1. ziviso
1.1 Chimurenga che5G nematambudziko ePCB
Kuburitswa kwe5G wireless technology pasi rose kunomiririra shanduko huru muzvivakwa zvekutaurirana kubva pakatanga 4G LTE. Inoshanda kuburikidza nema frequency bands maviri akasiyana pasi pe6 GHz kuti ifukidzwe ne broad coverage uye millimeter wave (mmWave) frequency inotangira pa24 kusvika 77 GHz kuti iwane high-high.
Kutumira data nekukurumidza. Ma network e5G anoda kunyatsojeka kusati kwamboitika mukugadzirwa kwebhodhi redunhu rakadhindwa (PCB). Kusiyana nemashandisirwo ePCB akajairwa, masisitimu e5G anofanirwa kubata ma frequency ezviratidzo uko kunyangwe zvikanganiso zvemagadzirirwo ema microscopic zvinogona kukonzera kudzikira kwekushanda.
Sekureva kweongororo yeindasitiri, musika wepasi rose wezvivakwa zve5G unotarisirwa kudarika mabhiriyoni emadhora $47.7 panosvika gore ra2027, zvichikonzera kudiwa kukuru kwemhinduro dzePCB dzinoshanda zvakanaka. Kukura uku kunounza mikana nematambudziko kune vagadziri vePCB vanofanirwa kuziva hukama hwakaoma pakati pezvinhu zvemidziyo, magadzirirwo ezvikamu, uye maitiro ezviratidzo pamafrequensi eredhiyo. Kuchinja kubva pa4G kuenda ku5G hakusi kungovandudza zvishoma nezvishoma, kunoda kufunga patsva nezvePCB stack up architecture.
Mufananidzo 1 - frequency spectrum ine sub-6 GHz uye mmWave bands dzakaratidzwa
1.2 Basa Rakakosha reKugadzira Stack-Up muKushanda kwe5G
Kuunganidzwa kwePCB kwakanyatsorongeka kwezvikamu zvemhangura, zvinhu zve dielectric, uye substrates dzepakati zvinoshanda sehwaro hwakavakirwa pakuvimbika kwese kwechiratidzo che5G. Pama frequency e mmWave, simba remagetsi rinoita zvinoenderana nemisimboti inoita seisingawirirane nevagadziri vakajaira mashandisirwo e frequency yakaderera. Ma wavelength echiratidzo anoderera kusvika pa millimeter scale, zvichiita kuti
zvinhu zvakaita sezvimedu uye kusawirirana kwetrace izvo zvaive zvisina basa pa1 GHz zvinova manyuko makuru ekuratidzira uye kurasikirwa kwechiratidzo pa28 GHz.
Kuunganidzwa kwe5G PCB kwakagadzirwa zvakanaka kunofanira kugadzirisa zvinodiwa zvakasiyana-siyana panguva imwe chete: kudzorwa kweimpedance kudzivirira kuratidzwa kwechiratidzo, kurasikirwa kwakaderera kwekuisa kuti kuchengetedze simba rechiratidzo, kudzivirira kupindirana kwemagetsi (EMI) kudzivirira kutaurirana pakati pemaseketi, uye manejimendi yakasimba yekupisa kuti ibvise kupisa kubva kuma amplifiers eRF anoda simba. Kugadziriswa kwekubatanidzwa kunokanganisa zvakananga chimwe nechimwe chezviyero izvi, zvichiita kuti ive sarudzo yakakosha mukugadzirwa kwe5G PCB yese.
2. Kunzwisisa Zvinodiwa zvePCB zve5G
2.1 5G Frequency Spectrum uye Hunhu hweSignali
Mabhendi eSub-6 GHz: Hwaro hweKupararira Kwakapararira
Rudzi rwe sub-6 GHz, runosanganisira ma frequency kubva pa600 MHz kusvika pa6 GHz, rwunomiririra musimboti wekuvhara we5G. Ma frequency aya akaderera anopa hunhu hwekupararira hunodiwa pakuisa network munzvimbo yakakura, zvichipa kupinda kwemukati kwechivako uye kureba kwenguva refu zvichienzaniswa ne mmWave. Kubva pamaonero ekugadzira PCB, masaini e sub-6 GHz anopa matambudziko ari pakati nepakati anorema kupfuura 4G LTE asi asina kunyanya kunyanyisa pane mashandisirwo e mmWave.
