Kwabaqalayo, kukhona “izendlalelo” eziningi kumabhodi esekethe e-PCB, futhi abaqalayo abaningi badidwa kalula izendlalelo ze-PCB ezihlukahlukene lapho befunda ukwakheka kwe-PCB. Ngezansi, vumela unjiniyela afingqe incazelo yezendlalelo ezehlukene ekwakhiweni kwe-PCB ukuze usize abasaqalayo ukuthi baqonde kangcono futhi bazi kahle. Kunezincazelo eziningi ezahlukene zamatemu akhethekile esoftware ye-EDA. Okulandelayo yincazelo yezincazelo ezingaba khona zamagama.
Imishini: Ngokujwayelekile isho ungqimba lokumaka oluyi-dimensional lomshini wamapuleti.
Gcina isendlalelo: Ichaza izindawo lapho izintambo, izimbobo (nge) noma izingxenye zingakwazi ukuhanjiswa. Le mikhawulo ingachazwa ngokuzimela komunye nomunye.
Top imbondela: ichaza izinhlamvu zesikrini sikasilika kungqimba olungaphezulu, okuyizinombolo zezingxenye nezinye izinhlamvu namafreyimu esikrini sikasilika esivame ukukubona ku-PCB.
Imbondela engezansi: ichaza ungqimba olungezansi lwezinhlamvu zesikrini sikasilika, okuyinombolo yengxenye nezinye izinhlamvu esivame ukuzibona ku-PCB, kanye nohlaka lwesikrini sikasilika.
Ukunamathisela okuphezulu: Isendlalelo esiphezulu sidinga ukuveza ingxenye ye-solder paste esikhumbeni sethusi.
Okunamathiselwe phansi: Isendlalelo esingezansi kufanele sivezwe ku-solder unama phezu kwethusi.
Top i-solder: Lokhu kufanele kubhekisele kungqimba oluphezulu lwe-soldermask ukuze kugwenywe ukufinyezwa kwe-circuiting ngokungazi ngesikhathi sokwenziwa noma ukulungiswa kwesikhathi esizayo.
Imishini: Ngokujwayelekile isho ungqimba lokumaka oluyi-dimensional lomshini wamapuleti.
Gcina isendlalelo: Ichaza izindawo lapho izintambo, izimbobo (nge) noma izingxenye zingakwazi ukuhanjiswa. Le mikhawulo ingachazwa ngokuzimela komunye nomunye.
Imbondela ephezulu: ichaza izinhlamvu zesikrini sikasilika kungqimba olungaphezulu, okuyizinombolo zezingxenye nezinye izinhlamvu namafreyimu esikrini sikasilika esivame ukukubona ku-PCB.
Bottom ukuguqa : ichaza ungqimba olungezansi lwezinhlamvu zesikrini sikasilika, okuyinombolo yengxenye nezinye izinhlamvu esivame ukuzibona ku-PCB, kanye nohlaka lwesikrini sikasilika.
Ukunamathisela okuphezulu: Isendlalelo esiphezulu sidinga ukuveza ingxenye ye-solder paste esikhumbeni sethusi.
Okunamathiselwe phansi: Isendlalelo esingezansi kufanele sivezwe ku-solder unama phezu kwethusi.
Top i-solder: Lokhu kufanele kubhekisele kungqimba oluphezulu lwe-soldermask ukuze kugwenywe ukufinyezwa kwe-circuiting ngokungazi ngesikhathi sokwenziwa noma ukulungiswa kwesikhathi esizayo.
Ukunamathisela okuphezulu: Yilokhu okusetshenziselwa ukuvula i-stencil yemephu yongqimba ephezulu.
Okunamathiselwe phansi: Yilokhu okusetshenziselwa ukuvula i-stencil yesendlalelo esingezansi.
Isendlalelo esiphezulu: Lesi isendlalelo esiphezulu somzila wezintambo.
Bottom Isendlalelo: Lesi isendlalelo esingezansi.
Amagama ezingqimba zangaphakathi ayahlukahluka kuye ngemikhuba ngayinye. Ngokuvamile, ungqimba lwezintambo luyi-S1, i-S2 njalonjalo, isendlalelo samandla Amandla, futhi ungqimba lomhlabathi yi-Gnd.
UDkt. Isho isendlalelo sokumba, futhi imigodi yokumba ihlukaniswa ngemigodi, imigodi engeyona eyensimbi nangaphezulu kwemigodi. Imigodi yokumba ihlukaniswa njengemigodi, imigodi engeyona eyensimbi kanye nezimbobo ezingaboni. Ngokuvamile, igama lesendlalelo lithi drl elisho ngezimbobo, i-Npth yezimbobo ezingezona ezensimbi, futhi izimbobo ezingaboni ziqanjwe ngokwengqimba ezixhunywe kuyo, isb.
