Iyini Inqubo Yokwenziwa Kwe-PCB?

Njengenkampani ephethe izinto zikagesi, i-PCB idlala indima ebalulekile embonini yokukhiqiza izinto zikagesi. Inqubo yokukhiqiza yayo iyinkimbinkimbi futhi inembile, ithinta ngokuqondile ukusebenza kanye nekhwalithi yomkhiqizo wokugcina. I-WonderfulPCB, ifekthri ethembekile yokucubungula i-SMT, inikeza ukuhlaziya okuningiliziwe kwenqubo yokukhiqiza ye-PCB ukuze isize abakhiqizi bezinto zikagesi kanye namathimba okuthenga bakuqonde kangcono.

Uhlolojikelele lwenqubo yokukhiqiza ye-PCB

Inqubo yokukhiqiza ye-PCB ingahlukaniswa ngezigaba ezimbalwa ezibalulekile: ukwakhiwa kongqimba lwangaphakathi, ukufakwa kwe-lamination, ukubhoboza, i-metalization, ukwakhiwa kongqimba lwangaphandle, ukuvikelwa kwendawo, nokuhlolwa kokugcina nokupakishwa. Isinyathelo ngasinye sibandakanya amasu nobuchwepheshe obuhlukahlukene, obudinga izinga eliphezulu lokunemba kanye nobuchwepheshe.

Ukwenziwa Kwesendlalelo Sangaphakathi

Izendlalelo zangaphakathi ziwumgogodla we-PCB, oxhumanisa izingxenye ze-elekthronikhi. Inqubo ihlanganisa:

Ukusika Ibhodi: Ukusika i-substrate ye-PCB yoqobo ibe usayizi odingekayo wokukhiqiza.
Ukwelashwa kwangaphambili: Ukuhlanza indawo engaphansi ukuze kukhishwe uwoyela, ama-oxides, nokunye ukungcola, kuqinisekisa ukuqhubeka kahle ezinyathelweni ezilandelayo.
Isililo: Ukusebenzisa ungqimba lwefilimu eyomile endaweni ye-substrate, ezodlulisela iphethini yesifunda ngesikhathi sokuchayeka.
Ukuchayeka: Ukusebenzisa ukukhanya kwe-ultraviolet ukuveza ibhodi elaminate, ukudlulisa iphethini yesifunda eklanyelwe kufilimu eyomile.
Ukuthuthukisa, uku-Etching, kanye nokuhlubula: Ukukhipha izindawo ezingavezwanga zefilimu eyomile ngokuthuthukiswa, bese kucinywa ungqimba lwethusi olungavikelekile, futhi ekugcineni kususwa ifilimu eyomile esele ukwenza isekethe yongqimba yangaphakathi.
I-AOI (Ukuhlola Okuzenzakalelayo Kwamehlo): Ukuhlola ikhwalithi yomjikelezo wesendlalelo sangaphakathi ukuze kuqinisekiswe ukuthi awekho amasekhethi avuliwe, izikhindi, noma ezinye izinkinga.

Isililo

I-Lamination ihlanganisa izingqimba eziningi zangaphakathi zibe ibhodi elilodwa le-multilayer usebenzisa izinto ze-resin. Lesi sinyathelo sibalulekile ama-PCB amaningi, futhi inqubo ihlanganisa:

I-Brown oxide: Ukwandisa ukunamathela phakathi kwezingqimba nokuthuthukisa ukumanzisa kwendawo yethusi.
Ukubeka phansi: Ukwendlalela amasekethe angaphakathi kanye namashidi e-PP (Prepreg) ngokuya ngezidingo zokuklama.
Ukucindezela: Ukusebenzisa izinga lokushisa eliphezulu nokucindezela ukuze ubophe izendlalelo ebhodini elilodwa le-multilayer.
I-Target Drilling, Umzila, kanye Nokugaya Umphetho: Ukunquma ibhodi laminated ukuze kukhishwe impahla eyengeziwe futhi kufinyelele ubukhulu bomklamo.

Drilling

Ukubhoboza kuyadingeka ukuze kudalwe ngezimbobo noma izimbobo eziyizimpumputhe zokuxhunywa kukagesi nokufakwa kwengxenye. Inqubo ihlanganisa:

Drilling: Ukusebenzisa umshini wokubhoboza ukuze udale izimbobo ngokuya ngemininingwane yokuklama.
Deburring: Ukukhipha ama-burrs akhiwe ngesikhathi sokumba ukuze kuqinisekiswe izindonga zembobo ezibushelelezi.

I-Hole Metallization

Kulesi sinyathelo, ungqimba oluncane lwethusi lufakwa ezindongeni zembobo evikelayo ukuze kwakhiwe isisekelo sokuqhuba ukuze kuqhutshekwe nokucwetshwa kwethusi. Inqubo ihlanganisa:

I-PTH (Plated Through Hole) I-Copper Deposition: Ukufaka ngokwekhemikhali ungqimba lwethusi ezindongeni zembobo.
Ukugcwaliswa Kwemigodi: Ukufaka ithusi ngaphakathi kwezimbobo ukuze udale indlela ephelele yokuqhuba.

Ukwenziwa Kwezingqimba Zangaphandle

Ukwakhiwa kwesendlalelo sangaphandle kufana nezingqimba zangaphakathi kodwa kuyinkimbinkimbi kakhulu, njengoba kuhilela ukwenza iphethini yesekethe phezu kwezingqimba zangaphandle I-PCB ye-multilayer. Izinyathelo zihlanganisa:

Ukwelashwa Kwangaphambili Kwesendlalelo Sangaphandle: Ukuhlanza indawo engaphandle ukuze kukhishwe ukungcola.
Lamination, Exposure, and Developing: Ukwakha iphethini yesekethe yesendlalelo sangaphandle nge-lamination, ukuchayeka, nokuthuthukisa, okufana nenqubo yongqimba yangaphakathi.
Iphethini Plating: I-Electroplating yethusi kuphethini yesekethe ukuze ujiye imikhondo.
Ukuhlubula, uku-Etching, kanye Nokukhumula Tin: Ukukhipha ifilimu eyomile, ukukha ithusi elingavikelekile, nokukhumula ungqimba lukathayela ukuze kubonakale umjikelezo wokugcina wesendlalelo sangaphandle.

Ukuvikelwa kwendawo

Ukuvikelwa kwendawo kuvimbela i-oxidation kanye nokugqwala kwesekethe kuyilapho kuthuthukisa ukuthengiselana. Izinyathelo zihlanganisa:

I-Solder Mask: Ukusebenzisa isendlalelo sikayinki wemaski we-solder ezwela isithombe, okulandelwa ukuchayeka nokuthuthukisa ukwenza imaski ye-solder evikela ukujikeleza ekuhlanganisweni.
Ukwelashwa Kwendawo Engaphezulu: Izindlela ezifana ne-electroless nickel/i-immersion gold (ENIG) zisetshenziselwa ukuthuthukisa ukuqina nokumelana nokugqwala.
Ukuphrinta kwesikrini sikasilika: Ukuphrinta umbhalo nezimpawu zokuhlonza ebhodini ukuze kube lula ukuhlanganisa nokunakekela.

Ukuhlolwa Kokugcina Nokupakishwa

Ukuhlola kokugcina kuqinisekisa ikhwalithi ye-PCB, okuhlanganisa ukuhlolwa kwe-AOI, ukuhlolwa kwe-flying probe, nokuqinisekisa ukuthi azikho izikhindi noma izinto ezivulekayo. Uma amabhodi esephumelele ukuhlolwa, ayapakishwa ngevacuum, apakishwe futhi athunyelwe ukuze alethwe.