mmWave Bands (24-77 GHz): Zvinodiwa Pakunyatsoongorora Millimeter wave 5G, inoshanda zvakanyanya mumabhendi e24 GHz, 28 GHz, 39 GHz, uye 77 GHz, inosundidzira tekinoroji yePCB kusvika pamiganhu yayo. Pa28 GHz, kureba kwewavelength muRogers RO4350B laminate yakajairika (Dk = 3.48) kunoyera 5.7 mm chete. Izvi zvinoreva kuti kota yewavelength stub ine resonant yakakosha inoreba 1.4 mm chete. Ma "vias" echinyakare akagadzirwa neburi, ayo anogara achisiya 2-3 mm stubs, anova ma "resonators" akakosha anogona kuparadza zvachose kusimba kwechiratidzo.
Mufananidzo 2 - Kuenzanisa kwakadzama kwehurefu hwemafungu kunoratidza mativi chaiwo
2.2 MaParamita Akakosha Emagetsi e5G Stack-Ups
Maparamita akawanda emagetsi anodzora mashandiro ePCB ye5G, imwe neimwe ichida kunyatsofungwa panguva yekugadzira stack-up. Dielectric constant (Dk kana εr) inosarudza kumhanya kwekupararira kwechiratidzo uye kukosha kweimpedance inodzorwa. Kune maapplication e5G, kugadzikana kweDk pakati pemafrequency netembiricha kwakakosha. Chinhu chine Dk chinosiyana ne5% pamusoro petembiricha chichaita kuti impedance ishanduke izvo zvinoburitsa kuratidzwa uye zvinoderedza kusimba kwechiratidzo mumacircuit eRF akarurama.
Chinhu chinopa simba (Df), chinonziwo loss tangent (tan δ), chinoyera kushaikwa kwe dielectric. Standard FR-4 inoratidza Df values ye0.015-0.020 pa10 GHz, nepo zvinhu zvinoshanda zvakanyanya zvakaita seRogers RO3003 zvichisvika 0.0010 panguva imwe chete yekuvandudza ka15-20.
Kushivirira kweImpedance control kwakasimba zvakanyanya kune 5G applications. Kunyange hazvo ±10% kushivirira kweImpedance kuchikwanisa kukwana kune akawanda maapplications, 5G RF circuits inowanzoda ±5% kana kudzora kwakasimba.
| zvinhu | Dielectric Nguva dzose (Dk) | bongozozo Factor (Df) | Best Application |
| FR-4 Standard | 4.2-4.5 @ 1GHz | 0.015-0.020 | Dhijitari, sub-6 GHz haisi yakakosha |
| Rogers RO4350B | 3.48 @ 10GHz | 0.0037 | Sub-6 GHz RF, mmWave inodhura zvishoma |
| Rogers RO3003 | 3.00 @ 10GHz | 0.0010 | Midziyo ye mmWave inoshanda zvakanyanya, nzvimbo dzekutanga |
| RT/duroid 5880 | 2.20 @ 10GHz | 0.0009 | Kurasikirwa kwakanyanya >20 GHz, zvikamu zvakarongwa |
Tafura 1: Kuenzanisa zvinhu zve laminate zvine frequency yakawanda kune 5G PCB applications
2.3 Zvinodiwa Pamuviri Nepakupisa
MaPCB e5G anowanzoda 10-16 copper layers kuti akwanise kugadzirisa zvinodiwa zveRF transceivers dzemazuva ano, baseband processors, power management circuits, uye digital interfaces dzakabatana. Tekinoroji yeHigh-density interconnect (HDI) ine ma microvia madiki se 0.1 mm dhayamita, ma blind uye akavigwa vias, uye any-layer routing inova yakakosha kuti uwane huwandu hwe component hunodiwa ne 5G system integration uku uchichengetedza nzira dze controlled impedance signal.
Kutarisira kupisa kunounza matambudziko makuru mumagadzirirwo e5G. Ma amplifiers emagetsi muzvishandiso zvebase station anogona kuburitsa 50-100 watts, zvichigadzira nzvimbo dzinopisa dzinosvika 85-100°C panguva yekushanda. PCB substrate inofanira kunge iine thermal conductivity yakakwana (≥1.5 W/m·K) kuti iparadzire kupisa uku munzvimbo yese yebhodhi uye kukuendesa kuma heat sinks kana ma thermal management systems. Kudzivirira kupisa kwakanyanya, kunoyerwa seRelative Thermal Index (RTI) ye≥150°C, kunoita kuti zvinhu zvigare zvakanaka mumamiriro ekushanda akasimba.
