Kusarudza iyo chaiyo yakasanganiswa PCB zvinhu zvinoita basa rakakosha mukuwana kuita kwepamusoro uye kuvimbika uku uchichengeta mitengo. Iwe unofanirwa kuenzanisa zvinhu zvemukati senge coefficient yekupisa kwekuwedzera (CTE) kune mhangura-yakanyatso kutenderedza 17 ppm/°C-kudzikisa kushushikana kwekupisa uye kudzivirira kuderera.
Metric | ukoshi | Impact |
|---|---|---|
Kutadza mwero (sensors) | 2% | 20,000 kukanganisa pamamiriyoni emayuniti |
CTE yemhangura | ~17 ppm/°C | Inoderedza kushushikana, inovandudza kuvimbika |
Frequency range | Kusvikira ku 77 GHz | Inoda zvinhu zvakagadzikana, zvinoenderana |
Kusarudza anowirirana akaturikidzana uye kutevedzera IPC nhungamiro kunokubatsira kudzivirira kutadza kunodhura uye nyaya dzekugadzira mukugadzirwa kwehybrid PCB.
Zvitsva Zvitsva
Sarudza hybrid PCB zvinhu zvinoenderana nemhangura yekupisa kwekuwedzera kudzikisa kushushikana uye kudzivirira kukuvara.
Funga nezvemagetsi, zvinopisa, uye zvemuchina zvinodiwa kuti PCB yako iite zvakanaka uye inogara kwenguva refu.
Shandisa maturusi ekuenzanisa uye kuyedza kutsvaga nekugadzirisa matambudziko usati wagadzira PCB yako.
Shanda pamwe chete nemugadziri wako nekukurumidza kuti uvandudze kugona kwekugadzira uye kudzivirira zvikanganiso zvinodhura.
Kuenzanisa mutengo uye kuita nekushandisa zvinhu zvepamberi chete pazvinenge zvichidikanwa uye zvakajairwa zvinhu kumwe kunhu.
Hybrid PCB Overview
Chii chinonzi Hybrid PCB
Iwe unosangana nemahybrid PCB mune akawanda epamberi emagetsi masisitimu. Aya edunhu mabhodhi anosanganisa akati wandei emhando dzepcb zvinhu uye matekinoroji mukati mechimiro chimwe chete. Kusiyana chinyakare mapuranga, unoshandisa hybrid pcb zvinhu zvakadai FR-4 fiberglass, Ceramics, simbi-musimboti, polyimide, uye PTFE kusangana chaiwo kuita zvinodiwa. Iyi nzira inoita kuti iwe ugone kukwidziridza kutendeseka kwechiratidzo, kutonga kwemafuta, uye kugadzikana kwemuchina.
Zvinhu zvemhando yepamusoro zve pcb zvinotsigira magadzirirwo e multilayer, kusanganisira mabhodhi akaomarara uye ane frequency yakakwira .
Iwe unowana aya mabhodhi mune aerospace, mota, zvekurapa, uye zvemagetsi zvevatengi.
Zvikumbiro zvehybrid pcb zvinhu zvinosanganisira masisitimu ekutaurirana, ekufungidzira zvishandiso, uye yakakwirira-kumhanya komputa.
Tsvagiridzo ichangoburwa inotaridza kuchinjika kubva pakuongorora nemanyorero kuenda kuotomatiki optical inspection (AOI) yemahybrid PCB. Kudzidza kwakadzama uye mahybrid optical sensors ikozvino anoona madiki-saizi kuremara nehupamhi hwechokwadi. Kufambira mberi uku kunovandudza hutongi hwemhando uye kuderedza zvikanganiso zvisati zvagadzirwa.
Zano: Paunosarudza zvinhu zvemhando yehybrid pcb, funga nezvekushandiswa uye mashandiro anodiwa padanho rega rega.
Nei Kusarudza Zvinhu Zvichikosha
Sarudzo yako yepcb zvinhu inokanganisa zvakananga kushanda uye kuvimbika kwehybrid yako PCB. Chinhu chega chega chinounza chakasiyana chemagetsi, chinopisa, uye chemuchina. Semuenzaniso, ceramic-based substrates inopa yakanakisa kupisa kwekupisa, nepo polyimide inopa kuchinjika kwenzvimbo dzine simba.
