01
Chii chinonzi PCB pamusoro pekurapa maitiro?
Mhangura pamusoro PCB pasina solder mask coverage, zvakadai solder pads, minwe yegoridhe, maburi emagetsi, etc. Kana pasina kuvhara kwekudzivirira, nzvimbo yemhangura iri nyore oxidized, iyo inokanganisa kutengesa pakati pemhangura isina chinhu uye zvikamu munzvimbo inotengeswa yePCB.
Sezvinoratidzwa mumufananidzo uri pasi apa, iyo Pamusoro kurapwa kunowanikwa pamucheto wekunze wePCB, pamusoro pemhangura yemhangura, kushanda se "kupfeka" pamusoro pemhangura.
Basa guru rekugadziriswa kwepamusoro nderokudzivirira nzvimbo yakazaruka yemhangura kubva kune oxidation circuits, nokudaro ichipa solderable surface ye soldering panguva yekuputika.
02
Kurongwa kwePCB pamusoro pekurapa maitiro
PCB pamusoro pekurapa maitiro akakamurwa muzvikamu zvinotevera:
Kupisa kwemhepo solder kuyera (HASL)
Kunyudzwa kwemarata (ImSn)
Kemikari nickel goridhe (kunyudza goridhe) (ENIG)
Organic Solderable Preservatives (OSP)
Chemical Silver (ImAg)
Kemikari nickel plating, kemikari palladium plating, kunyudzwa mugoridhe (ENEPIG)
Electrolytic Nickel/Goridhe
Kupisa kwemhepo solder kuyera (HASL)
Kupisa Mhepo Solder Level (HASL), inowanzozivikanwa sespray tin, inzira yekurapa pamusoro iyo inonyanya kushandiswa uye isingadhure. Yakakamurwa kuita kutungamira-kusununguka pfapfaidza tin nelead spray tin.
Hupenyu hwesherufu hwePCB hunogona kusvika kumwedzi gumi nemiviri, iine tembiricha ye12 ℃ uye ukobvu hwekurapa hwepamusoro hwe250-1um.
Kupfapfaidza kwerata kunosanganisira kunyudza bhodhi redunhu mune yakanyungudutswa kugadzirisa (tin/lead) kuvhara nzvimbo yakafumurwa yemhangura paPCB. Kana iyo PCB ichisiya solder yakanyungudutswa, mhepo inopisa-yakanyanya-inopisa inovhuvhuta nepamusoro pedenga nebanga remhepo, zvichiita kuti solder iise flat uye kubvisa yakawandisa solder.
Iyo nzira yekupfapfaidza nemarata inoda hunyanzvi hwekupisa tembiricha, blade tembiricha, blade pressure, kunyudza welding nguva, kusimudza kumhanya, etc. Iva nechokwadi chekuti PCB yakanyura zvachose musolder yakanyungudutswa, uye banga remhepo rinogona kuputika solder risati raoma. Kudzvinyirirwa kwebanga remhepo kunogona kuderedza meniscus pane pamusoro pemhangura uye kudzivirira solder bridge.
Kupisa kwemhepo solder kuyera (HASL)
mukana:
Hurefu hwesherufu
Weldability yakanaka
Corrosion uye oxidation kuramba
Kuongorora kwekuona kunogoneka
payakaipira:
Kusaenzana kwepamusoro
Haikodzeri midziyo ine nzvimbo diki
Zviri nyore kugadzira marata
Deformation inokonzerwa nekupisa kwakanyanya
Haina kukodzera electroplating kuburikidza nemakomba
Kunyudzwa kwemarata (ImSn)
Kunyudzwa Tin (ImSn) isimbi yakanyungudutswa kuburikidza nekemikari displacement reaction, inoiswa zvakananga kune base simbi (kureva mhangura) yedare redunhu, iyo inogona kusangana nezvinodiwa zvediki diki zvikamu zvePCB pamusoro flatness.
Tin deposition inogona kuchengetedza iri pasi pemhangura kubva kune oxidation mukati memwedzi 3-6 pasherufu yehupenyu. Sezvo ese solder ari tin based, tin deposition layer inogona kuenderana chero mhando ye solder. Mushure mekuwedzera organic additives kune tin kunyudza mhinduro, iyo tin layer inova granular, ichikunda matambudziko anokonzerwa nemarata uye kutama kwerata, ukuwo uine. yakanaka yekupisa kugadzikana uye weldability.
