Inani eliphakeme kakhulu lama-PCB
Amabhodi esekethe kufanele amelane nelangabi futhi awakwazi ukuvutha ezingeni elithile lokushisa, kodwa angathamba kuphela. Iphuzu lokushisa ngalesi sikhathi libizwa ngokuthi izinga lokushisa lokushintsha kwengilazi (iphuzu le-Tg), futhi leli nani lihlobene nokuzinza kwe-dimensional yebhodi le-PCB. Ukuphakama kwevelu ye-TG, kuba ngcono ukumelana nezinga lokushisa kwe-PCB
Lapho izinga lokushisa likhuphukela endaweni ethile, i-substrate izoshintsha isuka "kwisimo sengilazi" ibe "isimo senjoloba", futhi lokhu kushisa kubizwa ngokuthi izinga lokushisa lokushintsha kwengilazi yeshidi (Tg). Ngamanye amazwi, i-Tg izinga lokushisa eliphakeme kakhulu (℃) lapho izinga lokushisa le-substrate ligcinwa khona. Okusho ukuthi, izinto ezijwayelekile ze-PCB substrate ngeke nje zikhiqize ukuguquguquka, ukuncibilika nezinye izenzakalo emazingeni okushisa aphezulu, kodwa futhi nokwehla okubukhali kwezakhiwo zemishini nezikagesi.
Ukwanda kwe-Tg ye-substrate kuzoqinisa futhi kuthuthukise izici zokumelana nokushisa kwebhodi lesifunda eliphrintiwe, ukumelana nomswakama, ukumelana namakhemikhali, nokuzinza kokumelana. Lapho inani le-TG liphakeme, izinga lokushisa elingcono kanye nezinye izici zebhodi, ikakhulukazi kunqubo yokukhiqiza engenawo umthofu, i-Tg ephezulu isetshenziswa kabanzi.
I-High Tg isho ukumelana nokushisa okuphezulu. Ngokuthuthuka okusheshayo kwemboni yezogesi, ikakhulukazi imikhiqizo ye-elekthronikhi emelwe amakhompiyutha, ukuthuthukiswa okubheke ekusebenzeni okuphezulu kanye nongqimba oluningi oluphezulu kudinga ukumelana nokushisa okuphezulu kwezinto ze-PCB substrate njengesiqinisekiso esibalulekile. Ukuvela nokuthuthukiswa kobuchwepheshe bokukhweza obunokuminyana okuphezulu okumelelwe i-SMT ne-CMT kwenze ama-PCB ancika kakhulu ekusekelweni kokumelana nokushisa okuphezulu kwama-substrates ngokwemibhobho emincane, amasekhethi amahle, kanye nokuba mncane.
Ngakho-ke, umehluko phakathi kokujwayelekile kwe-FR-4 kanye ne-high-Tg FR-4 ukuthi esimweni esishisayo, ikakhulukazi uma kushisa ngemva kokumuncwa komswakama, amandla emishini, ukuzinza kwe-dimensional, ukunamathela, ukumuncwa kwamanzi, ukubola okushisayo, ukunwetshwa okushisayo nezinye izimo zezinto ezihlukile. Imikhiqizo ye-High-Tg ngokusobala ingcono kunezinto ezijwayelekile ze-PCB substrate.
Kungani High-Tg PCB?
I-PCB ephezulu ye-Tg, okungukuthi, lapho izinga lokushisa likhuphukela ebangeni elithile, i-substrate ishintsha isuka "eqinile" ibe "isimo senjoloba", futhi leli phuzu lokushisa libizwa ngokuthi izinga lokushisa le-glass transition (Tg) lebhodi lesifunda.
I-Tg imele izinga lokushisa elidingekayo ukuze okokusebenza kushintshe ukusuka “kokuqinile” kuye kokuthi “isimo senjoloba”, kukalwa ngamadigri Celsius. Ngokuvamile, i-Tg yezinto ezibonakalayo ingaphezu kuka-130°C, kuyilapho i-Tg ephakeme ivamise ukuba ngaphezu kuka-170°C, futhi i-Tg ephakathi icishe ibe ngu-150°C. Ama-PCB ane-Tg ka-170°C noma ngaphezulu ngokuvamile abizwa ngokuthi ama-Tg PCB aphezulu.