Iwe unofanirwa kuenzanisa iyo coefficient yekupisa kwekuwedzera (CTE) pakati pemhangura uye substrate kudzivirira delamination.
Kusarudzwa kwezvinhu kunokanganisa kutapurirana kwechiratidzo, kukanganiswa kwemagetsi, uye kusimba kwemagetsi.
Izvo zvakakodzera hybrid pcb zvinhu zvinoderedza kukanganisa kwekugadzira uye kuwedzera hupenyu hwechigadzirwa.
Zvidzidzo zveEmpirical zvinoratidza kuti shanduko mune zvemukati geometry, senge pad dhayamita, inogona kudzikisa hupenyu hwekuchovha bhasikoro hwemagungano neinopfuura 90%. Kukuvadzwa kweVibrational kunowanzoitika mune z-direction, saka iwe unofanirwa kusimbisa bhodhi uye nekukwiridzira stack-up. Advanced modelling matekiniki zvino kukubatsira kufanotaura sei mumwe nomumwe pcb zvinhu achaita pasi kushushikana, kuvandudza dhizaini sarudzo.
Cherechedza: Gara uchienzanisa zvinhu zvaunosarudza zvichienderana nehuwandu hwekushandisa, simba, uye zvinodiwa nenharaunda.
Hybrid PCB Zvishandiso
Zvemagetsi neKupisa Zvinodiwa
Paunosarudza zvinhu zvePCB zvakasanganiswa, unofanirwa kuongorora kuti chinhu chimwe nechimwe chePCB chinosangana sei nezvinodiwa zvako zvemagetsi nekupisa. Sarudzo chaiyo inoita kuti dhizaini yako itsigire masaini ekumhanya kwepamusoro, kutumirwa kwesimba kwakasimba, uye kupisa kunobudirira. Unofanira kugara uchienzanisa mashandiro emagetsi echikamu chimwe nechimwe nechishandiso chako. Semuenzaniso, macircuit ane frequency yakakwira mumidziyo yeradar kana isina waya anoda zvinhu zvine kurasikirwa kwakaderera kwe dielectric uye kusagadzikana kwe dielectric kwakasimba. Hunhu uhu hunobatsira kuchengetedza kusimba kwechiratidzo uye kuderedza kurasikirwa mukugadzirwa kwekumhanya kwepamusoro.
Thermal conductivity chimwe chinhu chakakosha. Iwe unoda yako hybrid PCB kuti ibate kupisa zvakanaka, kunyanya mumagetsi emagetsi kana magungano akazara. Zvidzidzo zvinoratidza kuti kushandisa nano-enhanced phase shanduko zvinhu neAl2O3 nanoparticles mune dzakasiyana kupisa sink zvigadziriso zvinogona kuderedza base tembiricha kusvika 36.2% pane kumwe kupisa kunoyerera. Uku kuvandudzwa kwehutongi hwekupisa kunobatsira kudzivirira kupisa uye kuwedzera hupenyu hwechishandiso chako.
Iwe unofanirwawo kufunga nezve girazi shanduko tembiricha (Tg) uye coefficient yekupisa kwekuwedzera (CTE) pakusarudza pcb zvinhu. A Tg pamusoro pekushisa kwako kwekushanda inoita kuti substrate irambe yakagadzikana. Kufananidza CTE ye substrate yako nemhangura, iyo inenge 17 ppm / ° C, inoderedza njodzi ye delamination uye mechanical stress panguva yekupisa bhasikoro.
Zano: Gara uchienzanisa kufambiswa kwemhepo nekushanda kwemagetsi kwezvinhu zvako zvePCB zvakasanganiswa zvichienderana nezvinodiwa zvekushandisa kwako.
Mechanical Properties
Kugara kwenguva refu kwemuchina kwakakosha sekushanda kwemagetsi nekupisa. Unoda zvinhu zvePCB zvehybrid zvinogona kutsungirira kudedera, kuchinjika, uye kutenderera kwekupisa kakawanda. Zvidzidzo zvekuyedza zvakayera elastic modulus, relaxation modulus, uye creep compliance yezvinhu zvakaita sethermal conductive silica gel inoshandiswa muPCB packaging. Izvi zvinokubatsira kufanotaura kuti hybrid PCB yako ichaita sei kana wava kushushikana.
