01
Chii chinonzi PCB pamusoro pekurapa maitiro?
Nzvimbo dzemhangura dziri paPCB dzisina chifukidziro chemasiki anosungirirwa, dzakadai semapedhi esimbi, minwe yegoridhe, maburi emakanika, nezvimwewo. Kana pasina chifukidziro chekudzivirira, nzvimbo yemhangura inonyungudika nyore nyore, izvo zvinokanganisa kusungirirwa pakati pemhangura isina chinhu nezvinhu zviri munzvimbo inonyungudika yePCB.
Sezvakaratidzwa mumufananidzo uri pazasi, kugadziriswa kwenzvimbo yacho kuri pamusoro pePCB, pamusoro pemhangura, zvichishanda se "coating" pamusoro pemhangura.
Basa guru rekugadziriswa kwepamusoro nderokudzivirira nzvimbo yakazaruka yemhangura kubva kune oxidation circuits, nokudaro ichipa solderable surface ye soldering panguva yekuputika.
02
Kurongwa kwePCB pamusoro pekurapa maitiro
PCB pamusoro pekurapa maitiro akakamurwa muzvikamu zvinotevera:
Kupisa kwemhepo solder kuyera (HASL)
Kunyudzwa kwemarata (ImSn)
Kemikari nickel goridhe (kunyudza goridhe) (ENIG)
Organic Solderable Preservatives (OSP)
Chemical Silver (ImAg)
Kemikari nickel plating, kemikari palladium plating, kunyudzwa mugoridhe (ENEPIG)
Electrolytic Nickel/Goridhe
Kupisa kwemhepo solder kuyera (HASL)
Hot Air Solder Level (HASL), inozivikanwa sespray tin, inzira yekurapa pamusoro pemvura inonyanya kushandiswa uye isingadhuri. Yakakamurwa kuita spray tin isina lead uye spray tin ine lead.
Hupenyu hwesherufu hwePCB hunogona kusvika kumwedzi gumi nemiviri, iine tembiricha ye12 ℃ uye ukobvu hwekurapa hwepamusoro hwe250-1um.
Maitiro ekupfapfaidza tin anosanganisira kunyudza circuit board mu molded solder (tin/lead) kuti ifukidze copper surface iri paPCB. Kana PCB yabuda mu mold yakanyunguduka, mhepo inopisa ine simba rakawanda inovhuvhuta pamusoro nebanga remhepo, zvichiita kuti mold iparare zvakanaka uye ichibvisa mold yakawanda.
Maitiro ekupfapfaidza netini anoda kugona tembiricha yekuwelda, tembiricha yebanga, kumanikidzwa kwebanga, nguva yekuwelda yekunyudza, kumhanya kwekusimudza, nezvimwewo. Iva nechokwadi chekuti PCB yanyura zvizere musolder yakanyunguduka, uye banga remhepo rinogona kuputitsa solder risati raoma. Kumanikidzwa kwebanga remhepo kunogona kuderedza meniscus pamusoro pemhangura uye kudzivirira solder bridging.
Kupisa kwemhepo solder kuyera (HASL)
mukana:
Hurefu hwesherufu
Weldability yakanaka
Corrosion uye oxidation kuramba
Kuongorora kwekuona kunogoneka
payakaipira:
Kusaenzana kwepamusoro
Haikodzeri midziyo ine nzvimbo diki
Zviri nyore kugadzira marata
Deformation inokonzerwa nekupisa kwakanyanya
Haina kukodzera electroplating kuburikidza nemakomba
Kunyudzwa kwemarata (ImSn)
Kunyudzwa Tin (ImSn) isimbi yakanyungudutswa kuburikidza nekemikari displacement reaction, inoiswa zvakananga kune base simbi (kureva mhangura) yedare redunhu, iyo inogona kusangana nezvinodiwa zvediki diki zvikamu zvePCB pamusoro flatness.
Kuisa tin kunogona kudzivirira mhangura iri pasi kubva mukuoxidation mukati memwedzi mitatu kusvika mitanhatu. Sezvo solder yese yakavakirwa patin, tin deposition layer inogona kuenderana nechero rudzi rwesolder. Mushure mekuwedzera organic additives ku tin immersion solution, chimiro chetin layer chinova granular, ichikunda matambudziko anokonzerwa ne tin whiskers uye tin facilitation, ukuwo iine kugadzikana kwakanaka kwekupisa uye weldability.
