1. FPC Material Cutting
Ngaphandle kwezinto ezithile, uninzi lwezixhobo ezisetyenziswa kwiisekethe eziprintiweyo eziguquguqukayo (I-FPC) yiza ngemiqulu. Kuba ingezizo zonke iinkqubo ezifuna ubuchule obusekwe kwi-roll-based, ezinye iinkqubo, njengokugrumba imingxunya eyenziwe ngesinyithi kwi-PCB enamacala amabini, kufuneka zenziwe ngemathiriyeli yefom yephepha. Inyathelo lokuqala le-PCB enamacala amabini aguqukayo kukusika imathiriyeli ibe ngamashiti.
I-Flexible copper-clad laminates inonyamezelo oluphantsi kakhulu kuxinzelelo lwemishini kwaye inokonakala lula. Nawuphi na umonakalo ngexesha lenkqubo yokusika unokuchaphazela kakhulu isivuno seenkqubo ezilandelayo. Ngoko ke, nangona ukusika kubonakala kulula, kufuneka kuthathelwe ingqalelo enkulu ukuqinisekisa umgangatho wezinto eziphathekayo. Ngamancinci amancinci, oomatshini bokusika ngesandla okanye i-rotary cutters ingasetyenziswa. Kwimveliso enkulu, oomatshini bokusika ngokuzenzekelayo bakhethwa.
Ingaba i-laminates enecala elinye okanye i-double-copper-clad-clad okanye iifilimu zokugubungela, ukuchaneka kokusika kunokufikelela kwi-± 0.33 mm. Inkqubo yokusika inokwethenjelwa kakhulu, kwaye izinto ezisikiweyo zifakwe ngokuzenzekelayo ngokucokisekileyo, kungekho mfuneko yokuphatha ngesandla kwimveliso. Inkqubo inciphisa umonakalo wezinto eziphathekayo, kwaye izinto zihlala ziphantse zingabi nemibimbi okanye imikrwelo. Ngaphezu koko, izixhobo eziphambili zinokusika ngokuzenzekelayo Ii-FPCs ifakwe kwifomathi ye-roll isebenzisa ii-sensor ze-optical ezifumanisa iipatheni zokulungelelaniswa, ukufezekisa ukuchaneka kokusika kwe-0.3 mm. Nangona kunjalo, imida yokusikwa akufanele isetyenziswe ukulungelelanisa kwiinkqubo ezilandelayo.
2. FPC Hole Hole
Njengeebhodi zesekethe eziprintiweyo eziqinileyo (PCB), ngemingxunya PCB ebhetyebhetye inokugrunjwa kusetyenziswa CNC ukomba. Nangona kunjalo, ukugrumba kwe-CNC akufanelekanga kwiisekethe ezinamacala amabini ane-metalized through-mingxuma. Njengoko uyilo lwesekethe luba lukhuni kunye nedayamitha yomngxunya omncinci, imida yokugrumba i-CNC ikhokelele ekwamkelweni kwezinye iindlela zokugrumba umngxuma ezifana ne-plasma etching, i-laser drilling, i-micro-punching, kunye ne-chemical etching. Obu buchule butsha buhambelana ngakumbi neemfuno zenkqubo esekwe kwi-roll.
I-CNC Drill
Uninzi lwemingxuma kwiPCB enamacala amabini ebhetyebhetye isagrunjwa kusetyenziswa Oomatshini be-CNC. Aba matshini be-CNC ngokusisiseko bayafana nalawo asetyenziswa kwi-PCB eqinile, nangona ezinye iimeko ziyahluka. Kuba iPCB ebhetyebhetye ibhityile, amaphepha amaninzi anokupakishwa ukwenzela ukugrunjwa. Ngaphantsi kweemeko ezifanelekileyo, amashidi angama-10 ukuya kwi-15 anokwetywa ngaxeshanye. I-Phenolic paper-based laminates okanye i-glass-fiber epoxy laminates ingasetyenziswa njenge-backing and cover sheets, okanye iipleyiti ze-aluminium ezinobunzima be-0.2 ukuya kwi-0.4 mm nazo zingasetyenziswa. Amasuntswana okuqhuba asetyenziswa kwiPCB ebhetyebhetye ayafumaneka emarikeni, kwaye amasuntswana asetyenziselwa ukugrumba eyomeleleyo iPCB nawo angasetyenziselwa ababhetyebhetye.
Iimeko zokugaya, ukugaya ifilimu yesigqubuthelo, kunye nokubumba ibhodi yokuqinisa zifana ngokubanzi. Nangona kunjalo, ngenxa yokuthamba kwe-adhesive esetyenziswa kwizinto eziguquguqukayo zePCB, inokubambelela ngokulula kwi-drill bit, efuna ukuhlolwa rhoqo kwimeko ye-drill kunye nokwanda okufanelekileyo kwisantya sayo sokujikeleza. Inkathalo eyongezelelweyo kufuneka ithathwe xa kusomba i-multilayer flexible PCB okanye eqinile-flex PCB.