Iwe unogona kushandisa maturusi ekuenzanisa uye artificial neural network kufungidzira zvimisikidzo zvezvinhu zvako zvehybrid PCB. Semuyenzaniso, kubatanidza magumo ekuongorora zvinhu nedata rekuyedza kwave nemhosho yeperesenti yakakwana inosvika 1.2% pakufanotaura mafambiro echisikigo. Iyi nhanho yepamusoro yekurongeka inokupa iwe chivimbo mukusarudza kwako zvinhu uye stack-up dhizaini.
Paunosarudza pcb zvinhu, tsvaga maitiro akadai seyepamusoro elastic modulus uye yakanaka kushushikana kuzorora. Aya maficha anovandudza kugadzikana kwemuchina weiyo hybrid PCB, kunyanya munzvimbo dzinodiwa senge mota kana aerospace application. Iwe unofanirwawo kufunga nezve cushioning uye zvinokambaira maitiro eencapsulants uye anonamatira, sezvo izvi zvinogona kukanganisa kuvimbika kwenguva refu kwegungano rako.
Cherechedza: Hunhu hwemakanika hwakakosha pakushandisa zvinhu zvePCB zvakasanganiswa munzvimbo dzine kuzununguka kana kuchinja kwekupisa.
Advanced Material Options
Iwe unokwanisa kuwana advanced hybrid PCB zvinhu zvinopa zvakasarudzika mabhenefiti ehunyanzvi maapplication. Liquid Crystal Polymer (LCP) inomira kunze nekuda kwekushisa kwayo kwakanyanya kushanda, yakanakisa makemikari kuramba, uye yakasimba inodzivirira zvivakwa. LCP inodzivirira hunyoro ingress, inova chikonzero chakajairika chekutadza mune polyimide-based zvishandiso. Iyo monolithic fusing yeLCP maseru inogadzira chisimbiso chehermetic, inodzivirira wiring uye nekuwedzera hupenyu hwechishandiso.
LCP inotsigirawo akajairwa anochinjika PCB ekugadzira maitiro, achiita kuti ienderane nemitsara iripo yekugadzira. Iwe unogona thermoform LCP substrates kuita maumbirwo akaomarara, uye anogona kushanda patembiricha inosvika 190 °C. Izvi zvinhu zvinoita kuti LCP ive yakanaka kune zvekurapa, aerospace, uye miniaturized sensor modules. Iyo yakaderera permeability kune magasi nemvura, yakasanganiswa nekunamatira kwakasimba, inovimbisa kuita kwakavimbika munzvimbo dzakaoma.
Graphene imwe iri kubuda pcb zvinhu ine yakasarudzika magetsi kuita uye yekupisa conductivity. Chimiro chayo chakasiyana chinobvumira kukurumidza kufamba kwerekitironi, zvichiita kuti ive yakakodzera kugadzirwa kwepamusoro-soro uye chizvarwa chinotevera chemagetsi. Ndichiri mumatanho ekutanga ekugamuchirwa, graphene-yakagadziridzwa yakasanganiswa PCB zvinhu zvinovimbisa kuvandudzwa kwakakosha mune zvese chiratidzo chekuvimbika uye kutonga kwekupisa.
Kutsvaga: Zvinhu zvemhando yepamusoro zvePCB zvakaita seLCP negraphene zvinokugonesa kusvitsa miganhu yekushanda, kuvimbika, uye miniaturization mumagadzirirwo ako.
Iwe unofanirwa kugara uchiongorora huwandu hwakazara hwezvinhu zvezvinhu, zvinosanganisira mashandiro emagetsi, kupisa kwemafuta, uye kusimba kwemagetsi, paunenge uchisarudza mahybrid PCB zvishandiso zvepurojekiti yako inotevera.
