Tine anopfuura makore makumi maviri 'ruzivo muindastiri iyi, tinogona kupa mhinduro-yega kune vatengi kusanganisira PCB yekugadzira, yekutenga zvinhu uye PCB Assembly masevhisi. Nekuda kwemitemo nemirau yekugadzira, kuwedzera ruzivo rwetekinoroji uye shungu yekuyedza matekinoroji ezvino, takaunganidza akawanda ekugona kubata nemhando dzakasiyana dzezvikamu zvepakeji seBGA, PBGA, Flip chip, CSP, uye WLCSP.

BGA

BGA, ipfupi kune bhora grid array, imhando yeSMT (Surface Mount Technology) package iri kuwedzera kushandiswa mumaseketi akabatanidzwa (ICs). BGA inobatsira kuvandudzwa kwe solder joint kuvimbika.

BGA inoratidza zvinotevera zvakanakira:

• Kunyatsoshandiswa kwePCB nzvimbo

BGA package inoisa zvinongedzo pasi peSMD (Surface Mount Device) pasuru panzvimbo yekuitenderedza kuitira kuti nzvimbo ichengetedzwe zvakanyanya.

• Kuvandudza maererano nekushanda kwekushisa nemagetsi

Sezvo iyo BGA package inobatsira kudzikisa inductance yesimba uye pasi ndege uye impedance-inodzorwa chiratidzo mitsara, kupisa kunogona kutamiswa kubva padhi, kunobatsira pakupisa kupisa.

• Kuwedzera mukugadzira goho

Nekuda kwekufambira mberi kwekuvimbika kwemutengesi, BGA inogona kuchengetedza nzvimbo yakakura pakati pekubatanidza uye yemhando yepamusoro solder.

• Package ukobvu kuderedza

Isu tine hunyanzvi mukubata yakanaka pitch component assembly uye kusvika parizvino tinogona kubata nemaBGAs ayo madiki anonzwika anogona kuita diki se0.35mm.

Kana iwe ukaisa yakazara-kiyi PCB yekubatanidza odha ine chekuita neBGA package, mainjiniya edu, chekutanga, anotarisa mafaera ako ePCB neBGA dhatabheti kuitira kupfupisa chimiro chekupisa umo zvinhu zvinofanirwa kutariswa sehukuru hweBGA, zvinhu zvebhora zvichingodaro clearance, etc.

Nekuda kwehunhu hweBGA package, Automated Optical Inspection (AOI) inotadza kuzadzisa zvinodiwa pakuongorora. Tinoita ongororo yeBGA neAutomated X-ray Inspection (AXI) michina inokwanisa kuongorora hurema hwekutengesa panguva yekutanga isati yagadzirwa.

PBGA

PBGA, ipfupi kune epurasitiki bhora giridhi array, ndeimwe yeanonyanya kufarirwa mafomu ekurongedza epakati nepamusoro-pamwero I/O zvishandiso. Zvichienderana laminate substrate iyo ine okuwedzera mhangura akaturikidzana mukati, PBGA inobatsira kupisa dissipation uye anogona kugovera hukuru hwomuviri uye nhamba mabhora kuitira kusangana wakafara siyana zvinodiwa.

PBGA inoratidza zvinotevera zvakanakira:

• Inoda yakaderera inductance

• Kuita kuti kukwira kwepamusoro kuve nyore

• Mutengo wakaderera

• Kuchengeta kuvimbika kwakanyanya

• Kuderedza coplanar nyaya

• Kuwana mwero wepamusoro-soro wekupisa nemagetsi

Flip chip

Senzira yekubatanidza magetsi, flip chip inobatanidza kufa uye pasuru substrate nekutarisana zvakananga pasi IC kuitira kuti iite yakanamirwa kune substrate, redunhu bhodhi kana mutakuri. Zvakanakira zveflip chip zvinosanganisira:

• Kuderedza chiratidzo inductance uye simba / pasi inductanc

• Kuderedza nhamba yemapini epasuru uye saizi yefa

• Kuwedzera kusimba kwechiratidzo

CSP uye WLCSP

Kusvika parizvino, CSP ndiyo yazvino fomu yepakeji, ipfupi kune chip scale package. Sezvinoratidzwa nezita rayo, CSP inoreva pasuru ine saizi yakafanana neiyo chip ine hurema maererano nekushama machipisi akabviswa. CSP inopa mhinduro yekurongedza iyo yakaoma uye iri nyore, yakachipa uye nekukurumidza. Uye zvinotevera maficha eCSP anobatsira kutungamira mukuwedzera kwegoho regungano uye yakaderera mutengo wekugadzira.