Ukuqhawula
I-Micro-punching ayiyondlela entsha kwaye isetyenziselwe imveliso yobuninzi. Ekubeni iinkqubo ezisekelwe kwi-roll-based zibandakanya imveliso eqhubekayo, iimeko ezininzi zikhona apho imingxuma yokutyhulwa ibethelwa kwifomathi yokuqulunqwa. Nangona kunjalo, ukubetha ngobuninzi kunqunyelwe kwi-diameter ye-0.6-0.8 mm, kwaye xa kuthelekiswa ne-CNC yokubhoboza, ukubetha kuthatha ixesha elide kwaye kufuna ukusebenza ngesandla. Inkqubo yokuqala ihlala ibandakanya imilinganiselo emikhulu, eyenza ukuba ukubethelwa kufe ngokuhambelanayo kukhulu kwaye kubize kakhulu. Nangona imveliso yobuninzi inokunciphisa iindleko, ukuhla kwezixhobo kubalulekile, kwaye kwimveliso yeebhetshi ezincinci, ukomba we-CNC kunika ukuguquguquka ngakumbi kunye nokusebenza kakuhle kweendleko.
Kwiminyaka yakutshanje, nangona kunjalo, ukuqhubela phambili okubonakalayo kwenziwe kukokubini ukuchaneka kokufa kunye nokugrumba kwe-CNC. Ukubetha ngoku kuye kwenzeka ngakumbi kwi-PCB ebhetyebhetye. Iitekhnoloji zedie zamva nje zinokudala imingxunya emincinci njenge 75 µm kwiilaminayithi ezincamathelisayo zobhedu ezinobunzima be-substrate eyi-25 µm. Phantsi kweemeko ezifanelekileyo, imingxunya emincinci kangange 50 µm nayo ingabethwa. Oomatshini bokuntywila baye bazenzekela, kwaye abafayo abancinci bakhona ngoku, okwenza ukuba ukubetha kube yinto enokwenzeka kwiPCB ebhetyebhetye. Nangona kunjalo, akukho nto i-CNC yokugrumba okanye ukubethelwa ilungele ukusetyenzwa kwemingxuma eyimfama.
Laser ukubhola
Itekhnoloji yeLaser inokwemba eyona mingxunya incinci. Iindidi ezininzi zoomatshini bokugrumba belaser basetyenziselwa iPCB ebhetyebhetye, kubandakanywa i-excimer lasers, iCO₂ lasers, i-YAG (yttrium aluminium garnet) iilaser, kunye neargon lasers.
I-CO₂ lasers inokwemba kuphela i-insulation layers, ngelixa iilaser ze-YAG zinokugrumba zombini umaleko wokugquma kunye nefoyile yobhedu. Ukugrumba umaleko wokugquma kukhawuleza kakhulu kunokwemba ifoyile yobhedu, ke ukusebenzisa i-laser enye kuzo zonke iinkqubo zokomba akuphumelelanga. Ngokuqhelekileyo, i-foil yobhedu ifakwe kuqala ukwenza ipateni yomngxuma, kwaye emva koko i-insulation layer iyasuswa ukwenza umngxuma wokutyhutyha. Le ndlela ivumela ukugrunjwa kwemingxunya emincinane kakhulu ngeelaser. Nangona kunjalo, ukuchaneka kokubeka phakathi kwemingxunya ephezulu kunye nesezantsi kunokunciphisa i-diameter yomngxuma. Kwi-vias eyimfama, umba wolungelelwaniso oluthe nkqo awuveli, njengoko ifoyile yobhedu yecala elinye ixhonywe.
Iilaser zeExcimer ziyakwazi ukugrumba eyona mingxuma igqwesileyo. I-excimer lasers zisebenzisa ukukhanya kwe-ultraviolet okwaphula ngokuthe ngqo ubume bemolekyuli ye-substrate resin, ivelisa ubushushu obuncinci, kunye nokunciphisa umonakalo kwindawo ejikeleze umngxuma. Oku kubangela umngxuma ogudileyo, iindonga ezithe nkqo. Ukuba umqa welaser unokwehliswa ngakumbi ngobukhulu, imingxuma enobubanzi obuyi-10–20 µm inokugrunjwa. Nangona kunjalo, njengoko umyinge we-aspect ratio usanda, ukufakwa kwe-copper emanzi kuya kuba nzima.