Tembiricha yekuisa tin deposition process i50 ℃, uye ukobvu hwekurapa kwepamusoro i0.8-1.2um. PCB iyo inonyanya kukodzera kubatana kuburikidza necrimping, senge kutaurirana backboards.
Kunyudzwa kwemarata (ImSn)
mukana:
Inokodzera diki spacing/BGA
Kutsvedzerera kwepamusoro
Inoenderana neRoHS
Weldability yakanaka
Kuramba kwakanaka
payakaipira:
Zviri nyore kusvibiswa
Ndebvu dzemarata dzinogona kukonzera maseketi mapfupi
Kuongororwa kwemagetsi kunoda maprobe akapfava
Haikodzeri mabatiro ekubata
Corrosive kune solder mask layer
Kemikari nickel goridhe (kunyudza goridhe) (ENIG)
Kemikari Nickel Immersion Goridhe (ENIG) inogona kusangana nekudzikama kwepasi uye kutungamirira-isina kugadzirisa zvinodiwa zvePCB kune zvidiki zvepitch zvishandiso (BGA uye μ BGA).
ENIG ine maviri akaturikidzana esimbi, ine nickel inoiswa pamusoro pemhangura kuburikidza nemakemikari maitirwo uye yobva yaputirwa nemaatomu egoridhe kuburikidza nekuchinja-chinja. Ukobvu hwe nickel ndeye 3-6 μ m, uye ukobvu hwegoridhe 0.05-0.1 μ m. Nickel inoshanda sechipinganidzo kumhangura uye ndiyo nzvimbo iyo zvikamu zvinotengeswa. Basa regoridhe nderekudzivirira nickel oxidation panguva yekuchengetedza, nehupenyu hwesherufu hunosvika gore rimwe, uye inogona kuve nechokwadi. yakanakisa pamusoro flatness.
Iyo yekunyudza goridhe process inoshandiswa zvakanyanya mumabhodhi e-high-density, akajairwa mabhodhi akaomarara, uye mabhodhi akapfava, ane kuvimbika kwakanyanya uye kutsigirwa kwewaya bonding uchishandisa aluminium waya. Inoshandiswa zvakanyanya mumaindasitiri akadai sevatengi, kutaurirana / komputa, aerospace, uye hutano hwehutano.
Chemical Nickel Goridhe (ENIG)
mukana:
Hurefu hwesherufu
High density board (μ BGA)
Aluminium wire bonding
High surface flatness
Inokodzera maburi e electroplating
payakaipira:
mutengo unodhura
Attenuation yeRF masaini
Haikwanise kushanda zvakare
Dema pad/black nickel
Nzira yekugadzirisa yakaoma
Organic Solderable Preservatives (OSP)
Organic Solderability Preservatives (OSP) zvinhu zvitete zvakatetepa zvinodzivirira zvakaiswa kune yakafumurwa mhangura kudzivirira pamusoro pemhangura kubva mukusvibiswa.
Organic mafirimu ane hunhu hwakadai seoxidation resistance, thermal shock resistance, uye mwando kuramba, izvo zvinogona kudzivirira nzvimbo dzemhangura kubva kuoxidation kana sulfurization pasi pemamiriro akajairwa. Muchinzvimbo chepamusoro tembiricha welding process, iyo organic firimu inobviswa nyore nyore nekuyerera, zvichiita kuti iyo yakafumurwa yakachena mhangura nzvimbo kuti ibatane nekukurumidza neyakanyungudutswa. kugadzirisa, kugadzira mubatanidzwa wakasimba we solder munguva pfupi kwazvo.
OSP imvura-yakavakirwa organic komboni inogona kusarudza kusunga nemhangura kudzivirira pamusoro pemhangura isati yatungirwa. Kuenzaniswa nemamwe maitirwo ekurapa-emahara epasi, ane hushamwari zvakanyanya kwezvakatipoteredza nekuti mamwe maitiro ekurapa epamusoro anogona kunge aine chepfu kana kushandiswa kwesimba kwakanyanya.