Sarudzo Criteria
Performance Zvinhu
Unofanira kuongorora zvinhu zvakakosha pakusarudza zvinhu zvePCB zvakasanganiswa. Kushanda kwemagetsi kuri pamusoro pechinyorwa chako. Unofanira kutarisa dielectric constant (Dk) uye dissipation factor (Df) yezvinhu zvePCB zvega zvega . Kudzika kweDk neDf kunobatsira kuderedza kurasikirwa kwechiratidzo, kunyanya pamafrequencies akakwira. Kugadzikana kwezviyero izvi muhuwandu hwefrequencies yako kunovimbisa kusimba kwechiratidzo. Kukombama kwepombi yemhangura kunokanganisawo kurasikirwa kweconductor uye ganda, izvo zvinogona kukanganisa routing uye kushanda kwemagetsi.
Thermal conductivity uye thermal coefficient of dielectric constant (TcDk) zvinhu zvinokosha. Izvi zvinopesvedzera kuti PCB yako yakasanganiswa inobata sei kupisa uye inochengetedza kugadzikana kwedunhu. Kutora hunyoro kunogona kukanganisa kushanda kwemagetsi, kunyanya munzvimbo dzine hunyoro. Iwe unofanirwa kushandisa multiphysics simulation maturusi kufanotaura kuti zvinhu zvaunosarudza zvichaita sei pasi pemamiriro epasirese. Zvishandiso izvi zvinokubatsira kukwidziridza zvaunoda dhizaini uye nhungamiro yenzira yekuvimbika kwepamusoro.
Zano: Gara uchienzanisa mashandiro emagetsi uchishandisa data rekuyedza pasi pemamiriro ekuyedza akafanana, kwete chete zvinodiwa nemutengesi.
Kufungisisa kweMutengo
Mutengo une basa guru mukusarudza zvinhu zvako. Zvinhu zvePCB zvakagadzirwa zvakasiyana-siyana, zvakaita sema substrates ane frequency yakawanda kana tembiricha yakakwira, zvinowedzera mitengo yezvinhu zvako zvichienzaniswa nezvinhu zvePCB zvakaita seFR-4. Huwandu hwema layer, ukobvu hwemhangura, uye kuoma kwekufambisa zvese zvinowedzera mari yako. Kugadzirwa kwezvinhu zvakafambira mberi uye kushivirira kwakasimba kunowedzerawo mitengo yekugadzira.
Mutengo Wechinhu | Impact paHybrid PCB Kugadzira Mutengo |
|---|---|
Kusarudzwa Kwezvinhu | High-kuita zvinhu kuwedzera mari pamusoro mureza pcb zvinhu. |
Layer Count | Mamwe akaturikidzana anoreva zvinhu zvakakwirira uye mutengo wekugadzirisa. |
pamusoro Finish | Mapeji akakosha senge sirivheri yekunyudza anowedzera kumari. |
Routing Complexity | Complex routing uye advanced vias zvinoda imwe nguva uye zviwanikwa. |
Unogona kuenzanisa kuita uye mutengo nekushandisa yakakwirira-frequency zvinhu chete pamusoro akaturikidzana ane dzinokosha zviratidzo uye mureza pcb zvinhu kumwewo. Iyi nzira inosangana nezvido zvako zvekuita pasina kunyanya kugadzira uye kushandisa mari yakawandisa.
kugarisana
Kuenderana pakati peakasiyana hybrid PCB zvinhu kwakakosha kune yakavimbika chigadzirwa. Iwe unofanirwa kuenzanisa iyo coefficient yekupisa kwekuwedzera (CTE) pakati pezvinhu kudzivirira warpage uye delamination. Zvinhu zvisingaenderani zvinogona kukonzera kukanganisa kwemaitiro, kunyanya panguva yekupisa bhasikoro. Iwe unofanirwa kusarudza maitiro ekubatanidza anovimbisa kunamatira kwakasimba pakati pematanho.
Kugadzira hybrid PCB magungano anowanzoda hunyanzvi hwekushandisa uye kunyatso kudzora tembiricha, kudzvanywa, uye nguva. Aya matanho anokubatsira kuti uwane zvisungo zvakavimbika uye uchengetedze hunodikanwa hwezvinhu zvinhu. Kutevera nhungamiro dzakasimbiswa uye nhungamiro yenzira inoderedza njodzi yekuenderana nenyaya uye inotsigira kuvimbika kwakanyanya mukushandisa kwako.