Umba ophambili wokugrumba i-excimer laser kukuba ukubola kwe-resin kuvelisa intsalela yekhabhoni emnyama kwiindonga zomngxuma, ekufuneka zicocwe ngaphambi kokubekwa. Ukongeza, ukufana kwelaser kunokukhokelela kwiintsalela ezinjenge-bamboo xa kusetyenzwa imingxuma engaboniyo. Owona mceli mngeni mkhulu wokugrumba i-excimer laser sisantya esicothayo kunye neendleko eziphezulu, ukunciphisa ukusetyenziswa kwayo kwizicelo ezifuna ukuchaneka okuphezulu kunye nokuthembeka kwimingxunya emincinci kakhulu.
Ii-CO₂ laser drills, ngokuchaseneyo, zikhawuleza kakhulu kwaye azibizi kakhulu kodwa zinomgangatho ombi womngxuma, kunye nobubanzi obusuka kwi-70 ukuya kwi-100 µm. Nangona kunjalo, isantya sokusebenza sikhawuleza kakhulu kunee-lasers ze-excimer, okwenza ukuba i-CO₂ laser drilling ingabizi kakhulu, ngakumbi kuluhlu lwemingxuma ephezulu.
Xa usebenzisa i-CO₂ lasers ukugrumba ii-vias ezingaboniyo, kubalulekile ukuba i-laser ifike kuphela kumphezulu wobhedu. Ukususwa kwezinto eziphilayo kumphezulu akuyomfuneko, kodwa emva kokulungiswa ngemichiza okanye i-plasma etching inokufuneka ukucoca umphezulu wobhedu.
3. Ukwenziwa kwesinyithi kumngxuma
Inkqubo yomngxuma metallization for PCB bhetyebhetye iyafana naleyo isetyenziselwa PCB eqinile. Uphuculo lwakutsha nje luthathe indawo yokufakwa kweekhemikhali ngokutyabeka ngokuthe ngqo kusetyenziswa i-carbon-based conductive layers. Obu buchule buye baziswa kwimveliso ye-PCB eguquguqukayo.
Ngenxa yokuba i-PCB eguquguqukayo ithambile, izixhobo ezizodwa ziyafuneka ukukhusela iibhodi ngexesha le-metallization. Ezi zilungiso azibambeli nje iPCB endaweni kodwa zikwaqinisekisa uzinzo kwindawo yokuhlambela. Ngaphandle koko, ubukhulu bobhedu obungalinganiyo bunokukhokelela kwimiba enje ngeebhulukhwe ezimfutshane kunye nebhulorho ngexesha lokutsala. Ukufezekisa i-plating yobhedu efanayo, i-PCB eguquguqukayo kufuneka yolulwe ngokuqinileyo ngaphakathi kwendawo, kwaye ingqalelo enonophelo kufuneka ihlawulwe kwi-electrode positioning.
4. Ukucocwa koMphezulu weFoil yeCopper
Ukuphucula ukubambelela kwe-mask yokumelana, i-foil surface yobhedu kufuneka ihlambuluke ngaphambi kokuba isebenzise ukuchasana. Nangona oku kubonakala ngathi yinkqubo elula, inkathalo eyodwa kufuneka ithathelwe bhetyebhetye PCB.
Ngokuqhelekileyo, ukucoca kubandakanya iindlela zombini zeekhemikhali kunye nezomatshini. Ukufumana iipateni ezichanekileyo, zombini iindlela zihlala zidityaniswa. Ukubrasha ngoomatshini kunokuba luqilima; ukuba i-brush inzima kakhulu, inokulimaza i-foil yobhedu, kodwa ukuba ithambile kakhulu, ukucoca kunokungonelanga. Ngokuqhelekileyo, iibrashi zenylon zisetyenziswa, kwaye ubude kunye nobunzima beebrashi kufuneka zikhethwe ngokucophelela. Ii-roller ezimbini ze-brush zibekwe ngaphezu kwebhanti yokuhambisa, ejikelezayo kwicala elichasene nokunyakaza kwebhanti. Nangona kunjalo, uxinzelelo olugqithisileyo oluvela kwii-brush rollers lunokwandisa i-substrate, ekhokelela kutshintsho oluphezulu.
Ukuba indawo yobhedu ayicocwanga ngokufanelekileyo, ukunamathela kwe-mask yokumelana kuya kuba yimbi, ukunciphisa isivuno senkqubo yokubhala. Ngenxa yokuphuculwa komgangatho we-copper foil laminates kwiminyaka yamuva nje, ukucocwa komphezulu kunokugqithiswa kwiisekethe ezisecaleni. Nangona kunjalo, kwiipateni ezichanekileyo phantsi kwe-100 µm, ukucocwa komphezulu ihlala ibalulekile.
