Imwe yedzakanyanya kutariswa muPCB dhizaini kuona kuti mangani matutu enzira, ndege dzepasi, uye ndege dzemagetsi dzinodiwa kuzadzisa zvinodiwa nedunhu. Iyo stack-up dhizaini yePCB inowanzo kanganisa, ichitora akasiyana zvinhu mukufunga. Pazasi pane misimboti yakakosha yePCB stack-up dhizaini.
stack-up Planning
MaLayer Ekunze ane GND nePWR : MaLayer aya anonyanya kushandiswa pakuronga nekupfupisa matraces. Kune maapplication eHDI (High-Density Interconnect), layer yechipiri inowanzova chiratidzo chinoshandiswa pakuronga matraces pakati pezvikamu zveBGA zvakapfava. Mukushandisa uku kweHDI, vagadziri vanowanzo shandisa laser drilling pakuboorera kwakadzika kuti vasvike palayer yechipiri.
Kuenzanisa Masheya : Masheya ese anofanira kunge aine sheya yakaenzana kubva pamutsetse wepakati wePCB kuderedza kana kubvisa kukombama. Rudzi uye ukobvu hweprepreg (zvinhu zvakaiswa mudumbu) zvinofanirwa kutsanangurwa usati watanga kuronga kweCAD.
Zvinhu Zvinofanira Kufungwa Nezvekugadzira : Zvakakosha kuita ongororo ye stack-up nemugadziri kuti uone huremu hwemhangura, zvinhu zvakagadziriswa, uye ukobvu hwepakati usati wagadzira CAD, uchivimbisa kuti pane impedance inodzorwa.
Ukobvu hwezvinhu :
- 1.6mm FR4 zvinhu zvinoshandiswa kurongedza-ups ne 2-16 layers.
- 1.8mm FR4 inoshandiswa kuita stack-ups ine 10–20 layers.
- 2.3mm FR4 inoshandiswa kuita stack-ups ine 10–32 layers.
Ukobvu hwePCB Hwakajairika :
- A. 0.8mm (0.031″)
- B. 1.0mm (0.040″)
- C. 1.6mm (0.062″)
- D. 1.8mm (0.070″)
- E. 2.3mm (0.090″)
- F. 3.2mm (0.125″)
stack-up Design Principles
Layer Segmentation
Mune akawanda-layer PCBs, iwo akaturikidzana anowanzo sanganisira masignal layer (S), simba layers (P), uye pasi pasi (GND). Masimba uye pasi akaturikidzana anowanzo contiguous uye anopa yakaderera-impedance kudzoka nzira yezvino inoyerera kuburikidza nepedyo masaini maratidziro. Masignal layers anonyanya kuiswa pakati peaya masimba kana pasi referensi rendege. Iwo epamusoro uye epasi akaturikidzana eakawanda-layer PCB anowanzo shandiswa kuisa zvikamu uye shoma yenzira.
Kusarudza Single Power Reference Plane
Decoupling capacitor inofanira kuiswa chete pamusoro uye pasi pezvikamu zvePCB. Iyo nzira, mapedhi, uye vias inobatanidza kune aya capacitor inogona kukanganisa zvakanyanya kuita kwavo. Naizvozvo, zvakakosha kuve nechokwadi chekuti mitsetse inobatanidza kune decoupling capacitors ipfupi uye yakafara sezvinobvira, ine vias yakabatana kune aya maitiro ari mapfupi sezvinobvira.
Kusarudza Multiple Power Reference Planes
Multiple power reference ndege dzakakamurwa kuita matunhu akasiyana, imwe neimwe ichipa akasiyana voltage mazinga. Kana masignal layer ari padhuze neaya akawanda emagetsi ndege, masaini ari pazvikamu izvi anogona kusangana neasina kunaka nzira dzekudzoka, izvo zvinogona kukanganisa kusatendeseka kwechiratidzo. Naizvozvo, yakakwirira-yekumhanya yedhijitari chiratidzo routing inofanira kuchengetedzwa kure neakawanda simba rengedzo ndege.
Kusarudza Multiple Ground Reference Planes (Ground Planes)
Multiple ground reference ndege dzinopa yakaderera-impedance nzira yekudzoka yeazvino, zvichibatsira kudzikisa yakajairika-modhi EMI (Electromagnetic Interference). Ndege dzepasi uye dzemagetsi dzinofanirwa kubatanidzwa zvakasimba, uye masignal layers anofanirwawo kubatanidzwa zvakasimba nendege dziri pedyo.
Kugadzira Routing Combinations
Iko kusanganiswa kwezvikamu izvo chiratidzo chekutsvaga chinoyambuka chinonzi "musanganiswa wenzira." Iyo yakanakisa nzira yekubatanidza dhizaini inodzivirira kudzoka mafungu kubva mukuyerera pakati pemareferenzi ndege. Nenzira yakanaka, ikozvino kudzoka kunofanira kuyerera kubva pane imwe nzvimbo pane imwe ndege kuenda kune imwe nzvimbo pane imwe ndege.
