Chii chinonzi PCB Fabrication process?

Semutakuri wezvinhu zvemagetsi, PCB inoita basa rakakosha muindasitiri yekugadzira zvemagetsi. Nzira yekugadzira yaro yakaoma uye yakarurama, inobata zvakananga kushanda uye kunaka kwechigadzirwa chekupedzisira. WonderfulPCB, fekitori inovimbwa neSMT yekugadzirisa, inopa ongororo yakadzama yePCB kugadzira maitiro kubatsira vagadziri vemagetsi uye zvikwata zvinotenga zvinhu kuti zvinzwisise zviri nani.

Pfupiso yePCB Kugadzira Maitiro

Iyo PCB yekugadzira maitiro inogona kukamurwa kuita akati wandei matanho akakosha: yemukati dhizaini kugadzirwa, lamination, kuchera, metallization, yekunze dhizaini yekugadzira, kudzivirira kwepamusoro, uye yekupedzisira kuongorora uye kurongedza. Nhanho imwe neimwe inosanganisira hunyanzvi hwakasiyana uye matekinoroji, zvinoda mwero wepamusoro uye hunyanzvi.

Inner Layer Fabrication

Iwo mukati memukati ndiwo musimboti wePCB, inobatanidza zvinhu zvemagetsi. Iyo nzira inosanganisira:

Board Cutting: Kucheka iyo yekutanga PCB substrate kune inodiwa saizi yekugadzira.
Pre-kurapwa: Kuchenesa iyo substrate pamusoro kubvisa mafuta, okisidhi, uye zvimwe zvinosvibisa, kuve nechokwadi kufambira mberi kwakanaka mumatanho anotevera.
Nyoni: Kushandisa chidimbu chefirimu yakaoma kune substrate's surface, iyo ichaendesa dhigirii yedunhu panguva yekuratidzwa.
Kuchengetedza: Kushandisa ultraviolet mwenje kufumura bhodhi laminated, kuendesa rakagadzirwa redunhu pateni pane yakaoma firimu.
Kugadzira, Etching, uye Kubvisa: Kubvisa nzvimbo dzisina kuvharwa dzefirimu yakaoma kuburikidza nekuvandudzwa, uye kuvhara kunze kwemhangura yemhangura isina kudzivirirwa, uye pakupedzisira kubvisa iyo yakasara yakaoma firimu kuti iite mutsara wemukati wedunhu.
AOI (Otomatiki Optical Inspection): Kutarisa kunaka kweyemukati layer yedunhu kuona kuti hapana akavhurika maseketi, mapfupi, kana zvimwe zvirema.

Nyoni

Lamination inosanganisa akawanda emukati akaturikidzana kuita imwe multilayer board uchishandisa resin zvinhu. Danho iri rakakosha multilayer PCBs, uye maitiro anosanganisira:

Brown oxide: Kuwedzera kunamatira pakati pezvikamu uye kugadzirisa kunyorova kwemhangura.
Stacking: Kuisa masekete emukati uye PP (Prepreg) mapepa zvinoenderana nezvinodiwa zvekugadzira.
Kudzvinyirira: Kushandisa tembiricha yakakwira uye kudzvanywa kwekubatanidza maseru mune imwechete multilayer board.
Target Drilling, Routing, uye Edge Grinding: Kucheka bhodhi laminated kuti ubvise zvinhu zvakawandisa uye uwane zviyero zvekugadzira.

Drilling

Kuchera kunodiwa kugadzira kuburikidza nemakomba kana mapofu maburi ekubatanidza magetsi uye kuiswa kwechikamu. Iyo nzira inosanganisira:

Drilling: Kushandisa muchina wekuchera kugadzira makomba zvinoenderana nemaitiro ekugadzira.
Deburring: Kubvisa maburrs akaumbwa panguva yekuchera kuti ave nechokwadi chegomba rakatsetseka madziro.

Gomba Metallization

Munhanho iyi, chidimbu chitete chemhangura chinoiswa pamadziro egomba rekudzivirira kugadzira hwaro hwekuita kuti huwedzere kuputirwa nemhangura. Iyo nzira inosanganisira:

PTH (Yakapfekwa Neburi) Copper Deposition: Kemikari kuisa ndarira yemhangura pamadziro egomba.
Gomba Kuzadza: Kuisa mhangura mukati memakomba kugadzira yakakwana conductive nzira.

Outer Layer Fabrication

Iyo yekunze dhizaini yekugadzira yakafanana neyemukati machira asi yakanyanya kuomesesa, sezvo inosanganisira kuumba dhizaini pateni pane ekunze machira. multilayer pcb. Matanho acho anosanganisira:

Outer Layer Pre-kurapwa: Kuchenesa nzvimbo yekunze kubvisa tsvina.
Lamination, Exposure, uye Kuvandudza: Kugadzira iyo yekunze layer yedunhu pateni nelamination, exposure, uye kusimudzira, yakafanana neyemukati layer process.
Pattern Plating: Electroplating mhangura pane redunhu pateni kuti ukobvu maronda.
Kukurura, Etching, uye Kubvisa Tin: Kubvisa firimu rakaoma, kubvisa mhangura isina kudzivirirwa, uye kubvisa tin layer kuratidza yekupedzisira yekunze layer yedunhu.

Surface Protection

Kudzivirirwa kwepamusoro kunodzivirira oxidation uye corrosion yedunhu uku uchivandudza solderability. Matanho acho anosanganisira:

Solder Mask: Kuisa chidimbu chepikicha-sensitive solder mask inki, inoteverwa nekufumurwa uye kugadzira kuumba solder mask inodzivirira dunhu kubva pakusodha.
Surface Kurapa: Nzira dzakaita se electroless nickel / kunyudza goridhe (ENIG) dzinoshandiswa kuwedzera solderability uye kusaita ngura.
Silkscreen Printing: Kudhinda zvinyorwa uye zvitupa zviratidzo pabhodhi kuti zvive nyore kuunganidza uye kugadzirisa.

Kuongorora Kwekupedzisira uye Packaging

Kuongorora kwekupedzisira kunovimbisa kunaka kwePCB, kusanganisira kuongorora kweAOI, kuongorora kuongorora kubhururuka, uye kuona kuti hapana zvikabudura kana kuvhura. Kana mabhodhi angopfuura kuongororwa, anoiswa-vacuum-packed, akaiswa mukati, uye anotumirwa kuti aendeswe.