Tembiricha yekuisa tin deposition process i50 ℃, uye ukobvu hwekurapa kwepamusoro i0.8-1.2um. PCB iyo inonyanya kukodzera kubatana kuburikidza necrimping, senge kutaurirana backboards.
Kunyudzwa kwemarata (ImSn)
mukana:
Inokodzera diki spacing/BGA
Kutsvedzerera kwepamusoro
Inoenderana neRoHS
Weldability yakanaka
Kuramba kwakanaka
payakaipira:
Zviri nyore kusvibiswa
Ndebvu dzemarata dzinogona kukonzera maseketi mapfupi
Kuongororwa kwemagetsi kunoda maprobe akapfava
Haikodzeri mabatiro ekubata
Corrosive kune solder mask layer
Kemikari nickel goridhe (kunyudza goridhe) (ENIG)
Kemikari Nickel Immersion Goridhe (ENIG) inogona kusangana nekudzikama kwepasi uye kutungamirira-isina kugadzirisa zvinodiwa zvePCB kune zvidiki zvepitch zvishandiso (BGA uye μ BGA).
ENIG ine zvikamu zviviri zvesimbi, ine nickel yakaiswa pamusoro pemhangura kuburikidza nemaitiro emakemikari uye yozoputirwa nemaatomu egoridhe kuburikidza nekuchinjana kwekuchinjana. Ukobvu hwenickel i3-6 μ m, uye ukobvu hwegoridhe i0.05-0.1 μ m. Nickel inoshanda sechipingamupinyi kumhangura uye ndiyo nzvimbo iyo zvikamu zvinosungirirwa. Basa regoridhe nderekudzivirira nickel oxidation panguva yekuchengetwa, nehupenyu hwesherufu hweinenge gore rimwe, uye inogona kuve nechokwadi chekuti pamusoro payo pakanaka.
Iyo yekunyudza goridhe process inoshandiswa zvakanyanya mumabhodhi e-high-density, akajairwa mabhodhi akaomarara, uye mabhodhi akapfava, ane kuvimbika kwakanyanya uye kutsigirwa kwewaya bonding uchishandisa aluminium waya. Inoshandiswa zvakanyanya mumaindasitiri akadai sevatengi, kutaurirana / komputa, aerospace, uye hutano hwehutano.
Chemical Nickel Goridhe (ENIG)
mukana:
Hurefu hwesherufu
High density board (μ BGA)
Aluminium wire bonding
High surface flatness
Inokodzera maburi e electroplating
payakaipira:
mutengo unodhura
Attenuation yeRF masaini
Haikwanise kushanda zvakare
Dema pad/black nickel
Nzira yekugadzirisa yakaoma
Organic Solderable Preservatives (OSP)
Organic Solderability Preservatives (OSP) zvinhu zvitete zvakatetepa zvinodzivirira zvakaiswa kune yakafumurwa mhangura kudzivirira pamusoro pemhangura kubva mukusvibiswa.
Mafirimu eorganic ane hunhu hwakadai sekudzivirira oxidation, kudzivirira kupisa, uye kudzivirira hunyoro, izvo zvinogona kudzivirira pamusoro pemhangura kubva kuoxidation kana sulfurization mumamiriro ezvinhu akajairwa. Mukugadzirisa kwekushongedza mushure mekudziya tembiricha yakakwira, firimu reorganic rinobviswa nyore nyore neflux, zvichiita kuti pamusoro pemhangura yakachena yakaratidzwa ibatane nekunyunguduka kwakanyunguduka , zvichiita kuti solder joint yakasimba munguva pfupi.
OSP imvura-yakavakirwa organic komboni inogona kusarudza kusunga nemhangura kudzivirira pamusoro pemhangura isati yatungirwa. Kuenzaniswa nemamwe maitirwo ekurapa-emahara epasi, ane hushamwari zvakanyanya kwezvakatipoteredza nekuti mamwe maitiro ekurapa epamusoro anogona kunge aine chepfu kana kushandiswa kwesimba kwakanyanya.
