Ukukhiqizwa kwama-PCB anohlangothi olulodwa noma oluhlangothini olukabili ngokuvamile kuhilela ukubhoboza izimbobo ezingaqhubeki noma eziqhutshwayo ngokuqondile ngemva kokusikwa kwempahla, kuyilapho amabhodi anezingqimba eziningi abhobozwa ngemva kwenqubo yokucwasa. Imigodi ihlukaniswa ngokusekelwe emsebenzini wayo, okuhlanganisa imigodi yezingxenye, imigodi yamathuluzi, ngokusebenzisa imigodi (Vias), imigodi eyimpumputhe, nemigodi egqitshiwe (imigodi eyimpumputhe negqitshiwe iwuhlobo lwembobo). Ukumba okuvamile kwenziwa kusetshenziswa imishini yokumba eyimishini. Ekwenziweni kwangempela, ukuhlukana phakathi kwezimbobo kuvame ukuba nomthelela kukho kokubili inqubo yokwenza imishini kanye nokwethembeka komkhiqizo wokugcina.
Izidingo Zokukhiqiza Isikhala Sezimbobo:
Ngezimbobo (Izimbobo Eziqhubayo):
- Ubuncane be-Hole Diameter: Ukubhoboza ngomshini 0.15mm, laser drilling 0.075mm.
- Pad to Board Edge Isikhala: 0.2 mm.
- Nge-Hole ukuya e-Via Hole Space (Umphetho ukuya emphethweni): Ayikwazi ukuba ngaphansi kuka-6 mil; okungcono kakhulu kune-8 mil. Lokhu kubaluleke kakhulu futhi kufanele kucatshangelwe ngesikhathi sokuklama.
- Ubuncane be-diameter yembobo ngokuvamile abuncane kuno-0.2mm, futhi ibanga lohlangothi olulodwa lwephedi akufanele libe ngaphansi kuka-4 mil, okungcono kakhulu kuno-6 mil, ngaphandle komkhawulo ongaphezulu. Lokhu kubaluleke kakhulu futhi kufanele kucatshangelwe.
Izimbobo ze-Pad (PTH):
- Pad to Board Edge Isikhala: 0.25 mm.
- Usayizi wembobo yephedi unqunywa ingxenye esetshenzisiwe, kodwa kufanele okungenani ibe mkhulu ngo-0.2mm kunephinikhodi yengxenye. Isibonelo, ingxenye enephini engu-0.6mm kufanele ibe nembobo okungenani engu-0.8mm ukuze kugwenywe ubunzima ngenxa yokubekezelela ukukhiqiza.
- Imbobo Yephedi kuya Kwesikhala Semigodi (Edge to Edge): Ayikwazi ukuba ngaphansi kuka-0.3mm. Okukhulu, kungcono. Lokhu kubucayi futhi kufanele kubhekwe.
Izimbobo Nezikhala Ezingagxiliwe (NPTH):
- I-Non-Plated Slot Hole Isikhala: Isikhala esincane kufanele sibe okungenani ngu-1.6mm, noma singabangela ingozi eyengeziwe yezimbobo eziphukile kanye nobunzima bokugaya onqenqemeni.
- Ibanga ukusuka ezikhaleni ezinganapuliwe ukuya onqenqemeni lwebhodi akufanele libe ngaphansi kuka-2.0mm ukuze kugwenywe izimbobo eziphukile. Izikhala ezinde kufanele zibe nebanga elikhulu ukusuka onqenqemeni lwebhodi ukuvimbela ukuhlukana onqenqemeni.
- Imigodi Engenazitembu Engagxiliwe: Ukuze kuhlanganiswe amabhodi ndawonye, lezi zimbobo kufanele zihlukaniswe zingabi zincane kakhulu noma zibe zinkulu kakhulu ukugwema ukuphula ibhodi. Isikhala esinconywayo ngokuvamile siphakathi kuka-0.2-0.3mm.
Umthelela Wokuthembeka Wezikhala Zezimbobo:
Isikhala seHole-to-Hole:
Lokhu kubhekisela ebangeni elisuka odongeni olungaphakathi lwembobo ukuya odongeni lwangaphakathi lenye, hhayi ibanga eliphakathi kwamaphedi. Kubalulekile ukuhlukanisa phakathi kwalezi zilinganiso.
Uma isikhala sembobo nembobo sisincane kakhulu, yiziphi izinkinga ezingaba khona?
- Uma izimbobo ezingaphakathi kwenethiwekhi efanayo zisondelene kakhulu, zingabangela izimbobo eziphukile, ama-burrs, nokunye ukukhubazeka okuthinta ukubukeka nokuhlanganisa.
- Ngezimbobo kumanethiwekhi ahlukene, isikhala esinganele singabangela izimbobo eziphukile, ama-burrs, noma amasekhethi amafushane ngenxa umphumela we-capillary.