Kukwanisa kugadzira zvinhu kwakasimba zvakanyanya kune maPCB e5G. Kunyoresa kwakarurama, kunyatsoenderana pakati pezvikamu zvemhangura kunofanira kusvika ±75 μm (±3 mils) kana zviri nani kune mmWave applications, zvichienzaniswa ne ±150 μm yemagadzirirwo emazuva ano.
3. Sarudzo yezvinhu zve5G Stack-Ups
3.1 Zvinhu zveLaminate Zvinowanikwa Kakawanda
Rogers Materials: Standard yeIndasitiri yeRF Performance
Ma laminate eRogers Corporation ane ma frequency akakwira ave ndiwo anonyanya kushandiswa pakushandisa 5G PCB, achipa hunhu hwe dielectric hwakagadziriswa zvakanaka hunoramba hwakagadzikana pahuwandu hwema frequency netembiricha. RO4000 series, kunyanya RO4350B, ine chiyero chakanaka pakati pekushanda kweRF uye kugona kwayo kugadzira. Ne dielectric constant ye3.48 ±0.05 uye dissipation factor ye0.0037 pa10 GHz, RO4350B inopa simba rekudzivirira kusingafungidzike uku ichishandisa nzira dzekugadzirisa dzeFR-4 dzakajairika dzisina kunyanya kushandiswa kuburikidza nekurapa kana kugadzirisa ma parameter ekuboorera anodiwa.
Kune maapplication anoda kurasikirwa kwakaderera, RO3000 series inoita basa rakanaka kwazvo. RO3003, ine PTFE yakagadzirwa neceramic, inoita Df ye0.0010 uye Dk ye3.00 properties inoramba yakafanana kubva pa10 MHz kusvika ku40 GHz. Izvi zvinoshanda zvakanaka mukugadzira ma amplifier esimba rebase station nemamwe maapplication apo chegumi chega chega che dB chekurasikirwa kweinsertion chinokanganisa mashandiro esystem. Kuchinjana kunouya nemitengo yepamusoro yezvinhu (kazhinji 3-5x RO4350B) uye zvinodiwa zvakanyanya zvekugadzira.
Mufananidzo 3 - Chiratidzo cheRogers RO4350B chakagadzirwa nelaminate chinoratidza foil yemhangura, resin system, uye girazi rekusimbisa
3.2 FR-4 mu5G Applications: Kunzwisisa Miganhu
Standard FR-4 inoramba ichishanda kune zvikamu zvakati zvemagadzirirwo e5G, kunyanya zvikamu zvekugadzirisa masaini edhijitari, network dzekugovera magetsi, uye mashandisirwo e-sub-6 GHz uko zvinodiwa pakushanda kweRF zvisinganyanyi kuoma. FR-4 yemhando yepamusoro yemazuva ano kubva kuvagadziri vakaita saShengyi, Panasonic, uye ITEQ inogona kusvika paDf values ye0.012-0.015 pa5 GHz kana ichishandisa masisitimu akakodzera eresin uye magirazi ekusimbisa.
zvinogamuchirika kune nzira dzakawanda dzemasaini dziri pasi pe6 GHz.
Zvisinei, miganhu yeFR-4 inoonekwa pamafrequencies akakwira. Dk yezvinhu izvi inowanzo chinja-chinja ne ±10% patembiricha yekushanda (-40°C kusvika +85°C), zvichienzaniswa ne ±2% yema laminates ane mafrequencies akawanda. Kusiyana uku kunoshandura kushanduka kwe impedance kunogona kukonzera zvikanganiso zve reflection-induced bit mu high-speed digital interfaces uye kuderedza mashandiro eRF system. Pamusoro pezvo, FR-4's glass reinforcement inogadzira kusiyana kwenzvimbo muDk inoshanda 'fiber weave effect' iyo inova dambudziko kune traces dzinomhanya pa oblique angles kune glass fiber pattern.