Organic Solderable Preservatives (OSP)
mukana:
Zviri nyore uye zvakachipa
Tungamira mahara kuchengetedza kwezvakatipoteredza
Smooth surface
Kusunga waya
payakaipira:
Haina kukodzera PTH
Hupenyu hupfupi hwesherufu
Hazvina nyore pakuona uye kuongorora magetsi
ICT zvigadziriso zvinogona kukanganisa PCB
Chemical Silver (ImAg)
Kunyudzwa sirivheri (ImAg) inzira yekuisa yakananga mhangura ine chidimbu chesirivheri yakachena nekunyudza PCB mubhati resirivheri ion kuburikidza nekusimuka. Sirivha ine zvinhu zvakagadzikana zvemakemikari. PCB yakagadziridzwa kuburikidza nesirivheri kunyudzwa tekinoroji inogona kuchengetedza yakanaka magetsi uye solderability kunyangwe ichiiswa munzvimbo dzinopisa, dzine hunyoro, uye dzakasvibiswa, uye kunyangwe nzvimbo yacho ikarasikirwa nekupenya kwayo.
Dzimwe nguva, kudzivirira sirivheri kuti isaita nemasarufidhi munzvimbo, sirivheri deposition inosanganiswa neOSP coating. Kune akawanda maapplication, sirivha inogona kutsiva goridhe. Kana iwe usingade kuunza magineti zvinhu (nickel) muPCB, unogona kusarudza kushandisa sirivheri deposition.
Ukobvu hwepamusoro hweSilver deposition ndeye 0.12-0.40 μ m, uye hupenyu hwesherufu ndeye 6 kusvika 12 mwedzi. Sirivha yekuisa dhizaini inotarisisa kuchena kwepasi panguva yekugadziriswa, uye zvinodikanwa kuve nechokwadi kuti iyo yese yekugadzira maitiro haikonzere kusvibiswa kwepasi pekuisa sirivheri. Iyo sirivheri deposition process inokodzera maapplication akadai sePCB, matete-firimu switch, uye aluminium waya yekubatanidza inoda EMI kudzivirira.
Sirivha Inonyura (ImAg)
mukana:
Kunaka kwepamusoro flatness
High weldability
Kuramba kwakanaka
Kuita kwakanaka kwekudzivirira
Inokodzera aluminium wire bonding
payakaipira:
Inonzwa kune zvinosvibisa
Zviri nyore kuita electromigration
Ndebvu dzesimbi dzesirivha
Iwindo regungano pfupi mushure mekuburitsa
Kuoma mukuedza kwemagetsi
Kemikari nickel plating, kemikari palladium plating, kunyudzwa mugoridhe (ENEPIG)
Kana ichienzaniswa ne ENIG, ENEPIG ine imwezve palladium pakati penickel negoridhe, iyo inodzivirirazve nickel layer kubva mukuora uye inodzivirira inogona kuitika mapedhi matema panguva ye ENIG yekurapwa kwepamusoro, nekudaro ichipa mukana mukutsvedzereka kwepamusoro. Ukobvu hwekuisa nickel hunosvika 3-6 μ m, ukobvu hwepalladium hunosvika 0.1-0.5 μ m, uye ukobvu hwegoridhe 0.02-0.1 μ m. Kunyangwe ukobvu hwe goridhe layer yakatetepa kupfuura ENIG, inodhura zvakanyanya.
Iyo dhizaini yemhangura nickel palladium goridhe inogona kuve yakananga waya yakasungirirwa kune yeplating layer. Iyo yekupedzisira yegoridhe yakatetepa uye yakapfava, uye yakanyanyisa kukuvara kwemuchina kana kukwenya kwakadzika kunogona kuburitsa palladium layer.
Kemikari nickel plating, kemikari palladium plating, kunyudzwa mugoridhe (ENEPIG)
mukana:
Yakanyanya sandarara pamusoro
Kusunga waya
Inogona kudzoserwa kutengeswa kakawanda
Kuvimbika kwakanyanya kwemasoja majoini
Hurefu hwesherufu
payakaipira:
mutengo unodhura
Gold wire bonding haina kuvimbika sekubatana kwegoridhe rakapfava
Zviri nyore kugadzira marata
Complex process
Zvakaoma kudzora maitiro ekugadzirisa
Electrolytic Nickel/Goridhe
Electroplated nickel gold yakakamurwa kuita "hard gold" uye "soft gold".
Goridhe rakaomarara rine kuchena kwakaderera (99.6%) uye rinowanzo shandiswa kuita zvigunwe zvegoridhe (PCB edge connectors), PCB contacts, kana dzimwe nzvimbo dzakaoma kupfeka. Ukobvu hwegoridhe hunogona kusiyana zvichienderana nezvinodiwa.
