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  • smt smd pcba assembly manufactur -

    • Brand Name: Customized
    • Min.Order Quantity: No
    • Supply Ability: 30~50 thousand ㎡/Month
    • Port: Shenzhen
    • Service: EMS/OEM/ODM
    • Payment Terms: T/T,Paypal,WU etc.
    • Layer: 6
    • Base Material: FR-4
    • Copper Thickness: 1oz
    • Board Thickness: 1.6mm
    • Solder mask color: Blue(can customized)
    • Component labeling color: White(can customized)
    • Surface Finishing: ENIG
    • Service type: Full assembled services
    • Application: Consumer electronics products
    • Test: E-test,AOI,X-ray,Function test
    • Assembly Tech: DIP and Wave Soldering,SMT and Reflow Soldering

    Product Detail

    Product Tags

    Multilayer PCB Promotion In June

    – 12% discount for multilayer PCBs

    – more surprises for regular customers

    Deadline: July 5th,2015

    Advantages

    – No MOQ

    – OEM services provided

    – Heavy copper PCB, Heavy gold PCB, Blind / Buried via PCB, High layer count PCB  manufacturable

    – Factory direct price

    – Replying with price in one working day

    – Shipping within 24 hours

    – Certificate: ROHS, UL, ISO9001-2000, ISO14001,SGS Lead-Free

    PCB Capacity
    PCB General Capability
    Number of Layer 1 – 20 Layer
    Maximum Processing Area 680 × 1000MM
    Min Board Thickness 2 Layer – 0.3MM ( 12 mil )
    4 Layer – 0.4MM ( 16 mil )
    6 Layer – 0.8MM ( 32 mil )
    8 Layer – 1.0MM ( 40 mil)
    10 Layer – 1.1MM ( 44 mil )
    12 Layer – 1.3MM ( 52 mil )
    14 Layer – 1.5MM ( 59 mil )
    16 Layer – 1.6MM ( 63 mil )
    18 Layer – 1.8MM ( 71 mil )
    Finished Board Thickness Tolerance Thickness ≤ 1.0MM, Tolerance: ± 0.1MM
    1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%
    Twisting and Bending ≤ 0.75%, Min: 0.5%
    Range of TG 130 – 215 ℃
    Impedance Tolerance ± 10%, Min: ± 5%
    Hi-Pot Test Max: 4000V/10MA/60S
    Surface Treatment HASL, With Lead, HASL Free Lead
    Flash Gold, Immersion Gold
    Immersion Silver, Immersion Tin
    Gold Finger, OSP
    PCB Cu Thickness + Plating
    Out Layer Cu Thickness 1 – 6OZ
    Inner Layer Cu Thickness 0.5 – 4OZ
    Cu Thickness of PTH 20UM ≤ Average ≤ 25UM
    Min: 18UM
    HASL with Lead Tin 63% Lead 37%
    HASL Free Lead 7UM ≤ Surface Thickness ≤ 12UM
    Thick Gold Plating Ni Thickness: 3 – 5UM ( 120u” – 200u” )
    Gold Thickness: 0.025 – 1.27UM ( 1u” – 50u” )
    Immersion Gold Ni Thckness: 3 – 5UM ( 120u” – 200u” )
    Gold Thickness: 0.025 – 0.15UM ( 1u” – 3u” )
    Immersion Silver Ag Thickness: 0.15- 0.75 UM ( 6u” – 30u” )
    Gold Finger Ni Thickness: 3 – 5UM ( 120u” – 160u” )
    Gold Thickness: 0.025 – 1.51UM ( 1u” – 60u” )
    U940 PCB Pattern Limit Capability
    Min Width 0.075MM ( 3 mil )
    Min Trace 0.075MM ( 3 mil )
    Min Width of Ring ( Inner Layer ) 0.15MM ( 6 mil )
    Min Width of Ring ( Out Layer ) 0.1MM ( 4 mil )
    Min Solder Bridge 0.1MM ( 4 mil )
    Min Height of Legend 0.7MM ( 28 mil )
    Min Width of Legend 0.15MM ( 6 mil )
    PCB Holes Processing Capability
    Final Hole Size Min: Laser 0.1MM, Machine 0.2MM
    Drilling Hole Size 0.10 – 6.5MM
    Drilling Tolerance NPTH: ±0.05MM, PTH: ±0.075MM
    Final Hole Size Tolerance ( PTH ) φ0.20 – 1.60MM ± 0.075MM
    φ1.60 – 6.30MM ± 0.10MM
    Final Hole Size Tolerance ( NPTH ) φ0.20 – 1.60MM ± 0.05MM
    φ1.60 – 6.50MM ± 0.05MM
    Drilling Strip Hole -0L ~tu.’gth /width 2:1
    Min Strip Hole Width 0.65MM
    Length & Width Tolerance ± 0.05MM
    Board Thickness / Hole Size ≤ 10:1
    PCB Cover Thickness Capability
    Solder Mask Color Green,Matte Green,Yellow,Blue,Red,Black,Matte Black,White
    Solder Mask Thickness Surface Line ≥ 10UM
    Surface Line Corner ≥ 6UM
    Surface Board 10 – 25UM
    Solder Mask Bridge Width
    Legend Color White,Yellow,Black
    Min Height of Legend 0.70MM ( 28 mil )
    Min Width of Legend 0.15MM ( 6 mil )
    Blue Gel Thickness 0.2 – 1.5MM
    Blue Gel Tolerance ±0.15MM
    Carbon Print Thickness 5 – 25UM
    Carbon Print Min Space 0.25MM
    Carbon Print Impedance 200Ω
    Blind/Burried/Half Via PCB Capability
    Parameters (1+1)e.g.(4-layer)blind via:1-2,2-4(6-layer)buried via:2-3,3-4