3.3 Maitiro Ekubatanidza Zvinhu Zvakasanganiswa: Kuvandudza Mashandiro Uye Mutengo
Ma "hybrid stack-ups" anosanganisa ma "high-frequency laminates" neFR-4 anopa nzira yakanaka yekuenzanisa mashandiro uye mutengo mumagadzirirwo akaomarara e5G. Nzira huru iyi inoisa zvinhu zvinodhura zvishoma kurasikirwa chete panofamba masaini eRF, ukuwo ichishandisa FR-4 isingadhuri yezvikamu zvemukati zvinotakura masaini edhijitari, kugoverwa kwesimba, uye rutsigiro rwemakanika. Kuunganidzwa kwakajairika kwe "hybrid stack" kunogona kushandisa Rogers RO4350B kune zvikamu zviviri zvekunze (L1 neL12 muchimiro chezvikamu gumi nezviviri) uko RF microstrip transmission lines inogara, ine FR-4 cores inosanganisira zvikamu zvemukati.
Mufananidzo 4 - Dhayagiramu yechikamu chakasiyana che 12-layer hybrid stack-up inoratidza Rogers RO4350B ekunze kwezviratidzo zveRF
4. Maitiro Ekugadzirisa Maturikirwo e5G
4.1 Nheyo dzeKubatanidza Zvinhu Zvikuru
Usati watanga kuongorora magadzirirwo chaiwo ezvikamu, mitemo yakati wandei inodzora magadzirirwo ese ehunyanzvi e5G PCB stack-up. Symmetry ndiyo inonyanya kukosha pakugadzira: stack-up inofanira kuenzana pakati pebhodhi kudzivirira kudonha panguva yekukanda uye kupisa. Izvi zvinoreva kuenzana kwehuremu hwemhangura, ukobvu hwepakati, uye huwandu hweprepreg kumativi akasiyana epakati. Bhodhi rine mhangura kune rumwe rutivi richakotama sechipunu chembatatisi mushure mekusanganisa zvakare mhedzisiro isingagamuchirwi yekubatanidza kweRF kwakarurama.
Kuswedera pedyo kwenzvimbo yereferensi kwakakosha zvakaenzana: nzvimbo yega yega yechiratidzo inofanira kunge iine nzvimbo yepasi kana yemagetsi iri pedyo nayo. Izvi zvinopa nzira yekudzoka isina kudzika iyo masaini e-frequency yakakwira anoda ukuwo ichidzivirira nzvimbo yechiratidzo kubva pakukanganiswa.
Kubatanidza ma "layer pairing" kunosanganisira kuisa ma "signal layers" mumapoka zvichienderana nebasa uye zvinodiwa nemagetsi. Ma "high-speed differential pairs" anofanirwa kufamba ari pa "layer" imwe chete, ne "length matching" inowanikwa kuburikidza ne "serpentine routing" pane kupatsanura ma "layers" mu "layers". Ma "RF signal layers" anowanzo gara pa "layers" ekunze uko anogona kushandiswa se "microstrip transmission lines", zvichiita kuti zvive nyore kuwana nekugadzirisa.
4.2 Kuunganidzwa KwemaLayer 8: Nzvimbo Yekupinda Magadzirirwo e5G
Kuunganidzwa kwema layer masere kunomiririra huwandu hushoma hwema layer anoshandiswa pakushandisa 5G senge zvishandiso zveIoT, maredhiyo madiki efoni, kana ma sub-6 GHz RF modules ari nyore. Kunyangwe zvichienzaniswa nehuwandu hwema layer akakwira, chimiro chakagadzirwa zvakanaka chema layer masere chinogona kutsigira magadzirirwo akaomarara zvine mwero nekungwarira kwekushandisa uye kuiswa kwezvikamu.
Kurongeka KwemaLayer Masere Kunokurudzirwa:
∙ Chinyorwa 1: RF Signal & Critical High-Speed (microstrip, 50Ω)
∙ Danho rechipiri: Ndege yepasi (nzira huru yekudzoka kweRF)
∙ Chitsauko 3: Zviratidzo zveDigital Zvinomhanya Zvikuru (stripline, 50Ω kana 100Ω differential) ∙ Chitsauko 4: Power Plane (+3.3V, +1.8V split)
∙ Danho rechishanu: Ndege yemagetsi (yakaratidzwa: +3.3V, +1.8V yakapatsanurwa)
∙ Chitsauko 6: Zviratidzo zveDigital Zvinomhanya Zvikuru (stripline, orthogonal kusvika kuL3)
∙ Danho rechinomwe: Ndege yepasi (nzira yekudzoka yechipiri)
∙ Chinyorwa 8: RF Signal & Critical High-Speed (microstrip, 50Ω)
Kurongeka uku kunopa symmetry (L1-L2-L3-L4 magirazi L8-L7-L6-L5), kunoita kuti chiratidzo chega chega chive nereferensi iri pedyo, uye kunoisa ma power planes pakati penzvimbo iyo capacitance yavo inonyanya kushanda pakupatsanura. Ukobvu hwe dielectric hunogona kuva: L1-L2 = 6 mils (RO4350B yeRF), L2-L3 = 8 mils (core), L3-L4 = 14 mils (prepreg), L4-L5 = 20 mils (core), yakaenzaniswa zvakafanana neL8.