Organic Solderable Preservatives (OSP)
mukana:
Zviri nyore uye zvakachipa
Tungamira mahara kuchengetedza kwezvakatipoteredza
Smooth surface
Kusunga waya
payakaipira:
Haina kukodzera PTH
Hupenyu hupfupi hwesherufu
Hazvina nyore pakuona uye kuongorora magetsi
ICT zvigadziriso zvinogona kukanganisa PCB
Chemical Silver (ImAg)
Kunyudzwa sirivheri (ImAg) inzira yekuisa yakananga mhangura ine chidimbu chesirivheri yakachena nekunyudza PCB mubhati resirivheri ion kuburikidza nekusimuka. Sirivha ine zvinhu zvakagadzikana zvemakemikari. PCB yakagadziridzwa kuburikidza nesirivheri kunyudzwa tekinoroji inogona kuchengetedza yakanaka magetsi uye solderability kunyangwe ichiiswa munzvimbo dzinopisa, dzine hunyoro, uye dzakasvibiswa, uye kunyangwe nzvimbo yacho ikarasikirwa nekupenya kwayo.
Dzimwe nguva, kudzivirira sirivheri kuti isaita nemasarufidhi munzvimbo, sirivheri deposition inosanganiswa neOSP coating. Kune akawanda maapplication, sirivha inogona kutsiva goridhe. Kana iwe usingade kuunza magineti zvinhu (nickel) muPCB, unogona kusarudza kushandisa sirivheri deposition.
Ukobvu hwepamusoro hweSilver deposition ndeye 0.12-0.40 μ m, uye hupenyu hwesherufu ndeye 6 kusvika 12 mwedzi. Sirivha yekuisa dhizaini inotarisisa kuchena kwepasi panguva yekugadziriswa, uye zvinodikanwa kuve nechokwadi kuti iyo yese yekugadzira maitiro haikonzere kusvibiswa kwepasi pekuisa sirivheri. Iyo sirivheri deposition process inokodzera maapplication akadai sePCB, matete-firimu switch, uye aluminium waya yekubatanidza inoda EMI kudzivirira.
Sirivha Inonyura (ImAg)
mukana:
Kunaka kwepamusoro flatness
High weldability
Kuramba kwakanaka
Kuita kwakanaka kwekudzivirira
Inokodzera aluminium wire bonding
payakaipira:
Inonzwa kune zvinosvibisa
Zviri nyore kuita electromigration
Ndebvu dzesimbi dzesirivha
Iwindo regungano pfupi mushure mekuburitsa
Kuoma mukuedza kwemagetsi
Kemikari nickel plating, kemikari palladium plating, kunyudzwa mugoridhe (ENEPIG)
Kana tichienzanisa neENIG, ENEPIG ine imwe layer ye palladium pakati pe nickel negoridhe, iyo inodzivirira nickel layer kubva mukuora uye inodzivirira ma black pads anogona kuwanikwa panguva ye ENIG surface treatment, nokudaro ichipa mukana wekutsvedzerera pamusoro. Ukobvu hwe nickel hwakaita 3-6 μ m, ukobvu hwe palladium hunenge 0.1-0.5 μ m, uye ukobvu hwegoridhe hunenge 0.02-0.1 μ m. Kunyangwe ukobvu hwe layer yegoridhe hwakatetepa kupfuura ENIG, hunodhura zvakanyanya.
Iyo dhizaini yemhangura nickel palladium goridhe inogona kuve yakananga waya yakasungirirwa kune yeplating layer. Iyo yekupedzisira yegoridhe yakatetepa uye yakapfava, uye yakanyanyisa kukuvara kwemuchina kana kukwenya kwakadzika kunogona kuburitsa palladium layer.
Kemikari nickel plating, kemikari palladium plating, kunyudzwa mugoridhe (ENEPIG)
mukana:
Yakanyanya sandarara pamusoro
Kusunga waya
Inogona kudzoserwa kutengeswa kakawanda
Kuvimbika kwakanyanya kwemasoja majoini
Hurefu hwesherufu
payakaipira:
mutengo unodhura
Gold wire bonding haina kuvimbika sekubatana kwegoridhe rakapfava
Zviri nyore kugadzira marata
Complex process
Zvakaoma kudzora maitiro ekugadzirisa
Electrolytic Nickel/Goridhe
Electroplated nickel gold yakakamurwa kuita "hard gold" uye "soft gold".
Ndarama yakaoma haina kuchena kwakawanda (99.6%) uye inowanzoshandiswa paminwe yegoridhe (PCB edge connectors) , PCB contacts, kana dzimwe nzvimbo dzakaoma kupfekwa. Ukobvu hwendarama hunogona kusiyana zvichienderana nezvinodiwa.
