Yintoni iNkqubo yokuFakwa kwePCB?

Njengomthwali wamacandelo e-elektroniki, iPCB idlala indima ebalulekileyo kushishino lokwenziwa kombane. Inkqubo yokuveliswa kwayo iyinkimbinkimbi kwaye ichanekile, ichaphazela ngokuthe ngqo ukusebenza kunye nomgangatho wemveliso yokugqibela. I-WonderfulPCB, umzi-mveliso othembekileyo we-SMT, unikezela ngohlalutyo oluneenkcukacha lwenkqubo yokuvelisa i-PCB ukunceda abavelisi bezinto zombane kunye namaqela okuthenga aqonde ngcono.

Isishwankathelo seNkqubo yeMveliso yePCB

Inkqubo yokuvelisa i-PCB inokwahlulwa ibe ngamanqanaba angundoqo aliqela: ukwenziwa kwe-layer yangaphakathi, i-lamination, i-drilling, i-metallization, i-metallization yangaphandle, ukukhuselwa komphezulu, kunye nokuhlolwa kokugqibela kunye nokupakishwa. Inyathelo ngalinye libandakanya iindlela ezahlukeneyo zobugcisa, ezifuna inqanaba eliphezulu lokuchaneka kunye nobuchule.

I-Inner Layer Fabrication

Iileya zangaphakathi zingundoqo we-PCB, ezidibanisa amacandelo e-elektroniki. Inkqubo ibandakanya:

Ukusika ipleyiti yobhedu

  • Ukusika iBhodi: Ukusika i-substrate ye-PCB yoqobo ukuya kubungakanani obufunekayo kwimveliso.
  • Unyango kwangaphambili: Ukucoca i-substrate surface ukususa ioli, i-oxides, kunye nezinye izinto ezingcolileyo, ukuqinisekisa inkqubela phambili egudileyo kumanyathelo alandelayo.
  • I-Lamination: Ukusebenzisa umgca wefilimu eyomileyo kwindawo ye-substrate, eya kudlulisela iphethini yesiphaluka ngexesha lokuvezwa.
  • Ukuboniswa: Ukusebenzisa ukukhanya kwe-ultraviolet ukuveza ibhodi elaminethiweyo, ukuhambisa iphethini yesekethe eyenzelwe kwifilimu eyomileyo.
  • Ukuphuhlisa, ukuEtching, kunye nokuHluba: Ukususa iindawo ezingabonakaliyo zefilimu eyomileyo ngophuhliso, emva koko ucofa umgca wobhedu ongakhuselekanga, kwaye ekugqibeleni ususe ifilimu eyomileyo eseleyo ukwenza isiphaluka sangaphakathi sangaphakathi.
  • I-AOI (Uhlolo oluzenzekelayo lwaMacho): Ukujonga umgangatho wesekethe yangaphakathi yomaleko ukuqinisekisa ukuba akukho zijikelezo ezivulekileyo, iifutshane, okanye ezinye iziphene.

I-Lamination

I-Lamination idibanisa iileyile ezininzi zangaphakathi kwibhodi enye ye-multilayer usebenzisa izinto ze-resin. Eli nyathelo libaluleke kakhulu iiPCB ezininzi, kwaye inkqubo ibandakanya:

  • I-oxide emdaka: Ukwandisa ukunamathela phakathi kweengqimba kunye nokuphucula ukumanzisa kwendawo yobhedu.
  • Ukufakwa: Ukubeka iisekethe zangaphakathi kunye namaphepha ePP (Prepreg) ngokweemfuno zoyilo.
  • Ukucindezela: Ukusebenzisa ubushushu obuphezulu kunye noxinzelelo lokudibanisa iileya kwibhodi enye ye-multilayer.
  • Ukugrunjwa okucetyiweyo, uKuhamba, kunye nokuSila emdeni: Ukunciphisa ibhodi elaminethiweyo ukususa izinto ezingaphezulu kunye nokufezekisa imilinganiselo yoyilo.

ukubhola

Ukugaya kuyimfuneko ukudala ngemingxuma okanye imingxuma eyimfama yokudibanisa umbane kunye nokufakwa kwecandelo. Inkqubo ibandakanya:

  • ukubhola: Ukusebenzisa umatshini wokugaya ukwenza imingxuma ngokwemigaqo yoyilo.
  • Ukuhlawulelwa: Ukususa i-burrs eyenziwe ngexesha lokomba ukuqinisekisa iindonga ezigudileyo zomngxuma.

PCB yokomba

Ukwenziwa kwesinyithi kumngxuma

Kweli nyathelo, umaleko obhityileyo wobhedu ufakwa kwiindonga zomngxuma wokugquma ukuze zenze isiseko sokuqhuba ukongeza ubhedu. Inkqubo ibandakanya:

  • I-PTH (iPlated ngokusebenzisa umngxuma) i-Copper Deposition: Ukufakwa kweekhemikhali umaleko wobhedu kwiindonga zomngxuma.
  • Ukuzaliswa komngxuma: Ukufaka ubhedu ngaphakathi kwemingxunya ukwenza indlela epheleleyo yokuqhuba.

Ulwaleko oluNgaphandle lweNdlela

Ulwaleko lwangaphandle lufana nolwaleko lwangaphakathi kodwa lunzima ngakumbi, njengoko lubandakanya ukwenza ipateni yesekethe kumaleko angaphandle PCB yamanqanaba amaninzi. Amanyathelo aquka:

  • Ulwaleko lwangaphandle Unyango lwangaphambili: Ukucoca umphandle wangaphandle ukususa izinto ezingcolisayo.
  • Lamination, Exposure, kunye noPhuhliso: Ukwenza ipateni yesekethe yomaleko wangaphandle nge-lamination, exposure, and development, efana nenkqubo yangaphakathi yomaleko.
  • Ukufakwa kwePatheni: Ubhedu lwe-Electroplating kwipatheni yesekethe ukujiya imikhondo.
  • Ukuhluba, ukuqhotyoshwa, kunye nokuHluba iTin: Ukususa ifilimu eyomileyo, ukutsala ubhedu olungakhuselekanga, kunye nokuhluba umaleko wetin ukuveza isekethe yokugqibela yomaleko wangaphandle.

Khuselo loKhuselo

Ukukhuselwa komphezulu kuthintela i-oxidation kunye ne-corrosion yesekethe ngelixa uphucula ukuqina. Amanyathelo aquka:

  • Imaski yeSolder: Ukufaka umaleko we-inki ye-solder ye-photo-sensitive solder, elandelwa kukuvezwa kunye nokuphuhlisa ukwenza imaski ye-solder ekhusela isiphaluka ekuthengiseni.
  • Unyango lomphezulu: Iindlela ezifana ne-nickel engena-electroless / igolide yokuntywila (ENIG) zisetyenziselwa ukukhulisa ukuqina kunye nokumelana nokubola.
  • Silkscreen Printing: Ukuprintwa kwesicatshulwa kunye neesimboli zokuzazisa ebhodini ukuze kube lula ukudibanisa kunye nokugcinwa.

Ukuhlolwa kokuGqibela kunye nokuPakisha

Uhlolo lokugqibela luqinisekisa umgangatho we-PCB, kubandakanywa ukuhlolwa kwe-AOI, ukuvavanywa kwe-flying probe, kunye nokuqinisekisa ukuba akukho zimfutshane okanye zivuliwe. Nje ukuba iibhodi ziphumelele ukuhlolwa, zipakishwe nge-vacuum, zipakishwe, kwaye zithunyelwe ngenqanawa.

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