4.3 Kuunganidzwa KwemaLayer 12: Mapurogiramu Epamusoro e5G
Kune mamodule e5G systems base station emhando yepamusoro, maMIMO antenna arrays makuru, kana mafoni emhando yepamusoro, 12-layer stack-up inopa routing density uye signal integrity performance inodiwa kuti pave nemhedzisiro yakanaka.
kupatsanurwa kwakakwana kwezvikamu zveRF, zvedhijitari, uye zvemagetsi ukuwo zvichipa ndege dzakawanda dzepasi kuti dzidzivirire zvakanyanya.
Kugadziriswa Kwakagadzirwa KwemaLayer 12 kwemmWave:
∙ Chikamu 1: Chikamu cheRF Signal A (mmWave antenna feeds, microstrip 50Ω) ∙ Chikamu 2: Ground Plane A (kudzoserwa kweRF kwekutanga, 1 oz Cu)
∙ Chidimbu 3: Chidimbu cheRF Chiratidzo B (nzira dzechipiri dzeRF, mutsetse wepakati 50Ω)
∙ Chikamu chechina: Pasi peNdege B (RF isolation uye return, 1 oz Cu)
∙ Chikamu 5: Simba reNdege A (Simba reRF: +5V PA supply, 2 oz Cu)
∙ Chikamu 6: Dhijitari Yekumhanya Kwazvo (SerDes, DDR, PCIe stripline)
∙ Chikamu 7: Dhijitari Yekumhanya Kwakanyanya (kurongeka kwenzira kuenda kuL6)
∙ Dura 8: Ndege yeMagetsi B (Simba redhijitari: +3.3V, +1.8V, +1.2V kupatsanurwa, 2 oz Cu) ∙ Dura 9: Ndege yepasi C (kudzoka kwedhijitari uye kudzivirira, 1 oz Cu)
∙ Chikamu 10: Zviratidzo zveKumhanya Kwakaderera & Routing (kutonga, I2C, SPI)
∙ Chidimbu 11: Pasi D (chidimbu chekupedzisira chekudzivirira, 1 oz Cu)
∙ Chigadziko 12: Chigadziko cheRF Signal C (RF yechipiri, kuiswa kwechikamu, microstrip 50Ω) Iyi SGSGPSSPGSGS configuration inopa mashandiro akanaka: mapuraneti mana akasiyana epasi anogadzira zvipingamupinyi zvakawanda zvekudzivirira, mapuraneti eRF akaparadzaniswa zvachose kubva kune ruzha rwekuchinja kwedhijitari, uye stripline RF routing paL3 inopa dziviriro yakanaka yenzira dzinonzwa. Stack-up inochengetedza symmetry pamusoro peL6-L7 center plane.
Mufananidzo 5 - Chikamu chakadzama che 12-layer 5G PCB stack-up chinoratidza ukobvu hwe layer, huremu hwemhangura, uye chiratidzo/ndege
5. Maitiro ekugadzira pasi e5G PCBs
5.1 Zvinhu Zvinokosha Pakugadzira Magadzirirwo Akawanda
Pama frequency akakwira, pasi harisi nzvimbo yekunongedzera zero-voltage chete asi chimiro chakaoma che electromagnetic chine maitiro anotungamira mashandiro echiratidzo. Nheyo huru: ma currents ekudzoka kwe frequency yakakwirira anoyerera zvakananga pasi pezviratidzo zvawo zvine chekuita nazvo, achitevera nzira ye minimum impedance. Nzira iyi haitsamiri pakuramba kweDC asi pama inductance return currents anowanzo sangana munzvimbo ine magineti akawanda akabatana ne signal coupling.