CSP yakakurumbira uye inoshanda muindasitiri iyi zvekuti kusvika parizvino kune marudzi anopfuura makumi mashanu eCSPs mumhuri yayo uye nhamba ichiri kukura zuva nezuva. Huzhinji hunhu uye maficha eCSP anobatsira mukuzivikanwa kwayo kwakakura munharaunda iyi:

• Kuderedzwa kwehukuru hwepasuru

CSP inogona kuwana mashandiro ekurongedza kusvika pa83% kana kupfuura, kuwedzera zvakanyanya kuwanda kwezvigadzirwa.

• Kuzvigadzirisa

CSP inokwanisa kuzvienzanisa mukuita kwePCB gungano reflow kuitira kuti zviite kuti SMT ive nyore.

• Kushaikwa kwakakombama inotungamira

Pasina kutora chikamu cheakabhenda anotungamira, coplanar nyaya dzinogona kuderedzwa zvakanyanya.

WLCSP, ipfupi yewafer level chip scale package, imhando chaiyo yeCSP sezvo pasuru yayo yapera inoratidza saizi yechip. WLCSP inoreva tekinoroji yekurongedza yeIC padanho rewafer. Mudziyo une WLCSP dhiyabhorosi inorongedzerwa mabhambu kana mabhora ekutengesa panzvimbo yeI/O, ichizadzisa zvinodiwa zvemagadzirirwo egungano redunhu redunhu.

Zvakanakira zveWLCSP zvinonyanya zvinosanganisira:

• Inductance kubva kufa kuenda kuPCB ndiyo idiki;

• Saizi yepakiti yakaderedzwa zvakanyanya nedhigirii density yakavandudzwa;

• Thermal conduction performance inowedzerwa zvakanyanya.

Kusvika parizvino, isu tinokwanisa kubata neWLCSP ine ese ari maviri mashoma Mukati-Die pitch uye Across-Die pitch inogona kusvika 0.35mm.

0201 uye 01005

Sezvo musika wemagetsi uye zvigadzirwa zvichifambira mberi, maitiro ari kukura e miniaturization yenharembozha, malaptop nezvimwe ari kugara achityaira zvinhu zvine madiki madiki. Kuti tiwirirane nemaitiro aya, tanga tichiita nhamburiko dzekuwedzera kugona kwechikamu chegungano kusvika 0201 uye 01005.

Kusvika parizvino, ese ari maviri 0201 uye 01005 ane mukurumbira zvakanyanya mumusika wemagetsi nekuda kwezvinotevera zvakanakira:

• Saizi diki ichiita kuti vagamuchirwe muzvigadzirwa zvekupedzisira-zvisina nzvimbo;

• Kuita kwakanakisa mukusimudzira mashandiro ezvigadzirwa zvemagetsi;

• Inopindirana nepamusoro density zvinodiwa zvemazuva ano zvigadzirwa zvemagetsi;

• Very high-nokukurumidza zvikumbiro.

Kuti tiwane kugona kuungana kwe01005, takabudirira mukubata nezvinhu zvine chekuita negungano rayo zvinosanganisira PCB dhizaini, zvikamu, solder paste, pick nekuisa, reflow, stencil uye kuongorora. Chiitiko chedu chemakore makumi maviri + chinotibatsira kupfupikisa kuti maererano nenyaya dzepashure-kudzokororwa, zvichienzaniswa nezvikamu zvine mamwe marudzi emapakeji, zvikamu zvakaputirwa ne20 zvinoita zvirinani mukubvisa nyaya senge bhiriji, guva, kumira-kumucheto, kumusoro-pasi, chikamu chisipo nezvimwe.

Isu tinokwanisa kubata akasiyana marudzi emapakeji muPCB musangano maitiro uye ndima iri pamusoro inotadza kuratidza ese. Kana fomu rako rinodikanwa repasuru isina kutaurwa pamusoro, ndapota usazeza kutibata pa [email inodzivirirwa] kune yedu yakawedzera pasuru yekubata masimba.