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RoHS FR4 circuit board electrical PCB control panel board
Product Description
Specification of PCB board
| Description | Techonical Data |
| Materials | FR4,TG:130°C/170°C,Alu,Rogers,Arlon,Tsconic |
| Layers | 1-30layers |
| Board thickness | 0 04-0 16″±10%(0 1-4mm±10%) |
| Single/Doublelayer:o.008+0 004″ | |
| 4layer:0.01±0 008* | |
| 8layer:(.01±0 .008″ | |
| Copper weight | 0.5-4OZ |
| Drilling | Min size 0.0078″(0.2mm) |
| Drilldeviation Drilling ±0 002″(0 05mm) | |
| PTH hole tolerance ±0 .002″(0 005mm) | |
| NPTH hole tolerance ±0.002″(0.005mm) | |
| Plating | Min hole size 0 0008″(0.02mm) |
| Aspect ratio 20(5:1) | |
| Solder mask | Color:green,white,black,red,yellow,blue… |
| Min solder mask clearance:0.003″(0.07mm) | |
| Thickness:0.0005-0.0007″(0.012-0.017mm) | |
| Silkscreen | Color:white,black,red,yellow,blue… |
| Min size 0.006″(0.15mm) | |
| E-test | Flying probe test/E-test fixture test |
| Controlled lmpedance | Tolerance:±10% |
| lmpedance Tester:Tektronix TDS8200 | |
| Surface Finish | HASL,ENIG,immersion silver,immersion tin,OSP… |
| Board cutting | Min.thickness for inner layers 0.003″(0.07mm) |
| Capacity | 250,000 square feet(Month) |
PCB Assembly Capacity
| Quantity | Prototype&Low Volume PCB Assembly&Mass production(without MOQ) |
| Type of Assembly | SMT,DIP&THT |
| Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free |
| Components | Passive Down to 0201 size;BGA and VFBGA;Leadless Chip Carriers/CSP |
| Bare Board Size | Smallest:0.25*0.25 inches;Largest:20*20 inches |
| File Format | Bill of Materials;Gerber files;Pick-N-Place file |
| Types of service | Turn-key,partial turn-key or consignment |
| Component Package | Cut Tape,Tube,Reels,Loose Parts |
| Testing | IQC;X-ray lnspection;AOI Test |
| PCBA Process | SMT–Wave Soldering–Assembling–ICT–Function Testing |
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