Goridhe rakapfava rakachena (99.9%) uye rinowanzo shandiswa pakubatanidza waya.
Hard electrolytic goridhe
Ndarama yakaoma isimbi yegoridhe ine cobalt, nickel, kana iron complexes. Low stress nickel inoshandiswa pakati pegoridhe plating nemhangura. Ndarama yakaoma inokodzera zvinhu zvinogara zvichishandiswa uye zvinonyanya kusakara, semabhodhi ekutakura, zvigunwe zvegoridhe, uye makiyi mapedhi.
Ukobvu hwegoridhe rakaomarara pamusoro pekurapa hunogona kusiyana zvichienderana nekushandiswa. Ukobvu hunoyemurika hunogoneka hweIPC i17.8 μ mukati, 25 μ mugoridhe uye 100 μ nickel yeIPC1 neClass 2 application, uye 50 μ mugoridhe uye 100 μ nickel yeIPC3 application.
Soft electrolytic gold
Inonyanya kushandiswa kuPCB inoda kusungirirwa kwewaya uye yakanyanya solderability, majoini akapfava egoridhe akachengetedzwa zvakanyanya kana achienzaniswa negoridhe rakaomarara.
Soft electrolytic goridhe pamusoro kurapwa
Electrolytic Nickel/Goridhe
mukana:
Hurefu hwesherufu
Kuvimbika kwakanyanya kwemasoja majoini
Durable surface
payakaipira:
Zvinodhura zvakanyanya
Chigunwe chegoridhe chinoda kuwedzera conductive wiring pabhodhi
Ndarama yakaoma ine weldability isina kunaka
03
Nzira yekusarudza PCB pamusoro pekurapa maitiro?
Iyo yepamusoro kurapwa maitiro ePCB ichakanganisa zvakananga kubuda, rework uwandu, pa-saiti yekutadza chiyero, kugona kuyedza, uye chiyero chezvikara. Nokuda kwehutano uye kushanda kwechigadzirwa chekupedzisira, zvakakosha kusarudza nzira yekurapa yepamusoro inosangana nezvinodiwa zvekugadzira. Muinjiniya, maonero anotevera anogona kutariswa:
Pad flatness
Iyo flatness ye solder pads inokanganisa zvakananga kunaka kwekutengesa kwePCBA, kunyanya kana paine BGA yakakura kana diki diki μ BGA pabhodhi, ENIG, ENEPIG, uye OSP inogona kusarudzwa kana iyo inodzivirira layer pane solder pad pedhi inoda kuve mutete uye yunifomu.
Solderability uye Wettability
Solderability inogara iri chinhu chakakosha chePCB. Paunenge uchisangana nezvimwe zvinodiwa, zvinokurudzirwa kusarudza nzira yekurapa yepamusoro ine solderability yakakwira kuti ive nechokwadi chegoho reflow soldering.
Welding frequency
Ko PCB inoda kutengeswa kangani kana kugadzirwazve? Iyo yepamusoro yekurapa maitiro eOSP haina kukodzera kuti ishandezve kanopfuura kaviri. Panguva ino, nzira dzakabatanidzwa dzepamusoro dzekurapa senge kunyudza goridhe + OSP dzichasarudzwawo. Parizvino, zvigadzirwa zvepamusoro zvemagetsi zvakaita sema smartphones zvichasarudza iyi nzira yekurapa.
RoHS kutevedzera
Iyo inotungamira element muPCBA inonyanya kuuya kubva kuchikamu pini, PCB pads, uye solder. Kuti utevedze mirau yeROHS, nzira yekurapa yepamusoro yePCB inofanirwawo kutevedzera ROHS zviyero. Semuenzaniso, ENIG, tin, sirivheri, uye OSP zvese zvinoenderana neROHS mwero.
Metal bonding
Kana goridhe kana aluminium waya yekubatanidza ichidikanwa, inogona kungogumira kuENIG, ENEPIG, uye yakapfava electrolytic goridhe.
Kuvimbika kwemajoini e solder
Iyo yepamusoro kurapwa maitiro ePCB inogona zvakare kukanganisa yekupedzisira soldering mhando yePCBA. Kana yakakwirira kuvimbika solder majoini achidikanwa, kushandiswa kwekunyudza goridhe kana nickel palladium goridhe process inogona kusarudzwa.