Kukanganisa kweganda pa mmWave frequency zvinoreva kuti mafungu ekudzoka anoyerera chete mumazana mashoma epamusoro epamusoro penyika yepasi. Izvi zvinoita kuti kupera kwepasi uye kugona kwe oxidation kuve kwakakosha zvinoshamisa kuti mhangura yakaora iratidze RF resistance yakakwira kupfuura mhangura yakajeka. Nekuda kweizvi, vagadziri vazhinji vanotsanangura ENIG (Electroless Nickel Immersion Gold) surface finishes pasi munzvimbo dzakakosha dzeRF, pasinei nekuwedzerwa kudiki kwe nickel layer.
5.2 Kuitwa Kwenzvimbo Yakasimba Pasi
Ndege yepasi inoenderera mberi, isina kupwanyika inomiririra chinhu chimwe chete chakakosha chePCB inounganidzwa nemhepo ine ruzha rwakawanda. Funga nezvendege yepasi senzvimbo yakatsetseka yegungwa kuti mafungu ekudzoka ayerere chero chipingamupinyi (chisina chinhu, nzvimbo, kucheka) chinogadzira nyonganyonga inoburitsa simba uye inoratidza zviratidzo. Kune mashandisirwo e5G, kusimba kwendege yepasi hakugone kutaurirana: ndege yega yega yepasi inofanira kubva kumucheto kuenda kumucheto webhodhi pasina kukanganiswa kwakanyanya.
Kana kupatsanuka kwepasi kwava kusingadzivisike, zvichida kuparadzanisa zvikamu zveanalog nedigital, kana kugadzira relief yekupisa kutenderedza maburi ekukwirisa shandisa ma capacitor ekusona kuti uvhare mukaha. Isa 0.1 μF kana ma capacitor madiki pa 1-2 inch intervals pamwe chete nekupatsanurwa, zvichiita kuti AC ipfupi paRF frequency uku uchichengetedza DC isolation. Usambofa wakaisa masaini ekumhanya kwepamusoro kana RF pakati pekupatsanurwa kwepasi; kana trace ichifanira kuyambuka kupatsanurwa, iendese yakatwasuka kuti uderedze nzvimbo ye loop uye wedzera pasi pedyo ne crossing point.
5.3 Kuburikidza neMatekiniki ekuStitch uye eGround Fencing
Kuburikidza nekusona nzvimbo yekuisa ma grounding vias kuti ubatanidze mapuraneti epasi pakati pezvikamu zviri pakati pezvinhu zvakakosha asi zvinowanzo regeredzwa pakugadzirwa kwe 5G PCB. Pa mmWave frequency, inductance yekubatanidza pasi pfupi inova yakakosha. Dhayamita imwe chete ye 10 mil kuburikidza nebhodhi rine ukobvu hwe 62 mil inoratidza inductance inosvika 0.7 nH inoita seisina basa, asi pa 28 GHz izvi zvinomiririra impedance inosvika 123 ohms, yakakwana kukanganisa zvakanyanya kubatana kwepasi kwe high-frequency.
Mhinduro yacho iri mumatanho akafanana. Kushandisa ma-vias mana panguva imwe chete kunoderedza inductance inoshanda nekanenge ka4 (zvichienderana nemhedzisiro yeinductance yekuwirirana), zvichiita kuti connection impedance ive padanho rinogamuchirwa. Kune zvikamu zvakakosha zveRF, isa ma-vias matatu kusvika mana ari pedyo nepini yega yega yevhu, uchibatanidza kune iri pedyo.
Nzvimbo yakasimba pasi. Isa nzvimbo idzi pedyo nechikamu sezvinobvira inductance inowedzera nekureba kwayo, zvichiita kuti nzira pfupi dzive dzakakosha.
Mufananidzo 6 - Chiratidzo chepamusoro chePCB chinoratidzwa nepatani yekusona yakatenderedza
6. Kudzora Kusapindirana Kwemagetsi mu5G Stack-Ups
6.1 Zvinodiwa zveImpedance Zvinodzorwa
Kudzorwa kweimpedance kunomiririra hwaro hwekukurumidza uye RF signal integrity. Kana kwakabva chiratidzo, nzira yekutumira, uye kuguma kwezvose zvichiratidza hunhu hwakafanana hweimpedance, simba rinofamba zvachose kubva kunobva kuenda kune mutoro pasina kuratidzwa. Kusawirirana kweimpedance kunoita kuti zvikamu zvechiratidzo zvidzoke zvichidzokera kunobva, zvichiita kuti mafungu amire, kurira, uye kupindirana kwepakati pezviratidzo zvinokanganisa masaini edhijitari uye zvinokanganisa mashandiro eRF system.