Cherechedza: Gara uchitarisa huwandu hwakazara hwezvinhu uye kuenderana kwazvinoita paunenge uchigadzira PCB yako yakasanganiswa kuti ienderane nemamiriro ezvinhu anoda simba rakawanda.
Hybrid PCB Matambudziko
Kuenderana kwezvinhu
Unosangana nematambudziko makuru mukugadzirwa kwe hybrid pcb kana ukasanganisa zvinhu zvakasiyana zve hybrid pcb. Chinhu chimwe nechimwe chine hunhu hwakasiyana, senge coefficient of thermal expansion (CTE) uye dielectric constant. Kana usingaenderane nehunhu uhwu, unogona kucheka madziro uye kushanda kwemagetsi kwakashata. Masisitimu ekunamira anofanira kubatana zvakanaka nechikamu chimwe nechimwe che layer kuti bhodhi rirambe rakasimba muhupenyu hwaro hwese. Unofanira kugara uchitarisa kuti zvinhu zvaunosarudza zvinokwanisika here usati watanga kugadzira hybrid-board. Danho iri rinokubatsira kudzivirira kugadziridzwa kwezvinhu zvinodhura uye kukundikana.
Zano: Shandisa maturusi ekufananidzira kufanotaura kuti zvinhu zve pcb zvehybrid zvichashanda sei kana zvapisa uye zvichimanikidzwa.
Warpage uye Stress
Warpage uye kushushikana zvinowanzoitika panguva yekugadzira uye kushanda kwemahybrid PCB. Paunoshandisa hybrid pcb zvinhu pamwe CTEs akasiyana, bhodhi anogona kukotama kana kumonyorora sezvo inopisa uye kutonhora. Kufamba uku kunoisa kushushikana pamajoini ekutengesa uye kunogona kukonzera kutsemuka kana kuvhurika maseketi. Zvidzidzo zvinoshandisa finite element analysis (FEA) uye thermal cycling bvunzo kuyera izvi mhedzisiro. Nekudaro, bvunzo zhinji dzinoshuma chete kupfuura kana kufoira mhinduro. Havakupi nhamba dzakadzama pamusoro pehuwandu hwekukundikana kana zvikonzero zvikuru zvezvinetso. Kushaikwa kwedata uku kunoita kuti zviome kuona matambudziko makuru mukuvimbika kwehybrid pcb.
FEA modhi inoratidza uko kushushikana kunowedzera mumajoini anotengeswa.
Hupenyu bvunzo dzinoshandisa anenge makumi mana neshanu mayunitsi pabatch asi haiparadzanise nzira dzekutadza.
Tsvagiridzo inoenderera mberi inoedza kuvandudza ongororo yenhamba yekufanotaura kwekuvimbika kuri nani.
Iwe unofanirwa kugara uchifunga nezvekugoneka kwedhizaini yako nekuongorora zvese zviri zviviri simulation uye chaiyo-yenyika bvunzo mhinduro.
Manufacturing Complexity
Zvinhu zvemhando yehybrid pcb zvinowedzera kuomarara mukugadzirwa. Unofanira kudzora tembiricha, kumanikidzwa, uye nguva yezvinhu zvega zvega kuti udzivise zvikanganiso. Kusiyana kweCTE kunogona kukonzera kushushikana kwemuchina uye kutyisidzira chimiro chebhodhi. Hunhu hwemagetsi senge impedance uye crosstalk hunochinjawo nekukora kwechinhu chega chega uye kuomarara kwepamusoro. Unoda manamatisi anoenderana kudzivirira kupatsanurwa pakati pezvikamu. Kusarudzwa kwakakodzera kwelaminate uye kupatsanurwa kwezvikamu ndiwo matanho akakosha mukugadzirwa kwe hybrid-board.
