Ngokuhlangenwe nakho kweminyaka engaphezu kwengu-20 kule mboni, singanikeza izixazululo zokuma okukodwa kumakhasimende okuhlanganisa ukwakhiwa kwe-PCB, ukuthengwa kwezingxenye kanye nezinsizakalo ze-PCB Assembly. Ngenxa yemithetho neziqondiso eziqinile zokukhiqiza, ukwandisa ulwazi lwezobuchwepheshe nomdlandla wokulwela ukuthola ubuchwepheshe bamuva nje, siqongelele amakhono amaningi okubhekana nezinhlobo ezahlukene zamaphakheji ezingxenye ezifana ne-BGA, i-PBGA, i-Flip chip, i-CSP, ne-WLCSP.

BGA

I-BGA, emfushane ngohlelo lwegridi yebhola, iwuhlobo lwephakheji ye-SMT (Surface Mount Technology) elisetshenziswa kakhulu kumasekethe ahlanganisiwe (ICs). I-BGA inenzuzo ekuthuthukiseni ukwethembeka okuhlangene kwe-solder.

I-BGA ibonisa izinzuzo ezilandelayo:

• Ukusebenzisa kahle isikhala se-PCB

Iphakheji ye-BGA ibeka uxhumo ngaphansi kwephakheji ye-SMD (Surface Mount Device) esikhundleni sokuyizungezile ukuze kugcinwe isikhala kakhulu.

• Intuthuko mayelana nokusebenza okushisayo nogesi

Njengoba iphakheji ye-BGA isiza ukunciphisa ukungena kwamandla kanye nezindiza zomhlabathi kanye nemigqa yesignali elawulwa yi-impedance, ukushisa kungasuswa kude nephedi, kunenzuzo ekushiseni kokushisa.

• Ukwenyuka kwesivuno sokukhiqiza

Ngenxa yenqubekelaphambili yokuthembeka kwe-solder, i-BGA ingagcina isikhala esikhulu phakathi kokuxhunywa nokuthengiswa kwekhwalithi ephezulu.

• Ukunciphisa ukushuba kwephakheji

Sisebenza ngokukhethekile ekusingatheni ingxenye yephimbo elihle futhi kuze kube manje singakwazi ukubhekana nama-BGA lapho iphimbo lawo elincane lingaba lincane njengo-0.35mm.

Lapho ubeka i-oda eliphelele lokuhlanganisa i-PCB yokuvula mayelana nephakheji ye-BGA, onjiniyela bethu, okokuqala, bazobheka amafayela akho e-PCB nemininingwane ye-BGA ukuze bafingqe iphrofayili eshisayo lapho izici okufanele zicatshangelwe njengosayizi we-BGA, into yebhola njll. imvume, njll.

Ngenxa yezimpawu zephakheji ye-BGA, Ukuhlola Okuzenzakalelayo Okuzenzakalelayo (AOI) kwehluleka ukuhlangabezana nezidingo zokuhlola. Sihlola i-BGA ngemishini ye-Automated X-ray Inspection (AXI) ekwazi ukuhlola ukonakala kwe-solder kusenesikhathi ngaphambi kokukhiqiza umthamo.

I-PBGA

I-PBGA, emfishane kuhlelo lwegridi yebhola lepulasitiki, ingenye yamafomu okupakisha adume kakhulu kumadivayisi e-I/O asezingeni eliphakathi nendawo ukuya phezulu. Kuye nge-laminate substrate equkethe izingqimba zethusi ezengeziwe ngaphakathi, i-PBGA inenzuzo ekulahlekeni kokushisa futhi ingabhekana nobukhulu bomzimba obukhulu kanye nenani lamabhola ukuze kuhlangatshezwane nezimfuneko ezibanzi.

I-PBGA ibonisa izinzuzo ezilandelayo:

• Idinga inductance ephansi

• Ukwenza ukukhweza phezulu kube lula

• Izindleko eziphansi uma kuqhathaniswa

• Ukugcina ukuthembeka okuphezulu uma kuqhathaniswa

• Ukunciphisa izinkinga ze-coplanar

• Ukuthola ukusebenza kwezinga eliphezulu kokushisayo nogesi

Phenya i-chip

Njengendlela yokuxhuma ugesi, i-flip chip ixhuma i-die and package substrate ngokubheka phansi ngokuqondile i-IC ukuze iyenze inamathiselwe ku-substrate, ibhodi lesifunda noma inkampani yenethiwekhi. Izinzuzo ze-flip chip zihlanganisa:

• Ukunciphisa inductance yesiginali namandla/ground inductanc

• Ukunciphisa inani lezikhonkwane zephakheji kanye nosayizi wefa

• Ukwandisa ukuminyana kwesignali

I-CSP ne-WLCSP

Kuze kube manje, i-CSP iwuhlobo lwakamuva lwephakheji, emfushane ngephakheji yesikali se-chip. Njengoba incazelo yegama layo ibonisa, i-CSP ibhekisela ephaketheni usayizi walo ofana nowe-chip enamaphutha aphathelene nama-chips angenalutho. I-CSP inikeza isixazululo sokupakisha esiminyene futhi esilula, esishibhile futhi esisheshayo. Futhi izici ezilandelayo ze-CSP zisiza ukuholela ekwandeni kwesivuno somhlangano kanye nezindleko eziphansi zokukhiqiza.

