Metal Core PCB
Metal Core Printed Circuit Board (MCPCB), inonziwo Insulated Metal Substrate (IMS) PCB kana inopisa PCB,
Contact kana RFQ


Iyo Basic Structure yeMCPCB inosanganisira:
- Solder mask layer
- Circuit layer
- Copper layer 1oz. kusvika 6oz. (inonyanya kushandiswa ndeye 1oz kusvika 2oz.)
- Dielectric layer
- Metal core layer - heatsink kana kupisa kuparadzira
Contact kana RFQ
Chii chinonzi Metal Core PCB (MCPCB)?
A Metal Core Printed Circuit Board (MCPCB), inonziwo insulated metal substrate (IMS) PCB kana inopisa PCB, imhando yebhodhi redunhu rinoshandisa simbi sehwaro hwayo hwekupisa kupisa, kusiyana neyakajairwa FR4 PCBs. MCPCBs dzakagadzirirwa kufambisa zvakanaka kupisa kunogadzirwa nemagetsi zvikamu panguva yekushanda kunzvimbo dzisinganyanyi kukosha, senge simbi heatsinks kana simbi simbi pachayo.
Iyo MCPCB inowanzo kuve nemateya matatu: conductive layer, thermal insulation layer, uye simbi substrate layer. Ichi chivakwa chinobvumira kutonga kwakanaka kwekupisa, kuve nechokwadi chekuvimbika uye hupenyu hurefu hwemidziyo yemagetsi, kunyanya mumashandisirwo emagetsi epamusoro senge mwenje we LED uye magetsi emagetsi.
Mhando dzeMetal Core PCB
Maererano ne Substrate zvinhu
Sarudzo yezvinhu zvehwaro zvinoenderana nezvinodiwa zvekushandisa, kuenzanisa zvinhu senge thermal conductivity, rigidity, uye mutengo.
Masimbi anonyanya kushandiswa mukugadzira MCPCB anosanganisira aluminium, mhangura, uye simbi alloys:
- aruminiyamu: Inozivikanwa nekunakisa kupisa kwekutamisa uye kugona kwekubvisa, aruminiyamu isingadhure, ichiita iyo yakanyanya kudhura sarudzo yeMCPCBs.
- mhangura: Paunenge uchipa yakanyanya kupisa kuita, mhangura inodhura kupfuura aluminium.
- simbi: Inowanikwa mumhando dzenguva dzose uye dzisina tsvina, simbi yakaoma kudarika aruminiyamu nemhangura asi ine yakadzika yekupisa conductivity.
Zvinoenderana neiyo Structure and Layers of Metal core PCB




Single Layer MCPCB
Double Layer MCPCB
Kaviri Side MCPCB
Multi-Layer MCPCB
Zvakanakira Metal Core PCB (MCPCB)
- Superior Heat Dissipation: MCPCBs inoshandisa simbi sealuminium kana mhangura, ichipa yakanakisa yekupisa conductivity. Ichi chiitiko chinogonesa kutonga kwakanaka kwekupisa mune-yakakwirira-simba maapplication, zvakanyanya kudzikisa tembiricha yekushanda yezvikamu uye kuwedzera kuvimbika kwehurongwa uye hupenyu. Semuyenzaniso, MCPCBs inogona kutamisa kupisa 8 kusvika 9 nguva nekukurumidza kupfuura yechinyakare FR4 PCBs.
- Kuderedzwa Kudiwa kweHeatsinks: Kusiyana neFR4 PCBs, inoda imwe yekutonhodza Hardware nekuda kwekudzika kwayo kwekushisa, MCPCBs inogona kunyatso bvisa kupisa yega. Izvi zvinoderedza huwandu hwese system saizi uye kuoma nekubvisa bulky heatsinks.
- Durability uye Simba: Aluminium, yakajairika substrate yeMCPCBs, inopa simba repamusoro uye kusimba kana ichienzaniswa nemidziyo yakaita sekeramic uye fiberglass. Kusimba uku kunoderedza njodzi yekukuvadzwa panguva yekugadzira, kusangana, uye kushanda kwakajairika, kuve nechokwadi chekuita kwenguva refu.
- Dimensional Kugadzikana: MCPCBs inoratidza kugadzikana kukuru kwedimensional kana ichiiswa mukusiyana kwetembiricha. Vanoona shanduko shoma saizi (kazhinji 2.5% kusvika 3.0%) pane tembiricha ye30 ° C kusvika 150 ° C, kuve nechokwadi chekushanda kwakafanana mumamiriro ekunze akasiyana.
- Yakareruka Kurema uye Yakakwirira Kugadziriswazve: MCPCBs akareruka kupfuura echinyakare PCBs, zvichiita kuti zvive nyore kubata uye kuisa. Pamusoro pezvo, aruminiyamu inodzokororwa uye haina chepfu, ichipa kune hushamwari maitiro. Ichi chimiro chinoitawo kuti aluminium ive inodhura-inoshanda imwe nzira kune zvimwe zvinhu.
- Hurefu Hupenyu: Kusimba uye kusimba kwealuminium haingowedzere kusimba kweMCPCBs asiwo inobatsira kune hupenyu hurefu hwekushanda. Izvi zvinoderedza mari yekugadzirisa uye kudiwa kwekutsiviwa, zvichiita kuti MCPCBs ive mari yekuchenjera maererano nehupenyu hurefu.
Metal Core PCB Manufacturing process
Iyo nzira yekugadzira yeMetal Core PCBs (MCPCBs) inosanganisira akati wandei nhanho nekuda kwekuvapo kwesimbi simbi mune stackup.
Single-Layer Boards: Kune single-layer MCPCBs isina layer transition, maitiro acho anoratidza iwo echinyakare FR4 mabhodhi. Iyo dielectric layer inotsikirirwa uye inosungirirwa yakananga kune simbi ndiro, kuve nechokwadi chekunamatira kunoshanda.
Multilayer Stackups: Kune multilayer MCPCBs, maitiro anotanga nekuchera simbi yesimbi. Izvi zvakakosha pakubvumira shanduko ye layer pasina kuisa njodzi mapfupi maseketi. Matanho anotevera anotsanangura maitiro:
- Drilling: Makomba akakura zvishoma anodonhedzwa mukati mesimbi simbi kuti agadzirise iyo insulating zvinhu.
- Kutakura: Makomba aya akazadzwa nejeli rinodzivirira, rinobva raporeswa nekuomeswa. Iyi nhanho yakakosha pakugadzirira nzvimbo yemhangura yekuputira.
- Kupera: Kana gel yaiswa, maburi akaboorwa anoputirwa nemhangura, yakafanana neyakajairwa vias mutsika PCBs.
- Kushamwaridzana: Iwo akasara dielectric layers anobva adzvanywa uye anosungirirwa kune simbi layer.
- Kuburikidza neHole Drilling: Mushure mekunge stackup yapera, kuburikidza-maburi anodonhedzwa kuburikidza negungano rose, achiteverwa nekuwedzera kweplating nekuchenesa maitiro.