Ukuziphatha okuphezulu okuphezulu
Izinto ze-Tg eziphezulu zinokusebenza okuphezulu kwe-thermal futhi zingakhipha ukushisa ngempumelelo kakhulu. Le ndawo isiza ukuthuthukisa ukuzinza nokuthembeka kwemishini kagesi, ikakhulukazi ezindaweni zokusebenza ezisezingeni eliphezulu.
Ukumelana nokushisa okuphezulu
Ukuphakama kwevelu ye-Tg, kuba ngcono ukumelana nokushisa kwempahla. Izinto ze-High Tg zingagcina ukusebenza kahle nokuzinza ezindaweni ezinezinga lokushisa eliphezulu futhi zifanele izindawo zokusebenza ezinezinga eliphezulu lokushisa.
Izakhiwo eziphambili kakhulu
Izinto ze-Tg eziphezulu zinamandla aphezulu nokuqina futhi zingamelana nokucindezeleka okukhulu kwemishini. Lesi sakhiwo sivumela izinto ze-Tg eziphezulu ukuthi zigcine ukusebenza okuzinzile ngisho nasezimeni ezinzima zemvelo.
Izici ezinhle zikagesi:
Izinto ezisetshenziswayo ze-Tg eziphakeme zine-dielectric constants ephansi kanye nama-tangents okulahlekelwa, okusiza ukuthuthukisa ikhwalithi yokudlulisela isignali nokuhambisana kwe-electromagnetic. Lokhu kubaluleke kakhulu ezinhlelweni zokudlulisa amasignali ezinesivinini esikhulu kanye nesivinini esikhulu.
I-Common High-Tg PCB Material
izinto | izindlela | I-IT-180ATC |
Tg (℃) | I-DSC | 175 |
T-288 (w/ 1oz Cu, min) | TMA | 20 |
Td-5%(℃ ) | TGA 5% ukulahlekelwa | 345 |
I-CTE (ppm/℃) | a1/a2 | 45/210 |
I-CTE (%), 50-260 ℃ | TMA | 2.7 |
Dk @ 1 GHz (RC 50%) | IPC TM-650 2.5.5.13 | 4.1 |
Df @ 1 GHz (RC 50%) | IPC TM-650 2.5.5.13 | 0.017 |
I-CTI (Ama-Volts) | I-IEC 60112 / UL 746 | I-CTI 3 (175-249) |
| izinto | Indlela | Isimo | Unit | Value ejwayelekile | |
|---|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.24.4 | I-DMA | ℃ | 200 | |
| Tg | TMA | ℃ | 170 | ||
| Td | IPC-TM-650 2.4.24.6 | 5% wt. ukulahlekelwa | ℃ | 350 | |
| I-CTE (Z-axis) | IPC-TM-650 2.4.24 | Ngaphambi kwe-Tg | ppm/℃ | 45 | |
| Ngemuva kwe-Tg | ppm/℃ | 210 | |||
| I-50-260 ℃ | % | 2.3 | |||
| T260 | IPC-TM-650 2.4.24.1 | TMA | imiz | > 60 | |
| T288 | IPC-TM-650 2.4.24.1 | TMA | imiz | 45 | |
| Ukucindezeleka Okushisayo | IPC-TM-650 2.4.13.1 | 288 ℃, idiphu ye-solder | s | > 100 | |
| Ukumelana Nomthamo | IPC-TM-650 2.5.17.1 | Ngemuva kokumelana nomswakama | MΩ.cm | I-2.5E + 08 | |
| E-24/125 | MΩ.cm | I-1.9E + 06 | |||
| Ukuphinda Usungulwe | IPC-TM-650 2.5.17.1 | Ngemuva kokumelana nomswakama | MΩ | I-3.3E + 07 | |
| E-24/125 | MΩ | I-2.4E + 06 | |||
| I-Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 146 | |
| Ukuhlukaniswa kweDielectric | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | > 45 | |
| I-Disipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1GHz | - | 4.6 | |
| IPC-TM-650 2.5.5.9 | 1MHz | - | 4.8 | ||
| I-Disipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1GHz | - | 0.015 | |
| IPC-TM-650 2.5.5.9 | 1MHz | - | 0.009 | ||
| Amandla e-Peel (1oz HTE ucwecwe lwethusi) | IPC-TM-650 2.4.8 | A | N / mm | - | |
| Ngemuva kwe-thermal Stress 288℃,10s | N/mm[lb/in] | I-1.25 [7.14] | |||
| 125 ℃ | N / mm | - | |||
| Amandla weFlexural | LW | IPC-TM-650 2.4.4 | A | MPA | 530 |
| CW | IPC-TM-650 2.4.4 | A | MPA | 410 | |
| Ukunwa kwamanzi | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.07 | |
| CTI | IEC60112 | A | Isilinganiso | PLC 3 | |
| Ukuvutha | I-UL94 | C-48/23/50 | Isilinganiso | I-V-0 | |
| E-24/125 | Isilinganiso | I-V-0 | |||
Amazwana:
1. Ishidi lokucaciswa: IPC-4101/126, elereferensi yakho kuphela.
2. Lonke inani elijwayelekile lisuselwe kusifanekiso esingu-1.6mm(16*2116).
| izinto | Indlela | Isimo | Unit | Value ejwayelekile | |
|---|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.25 | I-DSC | ℃ | 180 | |
| IPC-TM-650 2.4.24.4 | I-DMA | ℃ | 185 | ||
| Td | IPC-TM-650 2.4.24.6 | 5% wt. ukulahlekelwa | ℃ | 345 | |
| I-CTE (Z-axis) | IPC-TM-650 2.4.24 | Ngaphambi kwe-Tg | ppm/℃ | 45 | |
| Ngemuva kwe-Tg | ppm/℃ | 220 | |||
| I-50-260 ℃ | % | 2.8 | |||
| T260 | IPC-TM-650 2.4.24.1 | TMA | imiz | 60 | |
| T288 | IPC-TM-650 2.4.24.1 | TMA | imiz | 20 | |
| T300 | IPC-TM-650 2.4.24.1 | TMA | imiz | 5 | |
| Ukucindezeleka Okushisayo | IPC-TM-650 2.4.13.1 | 288 ℃, idiphu ye-solder | - | I-100S Akukho Delamination | |
| Ukumelana Nomthamo | IPC-TM-650 2.5.17.1 | Ngemuva kokumelana nomswakama | MΩ.cm | 2.2 x 108 | |
| E-24/125 | MΩ.cm | 4.5 x 106 | |||
| Ukuphinda Usungulwe | IPC-TM-650 2.5.17.1 | Ngemuva kokumelana nomswakama | MΩ | 7.9 x 107 | |
| E-24/125 | MΩ | 1.7 x 106 | |||
| I-Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 100 | |
| Ukuhlukaniswa kweDielectric | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | 63 | |
| I-Disipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1MHz | - | 4.8 | |
| IEC 61189-2-721 | 10GHz | - | - | ||
| I-Disipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1MHz | - | 0.013 | |
| IEC 61189-2-721 | 10GHz | - | - | ||
| Amandla Ekhasi (1Oz HTE ucwecwe lwethusi) | IPC-TM-650 2.4.8 | A | N / mm | - | |
| Ngemuva kwe-thermal Stress 288℃,10s | N / mm | 1.38 | |||
| 125 ℃ | N / mm | 1.07 | |||
| Amandla weFlexural | LW | IPC-TM-650 2.4.4 | A | MPA | 562 |
| CW | IPC-TM-650 2.4.4 | A | MPA | 518 | |
| Ukunwa kwamanzi | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.10 | |
| CTI | IEC60112 | A | Isilinganiso | PLC 3 | |
| Ukuvutha | I-UL94 | C-48/23/50 | Isilinganiso | I-V-0 | |
| E-24/125 | Isilinganiso | I-V-0 | |||
Amazwana:
- Ishidi lokucaciswa: IPC-4101/126, elereferensi yakho kuphela.
- Lonke inani elijwayelekile lisuselwe kusifanekiso esingu-1.6mm, kuyilapho i-Tg ingeyesampula≥0.50mm.
