I-Metal Core PCB

Ibhodi yeSekethe yeMetal Core eprintiweyo (MCPCB), ekwabizwa ngokuba yi-Insulated Metal Substrate (IMS) PCB okanye i-thermal PCB,

Qhagamshelana okanye RFQ

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metal core pcb gallery
isakhiwo esisiseko metal core pcb

Ulwakhiwo oluSisiseko lwe-MCPCB lubandakanya:

  • Umaleko wemaski eSolder
  • Umaleko wesekethe
  • Umaleko wobhedu 1oz. uya 6oz. (eyona isetyenziswa kakhulu yi-1oz ukuya kwi-2oz.)
  • Umaleko weDielectric
  • I-Metal core layer - i-heatsink okanye i-heat spreader

Qhagamshelana okanye RFQ

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Yintoni iMetal Core PCB(MCPCB)?

I-Metal Core Printed Circuit Board (MCPCB), ekwabizwa ngokuba yi-insulated metal substrate (IMS) PCB okanye i-PCB eshushu, luhlobo lwebhodi yesekethe esebenzisa izinto zentsimbi njengesiseko sayo sokutshatyalaliswa kobushushu, ngokungafaniyo ne-FR4 PCBs yendabuko. I-MCPCBs yenzelwe ukuhambisa ngokufanelekileyo ubushushu obuveliswa ngamacandelo e-elektroniki ngexesha lokusebenza kwiindawo ezingabalulekanga kangako, ezinjengeeheatsinks zetsimbi okanye umbindi wesinyithi ngokwawo.

I-MCPCB ikholisa ukuba nemigangatho emithathu: umaleko oqhubayo, umaleko wokugquma we-thermal, kunye ne-metal substrate layer. Olu lwakhiwo luvumela ulawulo olusebenzayo lobushushu, ukuqinisekisa ukuthembeka kunye nokuphila ixesha elide kwezixhobo zombane, ngokukodwa kwizicelo ezinamandla ezifana nezibane ze-LED kunye nombane wamandla.

Iintlobo zeMetal Core PCB

Ngokwemathiriyeli ye-Substrate

Ukukhethwa kwezinto ezisisiseko kuxhomekeke kwiimfuno ezithile zesicelo, izinto zokulinganisa ezifana ne-thermal conductivity, rigidity, kunye neendleko.

Ezona ntsimbi zisetyenziswa ngokuqhelekileyo kwiMCPCB yokwenziwa zibandakanya ialuminiyam, ubhedu, kunye nealloys zentsimbi:

  • ialuminiyam: Eyaziwayo ngokugqithisela ubushushu obugqwesileyo kunye nobuchule bokulahla, i-aluminium ayibizi kakhulu, iyenza ibe lolona khetho loqoqosho lwe-MCPCBs.
  • ubhedu: Ngelixa unikezela ukusebenza okuphezulu kwe-thermal, ubhedu lubiza kakhulu kune-aluminium.
  • steel: Ifumaneka kwiinguqu eziqhelekileyo kunye nezingenasici, intsimbi inzima kune-aluminium kunye nobhedu kodwa ine-conductivity ephantsi ye-thermal.

Ngokutsho koLwakhiwo kunye noMaleko we-Metal core PCB

I-single-layer-MCPCB-isakhiwo
Umaleko ophindwe kabini ubume be-MCPCB
Ulwakhiwo lwe-MCPCB kwicala eliphindwe kabini
Ulwakhiwo lwe-MCPCB lwamaleko amaninzi

Uluhlu olunye lwe-MCPCB

I-MCPCB ephindwe kabini

Icala eliphindwe kabini le-MCPCB

I-MCPCB enamaleko amaninzi

Izinto eziluncedo zeMetal Core PCB(MCPCB)