I-CSP idume kakhulu futhi isebenza kahle kulo mkhakha kangangokuthi kuze kube manje kunezinhlobo ezingaphezu kuka-50 zama-CSP emndenini wayo futhi inani lisakhula nsuku zonke. Izimfanelo eziningi nezici ze-CSP zinomthelela ekudumeni kwayo okubanzi kulo mkhakha:

• Ukwehliswa kosayizi wephakheji

I-CSP ingathola ukusebenza kahle kokupakisha okufika ku-83% noma ngaphezulu, okwandisa kakhulu ukuminyana kwemikhiqizo.

• Ukuziqondanisa ngokwakho

I-CSP iyakwazi ukuziqondanisa yona ngokwayo kunqubo yokugeleza kabusha kokuhlanganiswa kwe-PCB ukuze yenze i-SMT ibe lula.

• Ukuntuleka kwemikhondo egobile

Ngaphandle kokubamba iqhaza kwemikhondo egobile, izinkinga ze-coplanar zingancishiswa kakhulu.

I-WLCSP, emfushane ngephakheji yesikali se-wafer level chip, iwuhlobo lwangempela lwe-CSP njengoba iphakheji layo eliqediwe libonisa usayizi wesikali se-chip. I-WLCSP ibhekisela kubuchwepheshe bokupakisha be-IC ezingeni le-wafer. Idivayisi ene-WLCSP iyidayizi lapho amabhola amaningi noma amabhola e-solder ahlelwa khona endaweni ye-I/O, ehlangabezana nezimfuneko zezinqubo zokuhlanganisa zebhodi lesifunda.

Izinzuzo ze-WLCSP zifaka phakathi:

• I-inductance isuka ku-Die iye ku-PCB incane kakhulu;

• Usayizi wephakheji wehliswa kakhulu njengoba idigri yokuminyana ithuthukisiwe;

• Ukusebenza kwe-Thermal conduction kuthuthukiswa kakhulu.

Kuze kube manje, siyakwazi ukubhekana ne-WLCSP kokubili ubuncane be-In-Die pitch kanye ne-Across-Die pitch engafinyelela ku-0.35mm.

0201 futhi 01005

Njengoba imakethe ye-elekthronikhi nemikhiqizo ithuthuka, umkhuba okhulayo wokwenziwa kancane komakhalekhukhwini, amakhompyutha aphathekayo njll. uhlale ushayela izingxenye ezinosayizi abancane. Ukuze sixhumanise nalo mkhuba, besenza imizamo yokukhulisa amandla okuhlanganisa izingxenye kufika ku-0201 naku-01005.

Kuze kube manje, kokubili 0201 kanye 01005 zithandwa kakhulu emakethe electronic ngenxa yezinzuzo ezilandelayo:

• Usayizi omncane obenza bamukeleke emikhiqizweni yokugcina ebambezeleke emkhathini;

• Ukusebenza okuhle kakhulu ekuthuthukisweni kokusebenza kwemikhiqizo kagesi;

• Ihambisana nezidingo zokuminyana okuphezulu kwemikhiqizo yesimanje ye-elekthronikhi;

• Izinhlelo zokusebenza ezinesivinini esikhulu.

Ukuze kuzuzwe amandla okuhlanganisa ka-01005, siphumelele ekusebenzelaneni nezici eziphathelene nenqubo yokuhlanganisa okuhlanganisa ukwakheka kwe-PCB, izingxenye, unamathisele we-solder, ukukhetha nokubeka, ukugeleza kabusha, i-stencil nokuhlola. Umuzwa wethu weminyaka engu-20+ usisiza ukuthi sifingqe ukuthi ngokwezinkinga zangemuva kokugeleza kabusha, uma kuqhathaniswa nezingxenye nezinye izinhlobo zamaphakheji, izingxenye ezipakishwe ngo-01005 zisebenza kangcono ekuqedeni udaba olufana nokuvala ibhuloho, itshe lethuna, ukuma konqenqema, ukubheke phansi, ingxenye engekho njll.

Siyakwazi ukuphatha izinhlobo ezahlukene zamaphakeji kunqubo yokuhlanganisa ye-PCB futhi isiqephu esingenhla siyehluleka ukubonisa wonke. Uma ifomu lakho lephakheji lengxenye edingekayo lingashiwongo ngenhla, sicela ungangabazi ukusithola ku [i-imeyili ivikelwe] ngamakhono ethu okuphatha amaphakheji anwetshiwe.