Manufacturing Nyaya | Impact pane Feasibility uye Kuvimbika |
|---|---|
CTE kusawirirana | Inowedzera warpage uye kushushikana |
Adhesive kuenderana | Inoderedza delamination njodzi |
Kusiyana kwemagetsi | Inokanganisa kutendeseka kwechiratidzo uye kuita |
Iwe unofanirwa kugadzirisa matambudziko aya muhybrid pcb kugadzirwa kuti uve nechokwadi chekuti chigadzirwa chako chekupedzisira chinosangana nemhando uye kuvimbika zviyero.
Kukunda Matambudziko
Stack-Up Dhizaini
Unogona kugadzirisa matambudziko akawanda ePCB yakasanganiswa nekutarisa pakugadzira magadzirirwo e stack-up . Tanga nekusarudza zvinhu zvine ma coefficients anoenderana ekuwedzera kwekupisa. Danho iri rinoderedza warpage uye kushushikana panguva yekuchinja kwetembiricha. Ronga ma layers ako kuti aparadzanise masaini ekumhanya kukuru kubva kumagetsi. Nzira iyi inovandudza kusimba kwechiratidzo uye inoderedza crosstalk.
Shandisa maturusi ekufananidza kukwirisa yako stack-up. Semuyenzaniso, 3D full-wave electromagnetic simulations inokubatsira kusimbisa dhizaini yako pamafrequency anosvika 50 GHz. Aya masimulation anobvisa pesvedzero yezvigadziriso zvekuyedza, saka iwe unowana mhinduro chaidzo dzechishandiso chako. Pre-rongedzo uye post-kurongeka kuburikidza nekufananidza kunoita kuti iwe uongorore kuburikidza inductance uye usarudze pane yakanakisa lamination kutevedzana. Iwe unogona zvakare kushandisa maturusi e-post-layout kuti utarise kuti yako routing uye stack-up sarudzo dzinokanganisa sei chiratidzo chemhando.
Tevedzera chiratidzo che impedance kuti ifananidze trace wides ine dielectric constants.
Ongorora simba uye kugovera kwendege yepasi kuti ugone kuverengera layer.
Tarisa kudzoka kurasikirwa uye kuisa kurasikirwa kwezviratidzo zvakakosha.
Thermal uye mechanic kugadzikana simulations inokubatsira iwe kuona kuti bhodhi rako haripindire kana kudonhedza. Gara uchiongorora mhinduro dzekuenzanisa usati wapedzisa stack-up yako. Iyi nzira inovandudza kugona uye inoderedza dhizaini inodhura.
Zano: Shandisa gwara renzira dzekufambisa zvinhu rakavakirwa padata rekufananidzira kuti udzore hurefu hwenzira dzekutevera uye usarudze pakati pe microstrip ne stripline routing.
Mugadziri Kudyidzana
Kudyidzana kwekutanga nemugadziri wako kunowedzera kugona kweiyo hybrid PCB chirongwa. Goverana ako akaturikidzana-up zvirongwa uye simulation mhedzisiro isati yagadzirwa. Vagadziri vanogona kupa zano kugadziridzwa kusarudzo dzezvinhu, lamination maitiro, uye anonamatira masisitimu. Chiitiko chavo chinokubatsira kuti udzivise misungo yakajairika uye inova nechokwadi chekuti dhizaini yako inosangana nemirayiridzo yeindasitiri.
Kurukurai tembiricha, kudzvanywa, uye nguva zvinodiwa pachinhu chimwe nechimwe.
Ongorora adhesive kuenderana kudzivirira delamination.
Simbisa kuti nzira dzako dzekufambisa dzinoenderana nehunyanzvi hwekugadzira.
Vagadziri vanowanzova nemidziyo yepamusoro yekunyepedzera uye mapuroteni ekuyedza. Ivo vanogona kukubatsira kuona stack-up paramita uye zvipingaidzo zvenzira. Kudyidzana uku kunoderedza njodzi yekukanganisa uye kunovandudza kuvimbika kwese.
Cherechedza: Zvinodiwa nemugadziri zvakakosha pakuenzanisa mashandiro, mutengo, uye kugona kugadzirwa kwezvinhu mumagadzirirwo akaomarara ePCB.
