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    Nang le tsebo tse fetang 20 lilemo tse 'ho indasteri ena, re ka fana ka ditharollo mong setopong bakeng sa bareki ho akarelletsa PCB popontshwa, dikarolo phumantsho le ditshebeletso PCB Kopano. Ka lebaka la ho ea ka melao stringent difeme le melao ea tsamaiso, ho eketsa tsebo ea theknoloji le cheseho ho loanela ho theknoloji e ka morao-rao, re bokeletseng bokgoni tse 'maloa ho sebetsana le mefuta e fapaneng ya liphutheloana karolo kang BGA, PBGA, Flip ladica i, CSP le WLCSP.

    BGA

    BGA, مختصر bakeng drive bolo theiboleng, ke mofuta o mong oa SMT (holim'a Mount Technology) sephutheloana e eketsehileng sebelisoa ka lipotoloho setshehetso sa (ant). BGA e na le molemo ho ntlafatso ya solder kopanetsoeng tšepahala.

    BGA hlahisa melemo e latelang:

    • sebetsang hantle ya kopo ya PCB sebaka

    BGA sephutheloana libaka dikgokelo tlas'a SMD (holim'a Thaba ea sesebelisoa) sephutheloana sebakeng sa ka bophara e le hore sebaka ka haholo-holo ka pholoha.

    • Ntlafatso ya ho latela tshebetso mogote le motlakase

    Kaha BGA sephutheloana thusa ho fokotsa bottom la matla 'me fatše lifofane le impedance laoloa mela pontšo, mocheso ka ba ile ba fallela hole le sebaka, le molemo ho futhumatsa dissipation.

    • Keketseho ya chai difeme

    Ka lebaka la tsoelo-pele ea solder tšepahala, BGA ka lula sebaka batlang e le kholo pakeng tsa dikgokelo le boleng bo phahameng ka kulo.

    • sephutheloana phokotso botenya

    Re ikhetha ka ho sebetsana le e metle sekontiri se metsi metsoako kopano le ho fihlela ho hona joale re ka sebetsana le BGAs bao bonyane sekontiri se metsi e ka ba e le tse nyenyane e le 0.35mm.

    Ha u beha e tletseng ba retelehelang-senotlolo odara PCB kopano malebana BGA sephutheloana, baenjiniere ba rōna bo tla, pele ho tsohle, sheba difaele tsa hao PCB le BGA datasheet e le hore re ka akaretsa le profil mogote ka eo likarolo lokela ho ho nkoa ka nahanela kang BGA boholo , bolo tse bonahalang jj Pele ho mohato ona, re tla hlahloba PCB hao moralo bakeng sa BGA le fana ka FREE DFM cheke ho hlokomela thepa ea motheo ea bohlokoa ho PCB kopano ho akarelletsa le substrate tse bonahalang, bokaholimo fihlela qetellong, soldermask rengwa, joalo-joalo

    Ka lebaka la litšobotsi tsa BGA sephutheloana, km gana Optical Tlhahlobo (AOI) hloleha ho kopana le litlhoko tsa tlhahlobo. Re ikemisetsa BGA tlhahlobo ke km gana X-ray Tlhahlobo (AXI) thepa ea nang le bokhoni ba ho hlahloba likoli kulo ka sethaleng mathoasong a lekholo pele ho etsa thepa bophahamo ba modumo.

    PBGA

    PBGA, مختصر tsa polasetiki tse ngata bolo theiboleng, ke o mong oa mefuta e ratoang ka ho fetisisa ambalaji bakeng mahareng ho ea phahameng ke / O disebedisweng tse ding. Ho itšetlehile ka hore laminate substrate e nang le dikarolo tse eketsehileng koporo ka hare, PBGA e na le molemo ho mocheso dissipation le ka ipatlela boholo bo kholoanyane 'mele le nomoro ya libolo e le hore ho kopana e kgolo ee bophara mefuta e fapaneng ya ditlhoko.

    PBGA hlahisa melemo e latelang:

    • hlokang tlaase bottom

    • Etsa holim eketseha inolofaletse

    • litjeo tsa batlang e le e tlase

    • Ho boloka batlang e phahameng tšepahala

    • Ho fokotsa litokollo tsa coplanar

    • Ho fumana batlang e le ea phahameng mogote le motlakase tshebetso

    phetlhwang ladica i

    E le mokhoa oa mabapi motlakase, phetlhwang ladica i kopanya shoa le sephutheloana substrate ke ka ho toba li shebile fatše edy e le hore a etsa hore ho be khomaretse substrate, balebeli ba potoloho boto kapa microcyteme. Melemo ea ladica i phetlhwang kenyeletsa:

    • Ho fokotsa pontšo bottom le matla a / fatše inductanc

    • fokotseha palo ea sephutheloana Pinów le boholo ba shoela'ng

    • Ho eketsa segokanyipalo pontšo

    CSP le WLCSP

    Ho fihlela ho hona joale, CSP ke foromo morao-rao tsa sephutheloana, مختصر bakeng sa sephuthelwana ladica i tekanyo e. E le tlhaloso ea lebitso la eona le bontša, CSP e bua ka sephutheloana bao boholo e tšoanang le ea ladica i le likoli tse malebana le dita bare felisitsoe. CSP fana ka ambalaji tharollo ke hore denser le bonolo, theko e tlaase le ho feta. Le likarolo tse latelang tsa CSP thusang lebisa ho eketseha ha chai kopano le theko e tlaase ho etsa thepa.

