Waa maxay god-in-pad? Daloolka saxanka waxaa loola jeedaa godka suufka, suufka loogu talagalay saxanka SMD, badanaa wuxuu tixraacaa 0603 iyo wixii ka sareeya SMD iyo BGA pads, oo badanaa loo yaqaan VIP (via in pad). Daloollada suufka ah ee suufka laguma magacaabi karo dalool diskka, sababtoo ah godadka fur-ku-gudbinta ee suufka waxay u baahan yihiin in la geliyo qaybaha si loo iibiyo, dhammaan suufka biinanka ah ee plug-in waxay leeyihiin godad.
Iyadoo horumarinta alaabta elektiroonigga ah ee iftiinka, khafiifka ah, jihada yar, guddiga PCB ayaa sidoo kale lagu riixaa cufnaanta sare, ay adagtahay in la horumariyo, sidaas darteed xajmiga qaybaha ayaa si tartiib tartiib ah u yareynaya. Tusaale ahaan: Qaybaha BGA ee xirmadu way yar yihiin, kala dheeraynta biinku way yaraanaysaa. Kala dheereynta biinanka waa yar tahay, ka dibna xirmada gudaha biinanka waa ay adag tahay in laga baxo khadka, waxaad u baahan tahay inaad bedesho lakabka daloolka ee ka baxsan khadka.
In kala dheereynta biin BGA waa yar yahay, ma fan karo, waxaa jira hal hab oo kaliya si ay u xaliyaan dhibaatada, taas oo ah in la ciyaaro dalool disk ah. Waxaa sidoo kale jira dib u BGA in ay meel capacitor filter, marka pin BGA ka badan dhabarka capacitor filtarka ma ka fogaan kartaa godad taageere-out pin, oo kaliya in ay aqbalaan capacitance filter ee godadka suuf ah. Sidaa darteed, waxaa jira laba nooc oo godad ah oo ku yaala saxanka, mid wuxuu ku yaalaa suufka BGA, kan kalena wuxuu ku yaalaa suufka.
Waxaa halkan lagula talinayaa in la isku dayo in aan la naqshadayn god-in-disk haddii kala fogaantu ay ku filan tahay, sababtoo ah kharashka soo saarista god-in-disk-ku waa mid aad u sarreeya oo wakhtiga wax-soo-saarka soo-saarku uu aad u dheer yahay.
Naqshadeynta daloolka saxanka:
1. Looma baahna in la naqshadeeyo godka diskka;
Kahor marinka PCB-ga, waxaa lagama maarmaan ah in marka hore la sameeyo shaqada fanka si loo fududeeyo marinka lakabka gudaha. Wixii taageere-ka-baxa qalabka nooca BGA, ah
Tirada biinanka aad bay u badan tahay, laakiin aagga BGA waa in ay dhexda u ahaataa suufyada leh godad fanout ah. Ku saabsan BGA Fanout Settings
qiyaasaha, 0.15-0.2mm vias, 3-4 mil ballacyada laynka, iyo 0.3-0.4mm dalool siddo, sidaas darteed kala dheeraynta biin BGA waxay u baahan tahay inay ahaato mid weyn.
Marawaxadu waxay noqon kartaa mid caadi ah kaliya haddii ay ka yar tahay 0.35mm.
2.Need in la naqshadeeyo daloolka diskka;
Kahor fanout BGA, waxaan u baahanahay inaan dejino dhexroorka daloolka ee godadka, haddii kale dhexroorka daloolka kuma haboona fanout wax ku ool ah, ama
Haddii natiijada taageere-baxdu aanay ahayn mid caadi ah, markaa natiijadu maaha mid caadi ah. Marka kala dheeraynta biin BGA ay aad u yar tahay si ay u taageerto, waxaa lagama maarmaan ah in la naqshadeeyo daloolka saxanka, oo laga soo qaado fiilooyinka lakabka gudaha ama bartamaha diskka.
Isku toosinta hoose ee aaladaha BGA
Habka wax soo saarka ee daloolka saxanka:
1. BGA ee ka sarreeya daloolka waxaa guud ahaan lagu qeexaa sida dalool saxanka, waxaad u baahan tahay inaad xirto xabagta, daboolka dahaadhka resin si ay u fududayso iibinta macaamiisha.
Ilaa uu macaamiishu ka codsado in godadka ka sarreeya BGA aan la xidhin.
2. Marka laga reebo BGA, marka macaamiilku u baahan yahay dhammaan godadka in lagu dhejiyo xabagta, daloolada korka ee balastarka ayaa sidoo kale lagu qeexaa inay yihiin godad saxanka.
dalool qeexida diskka;
Habka wax soo saarka;
dalool dalool oo saxan ah → Daloolinta godka naxaasta → Ku xidhid xabagta → daawaynta → Polishing → Hoos u dhigista naxaasta → Ka saarida caagga buuxdhaafaya → Qodista godadka kale ee aan diskka ahayn (sida caadiga ah godadka qaybaha iyo godadka qalabka)
Plug-dalool awoodda habka;
Sawirka sawirka daloolka saxanka:
1. BGA ee godka saxanka: Guud ahaan, qalabka leh biinanka yar uma baahna godadka saxaaradda biinanka. Si kastaba ha ahaatee, BGA-yada leh biinanka badan, fiilooyinka biinanka ayaa boos ka qaadanaya fiilooyinka. Haddii fiisada loo nashqadeeyay sidii godadka saxaaradda oo godadka lagu feero suufka BGA, markaas boos ayaa loo hayn karaa fiilooyinka. Daloollada saxaarada waxaa la nashqadeeyaa marka kala dheereynta biintu ay aad u yar tahay in la mariyo fiilooyinka, iyo fiilooyinka laga soo gooyo meelo kale.
2. Hole-in-pan pan on capacitors filter: Marka fiisooyin badan loo baahan yahay si loogu wareego aaladda BGA, way adagtahay in laga fogaado fiisaha ku yaal dhabarka dambe ee aaladda BGA halkaasoo capacitors filter ay ku xiran yihiin. Sidaa darteed, fiisooyinka ayaa lagu feeray dusha sare ee suufka oo ay noqdaan god-in-disk.
3. Ha samayn godka habka diskka: daloolka diskka wuxuu u baahan yahay inuu dib u soo celiyo godka fur, ka dibna ku dheji xabagta kor ku xusan ee dahaadhka naxaasta ayaa ku habboon alxanka. Marka godka ku yaala saxanka uusan sameynin godka habka diskka, ha sameynin natiijada xiritaanka godka waa meel yar oo alxanka ah, godka ayaa qariyay kuul daasad ah ama dillaacay ifafaale saliid, taasoo keentay alxan been ah.
4. Samee habka daloolka saxan-ku-gudbinta: suufka BGA waa kuwa yaryar sida godadka saxanka ee dib loo habeeyay, asal ahaanna ma jiro meel wax lagu iibiyo oo hadhay. Sidaa darteed, godadka saxanka ku jira waxay u baahan yihiin in lagu xidho resin, iyo electroplating ayaa loo isticmaalaa in lagu buuxiyo godadka si siman, taas oo ku haboon alxanka oo aan keenin alxan xumo.