I-Capillary Effect (I-Chip Sucking Effect): Umthelela we-capillary wenzeka ngenxa yokuzungezisa ngesivinini esikhulu sebhithi yokubhoboza kanye nokucindezela okwenzayo ezintweni ezizungezile ze-PCB. Lokhu kungakhulula i-fiberglass ngaphakathi kwebhodi, okuholela ezindabeni ezifana nokungakhiwanga kahle kwemigodi namasekhethi amafushane lapho i-copper plating ingena kulezi zindawo ezixekethile.
Ngokuvumelana ne IPC-A-600G imihlahlandlela:
Ngomphumela we-capillary, B akufanele kuncishiswe isikhala sokulandelela ngaphansi kwenani elincane elidingekayo ngokucaciswa kokuthengwa kwempahla, futhi A akufanele idlule u-80mm (3.150in). Okufanayo kuyasebenza ekukhaleni kwemigodi.
Omunye umphumela ongemuhle odalwa ukuvaleka kwezimbobo eziqinile yi- I-CAF (I-Conductive Anodic Filamentation) umphumela:
- Umphumela we-CAF: Isho ama-ion ethusi ahambayo eduze kwama-microcracks ku-resin noma i-fiberglass phakathi kwamakhondatha ngaphansi kwezimo ze-voltage ephezulu nezimo zezinga lokushisa, okuholela ekuvuzeni kwemisinga.
- Lokhu kwenzeka lapho i-PCB/PCBA isebenza ezindaweni ezinezinga lokushisa eliphezulu nezinomswakama ophezulu, okuholela ekuhlukaniseni okungekuhle phakathi kwamakhondakta kanye namasekhethi amafushane ekugcineni. I-CAF ivamise ukwenzeka phakathi kwe-vias, noma phakathi kwe-vias nokulandela umkhondo, noma phakathi kwemikhondo yangaphandle, inciphisa ukufakwa kwe-insulation futhi iholele ekwehlulekeni.
Ukuhlolwa Kokwenziwa Kwezikhala Zezimbobo:
1. Ngenethiwekhi efanayo: Uma ama-vias amabili esondelene kakhulu ngesikhathi sokumba, ukusebenza kahle kokubhola kwe-PCB kungaba sengozini. Ngemva kokubhoboza imbobo yokuqala, izinto eziphakathi kwezimbobo zingaba zincane kakhulu, kubangele amandla angalingani ku-drill bit, ukupholisa okungaguquki, kanye nokuphuka kwe-drill bit. Lokhu kuholela ekubunjweni kwemigodi empofu noma ama-vias angaxhumekile.
2. Inethiwekhi Ehlukile Nge-: Lonke ungqimba ku-PCB ludinga iphedi enezimo zendawo ezizungezile ezithile, okufaka phakathi ukuthi amathrekhi aseduze noma cha. Uma isikhala singanele, amanye ngamaphedi angase alahlekelwe ukuxhuma kwawo ngethusi, okungase kubangele izikhindi. Ukuze ugweme lokhu, ibanga lokuphepha elingu-3 mil phakathi kwenethiwekhi ehlukene libalulekile.
3. I-Different Network Component Holes: Ukuqondanisa okuncane phakathi kokukhiqiza kungathinta isikhala phakathi kwezimbobo zezingxenye ezivela kumanethiwekhi ahlukene. Kulezi zimo, ibanga lokuphepha liqinisekiswa ngokunquma iphedi. Lokhu kunqunywa kungase kuholele ekubunjweni okungajwayelekile noma, esimweni esibi kakhulu, kubangele ukuba imbobo iphuke noma idale isifunda esifushane ngesikhathi sokusoda.
4. Izimpumputhe Nezingcwatshwa Ngezindlela:
- Izimpumputhe Vias: Lawa ama-vias axhuma izingqimba zangaphakathi kuzendlalelo zangaphandle kodwa angadluli kuyo yonke i-PCB.
- Wangcwatshwa Nge: Lezi zixhuma izendlalelo zangaphakathi kuphela futhi azibonakali ebusweni be-PCB.
Uma ukuhlukana phakathi kwe-dias engaboni noma engcwatshiwe sisincane kakhulu noma singekho, kuphumela "emgodini oyisitakiki." Idizayini ingase ibhekane nobunzima bokukhiqiza, ikakhulukazi uma indawo ye-vias ingakuvumeli ukuxhumana okufanele. Ezimweni ezinjalo, inqubo ekhethekile iyadingeka ukuqinisekisa ukuthi i-vias ixhunywe ngogesi ngemva kokubhoboza. Lokhu kuhilela ukuqedela ukungcwatshwa ngokubhoboza ngaphambi kokucwenga bese ubhoboza izimbobo eziyimpumputhe.