Kune mashandisirwo e5G, 50-ohm single-end impedance yave chiyero cheRF nema microwave circuits. Kukosha uku kwakabva pakugadzirisa pakati pesimba rekubata uye kurasikirwa kwetambo dze coaxial, uye zvese zvinobatanidza RF ecosystem, michina yekuyedza, nezvimwe zvinotora masisitimu e50-ohm.
ma "speed digital interfaces" anowanzo shandisa 50-ohm single-ended (yemasaini ane magumo akafanana nemawachi) kana 100-ohm differential impedance (yema "differential pairs" akadai seMIPI, PCIe, uye USB).
6.2 Kugadziriswa kweMicrostrip kweRF Signals
Microstrip chiratidzo chechiratidzo chiri pachikamu chekunze chebhodhi chine plane yepasi pachikamu chemukati chiri pedyo ndicho chinomiririra gadziriro yemutsetse wekutumira wakajairika weRF circuits.
Kuvharirwa kwechinhu che microstrip kunoenderana nehupamhi hwetrace (W), kukwirira pamusoro penyika (H), ukobvu hwemhangura (T), uye kuvharirwa kwe dielectric kwezvinhu zve substrate (εr). Kuti zvive nyore kusvika, kuvharirwa kwakafara uye kukora kwe dielectric kunowedzera kuvharirwa, nepo kuvharirwa kwakakwirira kwe dielectric kunoderedza kuvharirwa.
Muenzaniso wekuverenga microstrip: kuwana 50Ω pa Rogers RO4350B ine ukobvu hwe 5-mil (εr = 3.48) ne 1 oz copper kunoda upamhi hwe trace hunosvika 11 mil. Impedance imwechete pa 4-mil dielectric inoda upamhi hwe 8.5 mil inoratidza kunzwisiswa kwe dielectric thickness.
Mufananidzo 7 - Dhayagiramu yemitsetse yekutumira microstrip ine zvikamu zvakasiyana-siyana
6.4 Kusiyana kwePair Impedance yeHigh-Speed Interfaces
Kuchinjana kwemashoko ekutumira data semusiyano wemagetsi pakati pezviratidzo zviviri zvinopindirana kunonyanya kuoneka painterfaces dzedhijitari dzemazuva ano dzinomhanya zvakanyanya nekuda kwekusadzivirira ruzha zvakanyanya uye kudzikira kweEMI. Kuchinjana kwemashoko (Zdiff) kunoenderana ne single-end impedance ye trace yega yega (Z0) uye kubatana pakati pe traces. Kune traces dzakabatana zvisina kurongeka, Zdiff ≈ 2 × Z0. Sezvo traces dzichiswedera pedyo, kubatana kunowedzera, zvichideredza differential impedance pasi pe 2:1 ratio iyi.
Kune 100-ohm differential impedance (iyo ndiyo inowanzo shandiswa nema digital interfaces akawanda anomhanya zvakanyanya), magadzirirwo akajairika anoshandisa 50-ohm single-end traces ne coupling inoderedza differential impedance kusvika 100 ohms. Mu microstrip ine edge-coupled traces, kuwana 100-ohm differential kunowanzoda trace spacing ye 1.5-2× trace width. Kureba kwenzvimbo kunowedzera coupling uye kunoderedza differential impedance; wider spacing inoderedza coupling uye inowedzera differential impedance.
| rukoko | basa | mhando | Kurema kweCu | ukobvu | zvinhu |
| L1 | Chiratidzo cheRF | Microstrip 50Ω | 0.5 oz | - | RO4350B |
| L2 | Ground | ndege | 1 oz | Zviuru zvitatu | moyo |
| L3 | Chiratidzo cheRF | Mutsetse weStripline 50Ω | 0.5 oz | Zviuru zvitatu | prepreg |
| L4 | Ground | ndege | 1 oz | Zviuru zvitatu | moyo |
| ... | Symmetric | girazi | ... | ... | ... |
Tafura 2: Muenzaniso wekugadzirisa 5G ine 12-layer (zvishoma) inoratidza top layers
7. Kufunga Nezvekuvimbika Kwechiratidzo
Kuvimbika kwechiratidzo mumaPCB e5G kunosanganisira zviitiko zvakawanda zvine hukama zvinogona kukanganisa mashandiro esystem kana zvikasatarisirwa zvakanaka. Kunzwisisa nzira dzekudzikira kwechiratidzo uye matekiniki ekugadzira mastack-up anodzideredza kunoparadzanisa magadzirirwo anoshanda kubva kune akanakisa.