    (8-layer)blind/buried:1-3,4-5,6-8

    Min Via Laser 0.1MM, Machine 0.2MM
    Half Via Min: 0.6MM
    Impedance Capability
    Resistance Value Single-ended 50 – 75Ω, Difference 100Ω, Coplanar 50 – 75Ω
    PCBA Capability

    Our PCBA Capability

    SMT, PTH, mixed technology

    SMT: 2,000,000 solder joints per day

    DIP: 300,000 joints per day

    Ultra fine pitch, QFP, BGA, μBGA, CBGA

    Advanced SMT assembly

    Automated insertion of PTH (axial, radial, dip)

    Cleanable, aqueous and lead-free processing

    RF manufacturing expertise

    Peripheral process capabilities

    Pressfit back planes & mid planes

    Device programming

    Automated conformal coating

    For E-Test

    Universal Tester

    Flying Probe Open/Short Tester

    High power Microscope

    Solder ability Testing Kit

    Peel Strength tester

    High Volt Open & Short tester

    Cross Section Molding Kit With Polisher

    If you need PCB assembly service as well, could you give us following information?
    1. Gerber file of the bare PCB board
    2. BOM(Bill of material) for assembly
    To short the Lead time, please kindly advise us if there is any acceptable components substitution.
    3. Testing Guide & Test Fixtures, if necessary
    4. Programming files & Programming tool, is necessary
    5. Schematic, if necessary

    Our Production Capability for PCB

    Number of Layer 1 – 20 Layer
    Maximum Processing Area 680 × 1000MM
    Min Board Thickness 2 Layer – 0.3MM ( 12 mil )
    4 Layer – 0.4MM ( 16 mil )
    6 Layer – 0.8MM ( 32 mil )
    8 Layer – 1.0MM ( 40 mil)
    10 Layer – 1.1MM ( 44 mil )
    12 Layer – 1.3MM ( 52 mil )
    14 Layer – 1.5MM ( 59 mil )
    16 Layer – 1.6MM ( 63 mil )
    18 Layer – 1.8MM ( 71 mil )
    Finished Board Thickness Tolerance Thickness ≤ 1.0MM, Tolerance: ± 0.1MM
    1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%
    Twisting and Bending ≤ 0.75%, Min: 0.5%
    Range of TG 130 – 215 ℃
    Impedance Tolerance ± 10%, Min: ± 5%
    Hi-Pot Test Max: 4000V/10MA/60S
    Surface Treatment HASL, With Lead, HASL Free Lead
    Flash Gold, Immersion Gold
    Immersion Silver, Immersion Tin
    Gold Finger, OSP

    We provide OEM services to all sorts of printed circuit board assembly as well as electronic encased products.


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