    CSP e ratoa hakaale le sebetsang hantle ho indasteri ena hore ho fihlela ho hona joale ho na le tse fetang 50 mefuta e sa CSPs ka lelapa lona 'me palo e ntse le ntseng le hōla letsatsi le letsatsi. A mangata litšobotsi le litšobotsi tsa CSP ke contributive ho tloaeleha lona lohle tšimong ena:

    • Phokotso ea sephutheloana boholo

    CSP ka fumana ambalaji bokgoni e phahameng ho 83% kapa ho feta, haholo segokanyipalo oketseng tsa lihlahisoa.

    • Self lolamisiwa ga

    CSP khonang ho ho ho intša tsamaiso di nyalantswe ka tshebetso ya ho PCB kopano reflow e le hore e etsa SMT bonolo.

    • Ho hloka itlhomme sothoe

    Ntle le nka karolo ha itlhomme sothoe, mathata coplanar ka haholo tsa fokotswa.

    WLCSP, مختصر bakeng wafer boemo ba ladica i sephutheloana tekanyo e, ke mofuta oa sebele oa CSP kaha sephutheloana lona o qetile hlahisa 'boholo ladica i ka tekanyo. WLCSP bolela edy ambalaji thekenoloji ka boemo wafer. sesebediswa A le WLCSP ka sebele e leng shoela'ng leo e drive ya utloe kapa libolo solder e lokisetsa ka e ke / O sekontiri se metsi, kopana ditlhoko tsa dithulaganyo tsa moetlo oa potoloho boto kopano.

    Menyetla ya WLCSP haholo-holo e kenyeletsa:

    • bottom tloha shoela'ng ho PCB e nyenyane ka ho fetisisa;

    • sephutheloana boholo e fokotsehile haholo le segokanyipalo sa lengolo la ntlafala;

    • Thermal conduction tshebetso e haholo ntlafatsoa.

    Ho fihlela ho hona joale, re ka khona ho sebetsana le WLCSP bao bobeli ba bonyane ka Har'a-shoa sekontiri se metsi le ka mose-shoa sekontiri se metsi ka fihla 0.35mm.

    0201 le 01005

    E le 'maraka ea elektronike le lihlahisoa esale pele, ho hōla tšekamelo ea miniaturization liselefouno, dilepothopo jj kamehla koloi bakeng sa dikarolo le boholo bo nyenyane. Hore ho hokahanya le tšekamelo ena, re 'nile ka etsa boiteko ba ho eketsa bokgoni karolo kopano ho fihlela ho 0201 le 01005.

    Ho fihlela ho hona joale, ka bobeli 0201 le 01005 tse ratoang ka ho fetisisa 'marakeng ea elektronike ka lebaka la ho le menyetla e tse latelang:

    • Tiny boholo etsang hore ba haholo amohelehile ka lihlahisoa sebaka-constrained qetellong;

    • Excellent tshebetso ka tshebetso e tokafatso ea lihlahisoa tsa elektronike;

    • Lumellana nang le litlhoko tse phahameng segokanyipalo sa lihlahisoa tsa morao-rao tsa elektronike;

    • haholo phahameng-lebelo dikopo.

    E le hore ho fihlela bokgoni phutheho ea 01005, re nile ka a atleha ho sebetsana le likarolo tse malebana thulaganyou e lona kopano ho akarelletsa PCB moralo, dikarolo, solder peista, nka le placement, reflow, stensele le hlahloba. 20+ boiphihlelo lilemo tse 'rona re thusa hore re akaretsa hore ya ka dipehelo tsa litokollo tsa poso-reflow, bapisoa le dikarolo le mefuta e meng ea liphutheloana, dikarolo tsa phutheloa le 01005 phetha molemo makasineng ntsha tse kang ho hlaola, tombstone, bohale-ba emeng ka maoto, hlohlolingoane, sieo karolo jj

    Re khona ho sebetsana le mefuta e fapaneng ya liphutheloana ka thulaganyou e kopano PCB le temana tse ka holimo a hloleha ho bontša bohle. Haeba hao hlokahalang motsoako sephutheloana foromo e sa boletsoeng ka holimo, ka kōpo u se ke ua tsilatsila ho fihle re ka  wonderful@wonderfulpcb.com  bakeng sa atolosoa bokgoni rona sephutheloana tshwara.

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