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  • PCBA suppliers -

    • Brand Name: Customized
    • Min.Order Quantity: No
    • Supply Ability: 30~50 thousand ㎡/Month
    • Port: Shenzhen
    • Service: EMS/OEM/ODM
    • Payment Terms: T/T,Paypal,WU etc.
    • Layer: 6
    • Base Material: FR-4
    • Copper Thickness: 1oz
    • Board Thickness: 1.6mm
    • Solder mask color: Blue(can customized)
    • Component labeling color: White(can customized)
    • Surface Finishing: ENIG
    • Service type: Full assembled services
    • Application: Consumer electronics products
    • Test: E-test,AOI,X-ray,Function test
    • Assembly Tech: DIP and Wave Soldering,SMT and Reflow Soldering

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    We also have ability for PCB layout ,PCBA and Circuit assembly, specializes in producing the various electronic products based on your customized designs and do pcba,pcb assembly for all kinds of small ,medium Volume electronic products

    Enabling you to focus on product development and sales, we can solve your production technology issues and take care of product quality

    The operation we can handle for you is from the Bare pc board fabrication, full component procurement, SMT/BGA/DIP assembly, mechanical/case assembly, rubber molding, functional testing, repair, inspection of finished goods to shipment arrangement

    Typical Applications

    SMD package, Chip-on-board and Flip Chip assembly technique

    0201 chip, Micro BGA, u-BGA, QFN and LGA assembly

    AI and Thru-hole assembly

    RoHS, REACH compliance and Lead-Free solder technology

    Chip Programming

    Conformal Coating

    ICT test and AOI inspection

    ESD Protection Control Procedure

    IPC-A-610E Class II and Class III Workmanship Standard

    1) Professional Surface-mounting and Through-hole soldering Technology

    2) Various sizes like 1206,0805,0603 components SMT technology

    3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.

    4) PCB Assembly With UL,CE,FCC,Rohs Approval

    5) Nitrogen gas reflow soldering technology for SMT.

    6) High Standard SMT&Solder Assembly Line

    7) High density interconnected board placement technology capacity.

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