With the increasing trend of miniaturization of electronic products and applications of finer pitch devices, vias become extremely popular since they are an effective solution responsible for electrical connection between traces from different layers in a printed circuit board. Vias can be classified into three main types: Through-hole Vias, Blind Vias and Buried Vias, each of which implements different attributes and functions contributing to the overall optimal performance of PCBs or even electronic products.
Via-in-pad (VIP) technology basically refers to the technology by which via is placed directly beneath component contact pad, especially BGA pad with finer pitch array packages. In other words, VIP technology leads to vias plated or hidden under BGA pad, requiring that PCB manufacturer should plug via with resin prior to carrying out copper plating on the via to make it invisible.
Compared with blind vias and buried vias, VIP technology features more merits:
- • Fit for fine pitch BGAs
- • Leading to higher density of PCBs and promoting space saving
- • Performing better in thermal management, beneficial for heat dissipation
- • Defeating constraints of high-speed designs such as low inductance
- • Sharing a flat surface with component attachment
- • Making PCB footprints smaller and routing further and better
Owing to those advantages of VIP technology, via in pad is widely applied in small-scale PCBs, especially those that require limited space for BGAs and focus on heat transferring and high-speed designs. Therefore, although blind/buried vias are beneficial for density improvement and PCB real estate saving, as far as heat management and high-speed design elements are concerned, via in pad is still the best choice for you. With cost considered, different projects lead to different cost. So if vias are involved in your project and you fail to pick up which type, contact us through email email@example.com and our staff will provide you an optimal solution.