Incazelo: C=Isimo somswakama, D=Isimo sokucwiliswa emanzini acwengekile, E=Isimo sezinga lokushisa
Idijithi yokuqala elandela uhlamvu ikhombisa ubude besikhathi sesimo sangaphambilini ngamahora, idijithi yesibili izinga lokushisa langaphambili ku-℃ kanye nedijithi yesithathu umswakama ohlobene.
| izinto | Indlela | Isimo | Unit | Value ejwayelekile | |
|---|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.25 | I-DSC | ℃ | 180 | |
| IPC-TM-650 2.4.24.4 | I-DMA | ℃ | 185 | ||
| Td | IPC-TM-650 2.4.24.6 | 5% wt. ukulahlekelwa | ℃ | 355 | |
| I-CTE (Z-axis) | IPC-TM-650 2.4.24 | Ngaphambi kwe-Tg | ppm/℃ | 41 | |
| Ngemuva kwe-Tg | ppm/℃ | 208 | |||
| I-50-260 ℃ | % | 2.4 | |||
| T260 | IPC-TM-650 2.4.24.1 | TMA | imiz | > 60 | |
| T288 | IPC-TM-650 2.4.24.1 | TMA | imiz | 30 | |
| T300 | IPC-TM-650 2.4.24.1 | TMA | imiz | 15 | |
| Ukucindezeleka Okushisayo | IPC-TM-650 2.4.13.1 | 288 ℃, idiphu ye-solder | s | > 100 | |
| Ukumelana Nomthamo | IPC-TM-650 2.5.17.1 | Ngemuva kokumelana nomswakama | MΩ.cm | 8.7 E+08 | |
| E-24/125 | MΩ.cm | 7.2 E+06 | |||
| Ukuphinda Usungulwe | IPC-TM-650 2.5.17.1 | Ngemuva kokumelana nomswakama | MΩ | 2.2 E+07 | |
| E-24/125 | MΩ | 8.6 E+06 | |||
| I-Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 133 | |
| Ukuhlukaniswa kweDielectric | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | > 45 | |
| I-Disipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1GHz | - | 4.6 | |
| IPC-TM-650 2.5.5.9 | 1MHz | - | 4.9 | ||
| I-Disipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1GHz | - | 0.018 | |
| IPC-TM-650 2.5.5.9 | 1MHz | - | 0.015 | ||
| Amandla e-Peel (1oz HTE ucwecwe lwethusi) | IPC-TM-650 2.4.8 | A | N / mm | - | |
| Ngemuva kwe-thermal Stress 288℃,10s | N/mm[lb/in] | I-1.3 [7.43] | |||
| 125 ℃ | N / mm | ||||
| Amandla weFlexural | LW | IPC-TM-650 2.4.4 | A | MPA | 567 |
| CW | IPC-TM-650 2.4.4 | A | MPA | 442 | |
| Ukunwa kwamanzi | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.08 | |
| CTI | IEC60112 | A | Isilinganiso | PLC 3 | |
| Ukuvutha | I-UL94 | C-48/23/50 | Isilinganiso | I-V-0 | |
| E-24/125 | Isilinganiso | I-V-0 | |||
Amazwana:
1. Ishidi lokucaciswa: IPC-4101/126, elereferensi yakho kuphela.
2. Lonke inani elijwayelekile lisuselwe kusifanekiso esingu-1.6mm(8*7628).
| Property | Amanani ajwayelekile |
|---|---|
| Tg (DMA) | 190 ° C |
| I-Tg (DSC) | 180 ° C |
| I-Tg (TMA) | 170 ° C |
| I-Td (TGA) | 340 ° C |
| I-CTE z-axis (50 ukuya ku-260 °C) | 2.7% |
| T-260/ T288 | >60 min/ >15 min |
| Izimvume @1GHz(RC 50%) | 4.3 |
| I-Loss Tangent @1GHz(RC 50%) | 0.018 |
- Izimvume Zemboni
- I-IPC-4101E Uhlobo Lwegama : /98, /99, /101, /126
- I-IPC-4101E/126 Amasevisi Okuqinisekisa I-QPL Aqinisekisiwe
- I-UL Designation – ANSI Ibanga: FR-4.0
- Inombolo yefayela ye-UL: E189572
- Isilinganiso sokuvutha: 94V-0
- Izinga Lokushisa Eliphezulu Lokusebenza: 130°C
- Ukutholakala Okujwayelekile
- Ubukhulu: 0.002”[0.05mm] ukuya ku-0.062”[1.58mm], butholakala ngeshidi noma ngephaneli
- I-Copper Foil Cladding: 1/8 kuya ku-12oz (HTE) yokwakha; I-1/8 ukuya ku-3oz (HTE) yezinhlangothi ezimbili kanye no-H ukuya ku-2oz (MLS)
- Prepregs: Itholakala ngomqulu noma ngephaneli
- Izitayela Zengilazi: 106, 1080, 2113, 2116, 1506 kanye ne-7628 njll.