvikamu zvina kuita zvikamu zvitanhatu here?
Ehe, asi kushandurwa hakufanirwe kunge kuri kwemakanika. Kungowedzera zvikamu zviviri pane imwe nhanho iripo yezvikamu zvina pasina kufunga nezve stackup architecture, reference plane assignment, uye power distribution hazvizogadzirise matambudziko ako e signal integrity uye zvinogona kugadzira mamwe matsva. Tora mafambiro kuzvikamu zvitanhatu sechiitwa chekugadzira patsva, kwete kushandura saizi yebhodhi.
Ndeipi software yakanakira dhizaini yePCB ine layer 6?
Altium Designer, Cadence Allegro, uye KiCad 7+ zvese zvinotsigira dhizaini ye6-layer ine mitemo ye controlled impedance design uye interactive high-speed routing. Kune madhizaini e6-layer ane zvinodiwa zveSI, stackup editor uye impedance calculator iri muchishandiso chekuisa marongero zvinofanirwa kugadziriswa nedata rechokwadi re fab re stackup — kwete ma default values — usati waisa chero impedance-critical trace.