Metal Core PCB

Metal Core Printed Circuit Board (MCPCB), eo hape e bitsoang Insulated Metal Substrate (IMS) PCB kapa thermal PCB,

Sebopeho sa Motheo sa MCPCB se kenyelletsa:

Solder mask lera
Lera la potoloho
Lera la koporo 1oz. ho 6oz. (e sebelisoang haholo ke 1oz ho isa ho 2oz.)
Lera la dielectric
Metal core layer - heatsink kapa mocheso oa mocheso

Metal Core PCB(MCPCB) ke eng?

A Metal Core Printed Circuit Board (MCPCB), eo hape e bitsoang insulated metal substrate (IMS) PCB kapa thermal PCB, ke mofuta oa boto ea potoloho e sebelisang thepa ea tšepe e le motheo oa eona oa ho qhala mocheso, ho fapana le li-PCB tsa setso tsa FR4. Li-MCPCB li etselitsoe ho fetisetsa mocheso o hlahisoang ke likarolo tsa elektroniki nakong ea ts'ebetso ho ea libakeng tse sa bohlokoa haholo, joalo ka li-heatsink tsa tšepe kapa setsi sa tšepe ka boeona.

MCPCB ha e le hantle e na le likarolo tse tharo: lera la conductive, lera la ho futhumatsa mocheso, le karolo ea tšepe ea tšepe. Kaho ena e lumella ho laola mocheso ka katleho, ho netefatsa botšepehi le nako e telele ea lisebelisoa tsa elektronike, haholo-holo lits'ebetsong tse matla tse kang mabone a LED le lisebelisoa tsa motlakase tsa motlakase.

Mefuta ea Metal Core PCB

Ho ea ka thepa ea Substrate

Khetho ea thepa ea motheo e itšetlehile ka litlhoko tse khethehileng tsa kopo, lintlha tse leka-lekaneng tse kang conductivity ea mocheso, rigidity le litšenyehelo.

Litšepe tse sebelisoang haholo tlhahisong ea MCPCB li kenyelletsa aluminium, koporo le lialloys tsa tšepe:

aluminium: E tsebahala ka matla a eona a ho fetisa mocheso le matla a ho qhala, aluminium e batla e le theko e tlaase, e leng se etsang hore e be khetho ea moruo ka ho fetisisa bakeng sa MCPCBs.
koporo: Ha e ntse e fana ka ts'ebetso e phahameng ea mocheso, koporo e theko e boima ho feta aluminium.
tšepe: E fumaneha ka mefuta e tloaelehileng le e sa hloekang, tšepe e thata ho feta aluminium le koporo empa e na le conductivity e tlaase ea mocheso.

Ho latela Structure and Layers of Metal core PCB

Lera le le leng la MCPCB

MCPCB ea Layer e Habeli

Habeli Side MCPCB

Multi-Layer MCPCB

Melemo ea Metal Core PCB(MCPCB)

