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  • Renewable Design for Dual Layer Led Pcb - 4 layers pcb manufacture - Wonderful Technology -

    Product Detail

    Product Tags

    4 layers china pcb manufacturer low cost pcb prototype


    Our production capacity

    PCB Item Manufacture Capacity
       Layer Counts    1–20L
       Base Material    FR4,High-TG FR4,CEM3,aluminum,High Frequency(Rogers,Taconic,Aron,PTFE,F4B)
       Material Thickness(mm)    0.40, 0.60, 0.80, 1.00, 1.20, 1.50, 1.60, 2.0, 2.4, 3.2
       Max board size(mm)    1200x400mm
       Board Outline Tolerance    ±0.15mm
       Board Thickness    0.4mm–3.2mm
       Thickness Tolerance    ±8%
       Minimum line/space    0.1mm
       Min Annular Ring    0.1mm
       SMD Pitch    0.3mm
       Min  Hole Size(mechanical)    0.2mm
       Min Hole Size(laser hole)    0.1mm
       Hole Size Tol (+/-)    PTH:±0.075mm;NPTH: ±0.05mm
       Hole Position Tol    ±0.075mm
       HASL/LF HAL    2.5um
       Immersion Gold    Nickel  3-7um  Au:1-5u”
       Surface Finish    HAL,ENIG,Plated Gold,Immersion Gold,OSP
       Copper Weight    0.5–6oz
       Solder mask    Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue
       Silk screen    White, Black, Blue,Yellow
       Acceptable File Format    Gerber file,Powerpcb,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000
       Certificate    ROSH,ISO9001,UL


    PCB Assembly Capability


       Stencil Size    736x736mm
       Minimum IC Pitch    0.2mm
       Maximum PCB size    1200x 500mm
       Minimum PCB thickness    0.25mm
       Minimum chip size:    0201 (0.2×0.1)/0603 (0.6 x 0.3mm)
       Maximum BGA size:    74x74mm
       BGA ball pitch:    1.00mm (minimum), 3.00mm (maximum)
       BGA ball diameter:    0.40mm (minimum), 1.00mm (maximum)
       QFP lead pitch:    0.38mm (minimum), 2.54mm (maximum)
       Volume:    One piece to low volume production quantities
    Low cost first article builds
    Schedule deliveries
       Assembly type:    Surface mount(SMT) assembly
    DIP assembly
    Mixed(surface mount and through hole) technology
    Single or double sided placement
    Cable assembly
       Components type:    Passive components:
    As small as 0402 package
    As small as 0201 with design review
    Ball Grid Arrays(BGA):
    As small as .5mm pitch
       Parts procurements:    Turnkey(we supply the parts)
    Consigned(you supply the parts)
    You supply some parts, we do the rest
       Solder type:    Leaded
    Lead-free/ROHS compliant
       Other capabilities:    Repair/rework services
    Mechanical assembly
    Box build
    Mold and plastic injection.



    Sample Lead time Mass production lead time
    Single sided PCB 1~3 4~7
    Double sided PCB 2~5 7~10
    Multilayer PCB 7~8 10~15
    PCB and Assembly 8~15 15~20

    OEM/ODM/EMS Services for PCBA:

    • PCBA, PCB Board assembly: SMT & PTH & BGA
    • PCBA and enclosure design
    • Components sourcing and purchasing
    • Quick prototyping
    • Plastic injection molding
    • Metal sheet stamping
    • Final assembly
    • Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)
    • Custom clearance for material importing and product exporting

    Capability – SMT

    • Lines                   9(5 Yamaha,4KME)
    • Capacity                 52 million placements per month
    • Max Board Size           457*356mm.(18”X14”)
    • Min Component size       0201-54 sq.mm.(0.084 sq.inch),long connector,CSP,BGA,QFP
    • Speed                   0.15 sec/chip,0.7 sec/QFP

    Capability – PTH

    • Lines                   2
    • Max board width         400 mm
    • Type                   Dual wave
    • Pbs status               Lead-free line support
    • Max temp               399 degree C
    • Spray flux               add-on
    • Pre-heat                 3

    Product Type


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