7.1 Nzira Dzekurasikirwa Nekakawanda
Kurasikirwa kwechiratidzo kunowedzera zvakanyanya kana kukawanda nekuda kwemigumisiro yakawanda yemuviri. Kurasikirwa kweDielectric kunobva mukupokana kwemamorekuru muzvinhu zve substrate sezvo simba remagetsi richitenderera pama RF frequency, dipoles muzvinhu zvichiedza kuenderana nemunda, zvichibvisa simba sekupisa. Kurasikirwa uku kunoenderana zvakananga ne dissipation factor: kuwedzera kaviri Df kunowedzera kaviri kurasikirwa. Pa28 GHz mu standard FR-4 (Df ≈ 0.020), kurasikirwa kwe dielectric kunogona kudarika 1.5 dB pa inch, nepo Rogers RO3003 (Df ≈ 0.001) achirasikirwa pasi pe 0.3 dB pa inch pasi pemamiriro akafanana. Kurasikirwa kwe conductor kunowedzera ne square root ye frequency nekuda kweganda high-frequency currents concentrate pedyo ne conductor surfaces, zvichiwedzera resistance inoshanda.
7.2 Kuburikidza neDhizaini yeMashandisirwo emmWave
Via stubs chikamu chisina kushandiswa cheburi rinopinda nepakati pechikamu chinobuda chiratidzo chinogadzira maumbirwo e resonant anoratidza masaini pamafrequencies chaiwo. Chinobuda chinoshanda semutsetse wekutumira une ma quarter-wavelength resonance unokonzera kuratidzwa kwakanyanya. Pa 28 GHz ine ukobvu hwebhodhi hwe 50 mil, kunyangwe stub ye 15 mil inogona kugadzira ma resonances ane matambudziko. Mhinduro dzinosanganisira kudhonza-kumashure kubvisa ma stubs kana kushandisa ma blind/built vias anogumira pa signal layer.
Mufananidzo 9 - PCB yakacherwa kumashure kuburikidza
mhedziso
Kubudirira kwekugadzira 5G PCB stack-up kunoda hunyanzvi hwemakirasi akasiyana-siyana akadai sainzi yezvinhu, dzidziso yemagetsi, maitiro ekugadzira, uye manejimendi yekupisa. Mirayiridzo inoratidzwa muchinyorwa chino kubva pakusarudza zvinhu kusvika pakugadzirisa matanho kusvika pakudzora impedance inopa hurongwa hwakakwana hwekugadzira yakakwirira.
magadzirirwo e5G anoshanda.
Mhedzisiro mikuru inosanganisira:
1. Kusarudzwa kwezvinhu kunoita kuti pave nekushanda zvakanaka uye mari inoshandiswa pakushandisa laminates dzinoshandiswa kakawanda kana zvichidikanwa, FR-4 kune dzimwe nzvimbo.
2. Kuunganidzwa kwakaenzana kwemavara ane mareferensi akakodzera hakugone kutaurirana. 3. Kusimba kwepasi uye kuburikidza nekusona zvinoona kuvimbika kwechiratidzo pa mmWave.
4. Kudzora kweImpedance kunoda kutonga kwakanyatsojeka kweukobvu hwe dielectric uye kuongororwa kwe field solver.
5. Kushanda pamwe chete nemugadziri wePCB yako nekukurumidza kunodzivirira kudzokororwa kunodhura.
Sezvo tekinoroji ye5G ichiramba ichichinja ichienda kuma frequency akakwira uye kuomarara kwakanyanya, matanho nenzira dzakatsanangurwa pano dzicharamba dziri dzakakosha. Kunyangwe uri kugadzira chigadzirwa chako chekutanga che5G kana kugadzirisa puratifomu iripo, kushandisa nguva mukugadzirisa ma stack-up kunopa mibairo mukushanda kwesystem, goho rekugadzira, uye nguva yekutenga.