Goridhe rakapfava rakachena (99.9%) uye rinowanzo shandiswa pakubatanidza waya.
Hard electrolytic goridhe
Ndarama yakaoma isimbi yegoridhe ine cobalt, nickel, kana iron complexes. Low stress nickel inoshandiswa pakati pegoridhe plating nemhangura. Ndarama yakaoma inokodzera zvinhu zvinogara zvichishandiswa uye zvinonyanya kusakara, semabhodhi ekutakura, zvigunwe zvegoridhe, uye makiyi mapedhi.
Ukobvu hwegoridhe rakaomarara pamusoro pekurapa hunogona kusiyana zvichienderana nekushandiswa. Ukobvu hunoyemurika hunogoneka hweIPC i17.8 μ mukati, 25 μ mugoridhe uye 100 μ nickel yeIPC1 neClass 2 application, uye 50 μ mugoridhe uye 100 μ nickel yeIPC3 application.
Soft electrolytic gold
Inonyanya kushandiswa kuPCB inoda kusungirirwa kwewaya uye yakanyanya solderability, majoini akapfava egoridhe akachengetedzwa zvakanyanya kana achienzaniswa negoridhe rakaomarara.
Soft electrolytic goridhe pamusoro kurapwa
Electrolytic Nickel/Goridhe
mukana:
Hurefu hwesherufu
Kuvimbika kwakanyanya kwemasoja majoini
Durable surface
payakaipira:
Zvinodhura zvakanyanya
Chigunwe chegoridhe chinoda kuwedzera conductive wiring pabhodhi
Ndarama yakaoma ine weldability isina kunaka
03
Nzira yekusarudza PCB pamusoro pekurapa maitiro?
Maitiro ekugadzirisa pamusoro pePCB anokanganisa zvakananga kubuda, huwandu hwekugadzirisa patsva , mwero wekukundikana panzvimbo, kugona kuyedza, uye mwero wezvakaraswa. Kuti chigadzirwa chekupedzisira chive chemhando yepamusoro uye chishande zvakanaka, zvakakosha kusarudza maitiro ekugadzirisa pamusoro anoenderana nezvinodiwa zvekugadzira. Muinjiniya, maonero anotevera anogona kutariswa:
Pad flatness
Iyo flatness ye solder pads inokanganisa zvakananga kunaka kwekutengesa kwePCBA, kunyanya kana paine BGA yakakura kana diki diki μ BGA pabhodhi, ENIG, ENEPIG, uye OSP inogona kusarudzwa kana iyo inodzivirira layer pane solder pad pedhi inoda kuve mutete uye yunifomu.
Solderability uye Wettability
Solderability inogara iri chinhu chakakosha chePCB. Paunenge uchisangana nezvimwe zvinodiwa, zvinokurudzirwa kusarudza nzira yekurapa yepamusoro ine solderability yakakwira kuti ive nechokwadi chegoho reflow soldering.
Welding frequency
Ko PCB inoda kutengeswa kangani kana kugadzirwazve? Iyo yepamusoro yekurapa maitiro eOSP haina kukodzera kuti ishandezve kanopfuura kaviri. Panguva ino, nzira dzakabatanidzwa dzepamusoro dzekurapa senge kunyudza goridhe + OSP dzichasarudzwawo. Parizvino, zvigadzirwa zvepamusoro zvemagetsi zvakaita sema smartphones zvichasarudza iyi nzira yekurapa.
RoHS kutevedzera
Chinhu chikuru muPCBA chinobva kumapini ezvikamu, maPCB pads, uye solder. Kuti zvienderane nemitemo yeROHS, nzira yekurapa pamusoro pePCB inofanirawo kutevedzera mitemo yeROHS. Semuenzaniso, ENIG, tin, silver, uye OSP zvese zvinoenderana nemitemo yeROHS.
Metal bonding
Kana goridhe kana aluminium waya yekubatanidza ichidikanwa, inogona kungogumira kuENIG, ENEPIG, uye yakapfava electrolytic goridhe.
Kuvimbika kwemajoini e solder
Maitiro ekugadzirisa pamusoro pePCB anogonawo kukanganisa kunaka kwePCBA pakusungirirwa kwesimbi . Kana majoini esimbi akavimbika zvakanyanya achidikanwa, kushandiswa kwegoridhe rakanyikwa kana nickel palladium gold maitiro kunogona kusarudzwa.