Phallo e Phahameng ea Mocheso: Li-MCPCB li sebelisa litšepe tse kang aluminium kapa koporo, tse fanang ka conductivity e ntle ea mocheso. Tšobotsi ena e thusa ho laola mocheso o sebetsang hantle lits'ebetsong tsa matla a phahameng, ho fokotsa haholo mocheso oa ts'ebetso ea likarolo le ho matlafatsa ts'episo ea tsamaiso le nako ea bophelo. Mohlala, li-MCPCB li ka fetisa mocheso ka makhetlo a 8 ho isa ho a 9 ho feta li-PCB tsa setso tsa FR4.
Tlhokahalo e Fokotseng ea Heatsinks: Ho fapana le li-PCB tsa FR4, tse hlokang lisebelisoa tse eketsehileng tsa ho pholisa ka lebaka la mocheso oa tsona o tlase oa mocheso, li-MCPCB li ka khona ho qhala mocheso ka botsona. Sena se fokotsa boholo ba sistimi le ho rarahana ka kakaretso ka ho tlosa li-heatsink tse ngata.
Ho tšoarella le Matla: Aluminium, substrate e tloaelehileng bakeng sa MCPCBs, e fana ka matla a phahameng le ho tšoarella ha ho bapisoa le lisebelisoa tse kang lirafshoa le fiberglass. Ho tiea hona ho fokotsa kotsi ea tšenyo nakong ea tlhahiso, kopano, le ts'ebetso e tloaelehileng, ho netefatsa ts'ebetso ea nako e telele.
Botsitso ba Dimensional: Li-MCPCB li bonts'a botsitso bo boholo ha li le tlas'a maemo a fapaneng a mocheso. Ba ba le liphetoho tse fokolang tsa boholo (hangata 2.5% ho 3.0%) ho pholletsa le mocheso oa 30 ° C ho ea ho 150 ° C, ho netefatsa ts'ebetso e tsitsitseng maemong a fapaneng a tikoloho.
Boima bo Bobebe le Boipheliso bo Phahameng: Li-MCPCB li bobebe ho feta li-PCB tsa setso, li etsa hore ho be bonolo ho li tšoara le ho li kenya. Ho feta moo, aluminium e ka sebelisoa hape ebile ha e na chefo, e kenya letsoho lits'ebetsong tse baballang tikoloho. Karolo ena e boetse e etsa hore aluminium e be mokhoa o sa sebetseng hantle ho feta lisebelisoa tse ling.
Nako e telele ea Bophelo: Matla le ho tšoarella ha aluminium ha li matlafatse feela ho tiea ha li-MCPCB empa hape li kenya letsoho bophelong bo bolelele ba ts'ebetso. Sena se fokotsa litšenyehelo tsa tlhokomelo le tlhoko ea ho nchafatsa, ho etsa hore MCPCB e be letsete le bohlale mabapi le bophelo bo bolelele.

Metal Core PCB Manufacturing process

Ts'ebetso ea ho etsa li-PCB tsa Metal Core (MCPCBs) e kenyelletsa mehato e 'maloa e ikhethang ka lebaka la boteng ba lera la tšepe ka har'a stackup.

Maboto a Mola o le Mong: Bakeng sa li-MCPCB tsa lera le le leng ntle le liphetoho tsa lera, ts'ebetso e bonahatsa liboto tsa setso tsa FR4. Sekhahla sa dielectric se hatelloa 'me se tlamahane ka ho toba letlapeng la tšepe, ho netefatsa ho khomarela ka katleho.
Li-Stackups tsa Multilayer: Bakeng sa li-MCPCB tsa multilayer, ts'ebetso e qala ka ho cheka motheo oa tšepe. Sena se bohlokoa bakeng sa ho lumella liphetoho tsa layer ntle le ho beha li-circuits tse khutšoane kotsing. Mehato e latelang e hlalosa mokhoa ona:
- cheka: Likoti tse nyenyane tse kholoanyane li phunyeletsoa ka har'a lera la tšepe ho amohela thepa e sireletsang.
- Hlahloba: Likoti tsena li tlatsitsoe ka gel e sireletsang, e ntan'o phekoloa le ho thatafala. Mohato ona ke oa bohlokoa bakeng sa ho lokisa sebaka sa koporo.
- Ho pata: Hang ha gel e se e behiloe, likoti tse phuntsoeng li kenngoa ka koporo, tse tšoanang le li-vias tse tloaelehileng ho PCBs tsa setso.
- Ho ratana: Mekhahlelo e setseng ea dielectric e ntan'o hatelloa ebe e tlamahanngoa le lera la tšepe.
- Ho Cheka Mokoti: Ka mor'a hore li-stackup li phethoe, likoti li phunyeletsoa ka har'a kopano eohle, li lateloa ke mekhoa e eketsehileng ea ho pata le ho hloekisa.