Simulation uye Testing
Unofanira kugara uchisimbisa dhizaini yako yehybrid PCB uchishandisa nzira dzepamusoro dzekufananidzira uye dzekuedza . Shandisa ongororo yesignal-integrity, 3D modeling, uye ongororo yesimba kuti utarise matambudziko akadai sekurasikirwa kwesignal uye crosstalk. Tevedzera thermal uye mechanical stress kuti ufanotaura warpage kana delamination.
Empirical data kubva kune chaiyo prototypes inosimbisa kuvimba kwako mukugadzira. Semuyenzaniso, tembiricha- uye nguva-inotsamira deformation zviyero panzvimbo dzakakomba kutadza shandisa nzira dzekuona komputa. Idzi nzira dzinopa matatu-dimensional, chaiyo-nguva data yekuti bhodhi rako rinokanganisa sei pasi pekunetseka. Iwe unogona kuona nzvimbo dzinotadza kutadza uye kubvisa makiyi ma paramita, senge kunetsa uye kushushikana-kushungurudza zvishwe.
Zvidzidzo zvenyaya zvinoratidza kuti kuteedzera solder joint deformation panguva yekupisa bhasikoro kunokubatsira kupatsanura elastic, plastiki, uye creep strain components. Ongororo iyi inosimbisa kuti prototype yako inogona kumirisana nekudzokororwa kwekushisa. Iyo nzira yakasanganiswa, inosanganisa kuyerwa kuyerwa nenhamba yekuenzanisira, inovandudza kuvimbika kwemhedzisiro yako yekunyepedzera. Iwe unodzikisira huwandu hweyedzo kutenderera uye unowana yakawanda yakavimbika ongororo yekugara kwechigadzirwa.
Muchinjika-simbisa mabhodhi emuviri uchipesana nemhedzisiro yekuenzanisa mushure mekusangana.
Shandisa data yekunyepedzera kunatsa nzira uye stack-up sarudzo dzemagadzirirwo emangwana.
Kutsvaga: Maitiro epamusoro ekuenzanisa uye ekuyedza anokubatsira kubata matambudziko nekukurumidza, kuvandudza kuvimbika, uye kuve nechokwadi chekuti PCB yako yehybrid inosangana nezvinangwa zvese zvekushanda.
Iwe zvino une maturusi ekusarudza zvinhu zvakakodzera zvemapurojekiti ako ehybrid PCB. Tarisa pane zvemagetsi, zvinopisa, uye zvemuchina. Shandisa simulation uye kuyedza kuona matambudziko nekukurumidza. Shanda pamwe chete nemugadziri wako kudzivirira kukanganisa kunodhura. Pamagadzirirwo akaomarara, svika kune nyanzvi kuti uwane mazano. Govera zviitiko zvako kana kubvunza mibvunzo kuti urambe uchidzidza nekuvandudza mhedzisiro yako.
FAQ
Ndechipi bhenefiti huru yekushandisa zvinhu zvepamberi seLCP muPCB dhizaini?
Unowana dziviriro iri nani pakupisa uye hunyoro neLCP. Izvi zvinobatsira bhodhi rako kuti rigare kwenguva refu uye rishande zvakanaka munzvimbo dzakaoma.
Iwe unodzivirira sei warpage mumabhodhi akawanda?
Iwe unofanirwa kuenzanisa mazinga ekuwedzera ekupisa kwezvinhu zvako. Shandisa maturusi ekufananidza kuyedza yako stack-up isati yagadzirwa. Danho iri rinokubatsira kudzivirira kukotama kana kumonyoroka.
Unogona here kusanganisa yakajairwa FR-4 neakakwira-frequency zvinhu mubhodhi rimwe?
Ehe, unogona kusanganisa FR-4 nezvinhu zvinoshandisa frequency yakawanda . Nzira iyi inokubatsira kuti uenzanise mutengo nekushanda. Isa zvinhu zvinoshandisa frequency yakawanda chete paunoda.
Nei kubatana kwemugadziri kwakakosha kune yakaoma PCB mapurojekiti?
Iwe unowana zano rehunyanzvi pasarudzo dzezvinhu uye matanho ekugadzirisa. Hurukuro dzekutanga dzinokubatsira kudzivirira kukanganisa uye kugadzirisa kuvimbika kwebhodhi rako.