  • Ukutshatyalaliswa kobushushu obuPhezulu: Ii-MCPCB zisebenzisa iintsimbi ezifana ne-aluminiyam okanye ubhedu, zibonelela nge-thermal conductivity egqwesileyo. Olu phawu luvumela ulawulo olusebenzayo lobushushu kwizicelo eziphezulu zamandla, ukunciphisa kakhulu ubushushu bokusebenza kwamacandelo kunye nokuphucula ukuthembeka kwenkqubo kunye nobomi. Umzekelo, ii-MCPCBs zinokudlulisa ubushushu amaxesha angama-8 ukuya kwi-9 ngokukhawuleza kunee-PCB zemveli ze-FR4.
  • Isidingo esiNcitshisiweyo seeHeatsinks: Ngokungafaniyo nee-PCB ze-FR4, ezifuna i-hardware eyongezelelweyo yokupholisa ngenxa ye-conductivity ephantsi ye-thermal, i-MCPCBs inokuphelisa ngokufanelekileyo ukushisa ngokwazo. Oku kunciphisa ubungakanani benkqubo ngokubanzi kunye nobunzima ngokususa ii-heatsinks ezinkulu.
  • Ukuqina kunye nokomelela: I-Aluminium, i-substrate eqhelekileyo ye-MCPCBs, inika amandla aphezulu kunye nokuqina xa kuthelekiswa nezinto ezifana neeramics kunye ne-fiberglass. Oku kuqina kunciphisa umngcipheko womonakalo ngexesha lemveliso, ukudibanisa, kunye nokusebenza okuqhelekileyo, ukuqinisekisa ukusebenza okuhlala ixesha elide.
  • Uzinzo lweDimensional: Ii-MCPCBs zibonisa uzinzo olukhulu xa ziphantsi kokutshintsha kobushushu. Bafumana utshintsho lobungakanani obuncinci (ngokuqhelekileyo i-2.5% ukuya kwi-3.0%) kwiqondo lokushisa elingama-30 ° C ukuya kwi-150 ° C, liqinisekisa ukusebenza okufanayo kwiimeko ezahlukeneyo zokusingqongileyo.
  • Ubunzima obuKhala kunye nokuRecyclability okuPhezulu: Ii-MCPCBs zikhaphukhaphu kunePCBs zesintu, zisenza kube lula ukuzibamba nokuzifaka. Ukongeza, i-aluminiyam iyaphinda isetyenziswe kwaye ayinayo ityhefu, igalelo kwimisebenzi ehambelana nokusingqongileyo. Lo mba wenza i-aluminiyam ibe yindlela engabizi kakhulu kwezinye izinto.
  • Ubomi Obude: Amandla kunye nokuqina kwe-aluminiyam ayigcini nje ukwandisa ukomelela kwe-MCPCBs kodwa inegalelo kubomi obude bokusebenza. Oku kunciphisa iindleko zokugcinwa kunye nesidingo sokutshintshwa, okwenza i-MCPCB ibe yi-investment yobulumko malunga nokuphila ixesha elide.

Inkqubo yokwenziwa kweMetal Core PCB

Inkqubo yokwenziwa kwe-Metal Core PCBs (MCPCBs) ibandakanya amanyathelo akhethekileyo aliqela ngenxa yobukho bomaleko wesinyithi kwi-stackup.

  1. Iibhodi zoLuhlu olunye: Kwii-MCCBB zomaleko omnye ngaphandle kweenguqu zomaleko, inkqubo yezibuko yeebhodi zemveli ze-FR4. Uluhlu lwe-dielectric lucinezelwe kwaye luboshwe ngokuthe ngqo kwi-plate yensimbi, ukuqinisekisa ukubambelela okusebenzayo.

  2. Ii-stackups ezininzi: Kwii-MCCBB ezininzi, inkqubo iqala ngokubhobhoza i-core metal. Oku kubalulekile ekuvumeleni utshintsho lwamaleko ngaphandle kokubeka umngcipheko kwiisekethe ezimfutshane. La manyathelo alandelayo achaza inkqubo:

    • ukubhola: Imingxuma encinci igrunjwe kwi-metal layer ukuze ifake izinto zokukhusela.
    • Ukuxhuma: Le mingxunya izaliswe ngejeli yokugquma, ethi iphiliswe kwaye iqiniswe. Eli nyathelo liyimfuneko ekulungiseleleni indawo yokubeka ubhedu.
    • Ukutywala: Emva kokuba ijeli imisiwe, imingxuma egrunjiweyo ifakwe ngobhedu, efana ne-vias eqhelekileyo kwii-PCB zendabuko.
    • Bonding: I-dielectric layers eseleyo icinezelwe kwaye iboshwe kwi-metal layer.
    • Nge-Hole Drilling: Emva kokuba i-stackup igqityiwe, imingxuma igrunjwe kuyo yonke indibano, ilandelwa yiplating eyongezelelweyo kunye neenkqubo zokucoca.