Ukusetyenzwa kwetshiphu yendibano ye-SMT kukunye nophuhliso lweemveliso ze-elektroniki kuphuhliso oluchanekileyo oluphezulu, ulwalathiso lwepitch entle, kunye namacandelo okwenziwa kwetshiphu ye-SMT yoyilo oluncinane lwepitch kufuneka ikwazi ukuqinisekisa ukuba iipadi zePCBA azilula ukuba zimfutshane kwaye zikwathathele ingqalelo ukugcinwa kwamacandelo.
Iziphumo zokungonelanga kwezithuba zecandelo ukuya kwicandelwana;
Esinye sezikhonkwane zesinxibelelanisi secala eliPhantsi kwiPCB sisondele kakhulu kwelandelayo ngomngxunya, okukhokelela kumjikelezo omfutshane phakathi kwephini kunye nomngxuma odlulayo, kwaye iPCB itshiswe. Umgama phakathi komngxuma wokuxhoma wecandelo kunye nephedi lincinci kakhulu. Umngxuma wokutyhutyha ngokwawo uqhagamshelwe ngokuthe ngqo kwi-pad, kwaye akukho sixhathiso solder phakathi komngxuma kunye ne-pad kunye nesithuba asifanelekanga inkqubo yokuthengiswa kwamaza, okanye i-parameters ye-welding, njengesantya kunye nexesha le-welding, ayilungiswanga ngokufanelekileyo, okubangelwa ukuwelda okuqhubekayo.
Umngxuma omngxuma kunye nesithuba sephedi yokunyusela sincinci kakhulu. Umngxuma omngxuma kunye nesithuba sephedi yokunyusela sincinci kakhulu, okukhokelela ekubeni amalungu e-solder abe netoti encinci, i-welding ebandayo, ayidityaniswanga, isikhumbuzo kunye nezinye iziphene.
Iipads ezingabamelwane ziqhagamshelwe kufutshane kakhulu kumngxuma ongaphezulu, kwaye kukho umngcipheko wokuvalwa kwebhulorho kwiinkqubo ezinjengokuhamba kwakhona kwencwadana. Ukuba umngxuma wenzelwe kwi-pad, okanye i-pad isondele kumngxuma, i-solder iya kuphuma emngxunyeni ngexesha lokuphindaphinda, okubangela ukuba i-solder enganeleyo. Isiphene sokubeka umngxuma ngokuthe ngqo kwi-pad kukuba i-solder paste iyanyibilika kwaye igeleza emngxunyeni ngexesha lokuhamba kwakhona, okubangelwa ukungabikho kwe-tin kwiipads zecandelo, ngaloo ndlela yenze i-solder ebonakalayo kwaye mhlawumbi ibangele isiphaluka esifutshane.
Xa kungekho sigqumathelo sesolder phakathi kweengcingo ezidibanisa umngxuma wepads ezixhonywayo, iziphene zesolder ezifana nesolder esinesolder encinci, cold soldering, short circuits, unsoldered, kunye nemonumental soldering zingabangela. Umgama phakathi kweringi ye-solder kunye ne-BGA pad ikufutshane, kwaye nangona kukho imaski ye-solder, iringi ye-solder ayigqunywanga ngemaski ye-solder ekhokelela kwidibaniso ye-solder edityaniswe kumngxuma wokudlula. Capacitor pads kwi metal ngokusebenzisa-umngxuma ngaphandle solder imaski, okukhokelela component izikhonkwane iziphene tin, ezichaphazela ukuthembeka amacandelo. uyilo pad solder emva umngxuma, itywinwe nge-inki yokuxhathisa i-solder, i-solder joint solder virtual kwaye ayinakutshintshwa.
Ke ngoko, kubalulekile ukuqinisekisa uyilo olufanelekileyo lwepitch ngexesha lenkqubo yokubeka i-SMT. Uyilo olungonelanga lunokukhokelela kwiziphene ze-solder ezifana ne-solder ephantsi, i-solder ebandayo, iisekethe ezimfutshane, njl., ngaloo ndlela ichaphazela ukuthembeka kwamacandelo kunye nokusebenza okuqhelekileyo kwe-PCB. Uyilo olufanelekileyo lwe-pitch alunciphisi nje ezi ziphene kodwa luphucula umgangatho we-solder kwaye luqinisekisa ukugcinwa kwecandelo. Ukongeza, isithuba esifanelekileyo phakathi komngxuma ongaphezulu kunye ne-pad kunceda ukwandisa iiparameters zenkqubo ye-wave soldering kunye ne-reflow soldering ukuphepha iingxaki ezifana nokulahleka kwe-solder okanye i-solder yobuxoki kwaye ngaloo ndlela kuphuculwe imveliso kunye nomgangatho wemveliso. Ngokufutshane, abavelisi be-elektroniki kufuneka balawule ngokungqongqo isithuba phakathi kweepads kunye nemingxuma kunye nokwandisa inkqubo xa kuyilwa iiPCBAs ukuze kuqinisekiswe uzinzo kunye nokhuseleko lweemveliso zabo.
