Leading Mesh Nebulizer Manaufacturer
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  • 10L industrial control board

    • Brand Name: Customized
    • Min.Order Quantity: No
    • Supply Ability: 30~50 thousand ㎡/Month
    • Port: Shenzhen
    • Service: EMS/OEM/ODM
    • Payment Terms: T/T,Paypal,WU etc.
    • Layer: 16
    • Base Material: High Tg FR4
    • Copper Thickness: 1oz
    • Board Thickness: 2.43mm
    • Solder Mask Color: Green(can customized)
    • Silkscreen Color: White(can customized)
    • Surface Finishing: Immersion Gold
    • Application Industry: Industrial Control
    • Application Products: Core board
    • Outer Line width/space: 4/4mil
    • Inner Line width/space: 3.5/3.5mil
    • Min.Hole Size: 0.75mm
    • Test Way: 100% E-Test
    • Standard: IPC-Class2/Class 3

    Product Detail

    Product Tags

    6 layers boards fr4 94v0 rohs pcb for the fingerprint Scanner

    Advantages

    - No MOQ

    - OEM services provided

    - Heavy copper PCB, Heavy gold PCB, Blind / Buried via PCB, High layer count PCB  manufacturable

    - Factory direct price

    - Replying with price in one working day

    - Shipping within 24 hours

    - Certificate: ROHS, UL, ISO9001-2000, ISO14001,SGS Lead-Free

    PCB Capacity

    PCB General Capability
    Number of Layer 1 – 20 Layer
    Maximum Processing Area 680 × 1000MM
    Min Board Thickness 2 Layer – 0.3MM ( 12 mil )
    4 Layer – 0.4MM ( 16 mil )
    6 Layer – 0.8MM ( 32 mil )
    8 Layer – 1.0MM ( 40 mil)
    10 Layer – 1.1MM ( 44 mil )
    12 Layer – 1.3MM ( 52 mil )
    14 Layer – 1.5MM ( 59 mil )
    16 Layer – 1.6MM ( 63 mil )
    18 Layer – 1.8MM ( 71 mil )
    Finished Board Thickness Tolerance Thickness ≤ 1.0MM, Tolerance: ± 0.1MM
    1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%
    Twisting and Bending ≤ 0.75%, Min: 0.5%
    Range of TG 130 – 215 ℃
    Impedance Tolerance ± 10%, Min: ± 5%
    Hi-Pot Test Max: 4000V/10MA/60S
    Surface Treatment HASL, With Lead, HASL Free Lead
    Flash Gold, Immersion Gold
    Immersion Silver, Immersion Tin
    Gold Finger, OSP
    PCB Cu Thickness + Plating
    Out Layer Cu Thickness 1 – 6OZ
    Inner Layer Cu Thickness 0.5 – 4OZ
    Cu Thickness of PTH 20UM ≤ Average ≤ 25UM
    Min: 18UM
    HASL with Lead Tin 63% Lead 37%
    HASL Free Lead 7UM ≤ Surface Thickness ≤ 12UM
    Thick Gold Plating Ni Thickness: 3 – 5UM ( 120u” – 200u” )
    Gold Thickness: 0.025 – 1.27UM ( 1u” – 50u” )
    Immersion Gold Ni Thckness: 3 – 5UM ( 120u” – 200u” )
    Gold Thickness: 0.025 – 0.15UM ( 1u” – 3u” )
    Immersion Silver Ag Thickness: 0.15- 0.75 UM ( 6u” – 30u” )
    Gold Finger Ni Thickness: 3 – 5UM ( 120u” – 160u” )
    Gold Thickness: 0.025 – 1.51UM ( 1u” – 60u” )
    U940 PCB Pattern Limit Capability
    Min Width 0.075MM ( 3 mil )
    Min Trace 0.075MM ( 3 mil )
    Min Width of Ring ( Inner Layer ) 0.15MM ( 6 mil )
    Min Width of Ring ( Out Layer ) 0.1MM ( 4 mil )
    Min Solder Bridge 0.1MM ( 4 mil )
    Min Height of Legend 0.7MM ( 28 mil )
    Min Width of Legend 0.15MM ( 6 mil )
    PCB Holes Processing Capability
    Final Hole Size Min: Laser 0.1MM, Machine 0.2MM
    Drilling Hole Size 0.10 – 6.5MM
    Drilling Tolerance NPTH: ±0.05MM, PTH: ±0.075MM
    Final Hole Size Tolerance ( PTH ) φ0.20 – 1.60MM ± 0.075MM
    φ1.60 – 6.30MM ± 0.10MM
    Final Hole Size Tolerance ( NPTH ) φ0.20 – 1.60MM ± 0.05MM
    φ1.60 – 6.50MM ± 0.05MM
    Drilling Strip Hole -0L ~tu.’gth /width 2:1
    Min Strip Hole Width 0.65MM
    Length & Width Tolerance ± 0.05MM
    Board Thickness / Hole Size ≤ 10:1
    PCB Cover Thickness Capability
    Solder Mask Color Green,Matte Green,Yellow,Blue,Red,Black,Matte Black,White
    Solder Mask Thickness Surface Line ≥ 10UM
    Surface Line Corner ≥ 6UM
    Surface Board 10 – 25UM
    Solder Mask Bridge Width
    Legend Color White,Yellow,Black
    Min Height of Legend 0.70MM ( 28 mil )
    Min Width of Legend 0.15MM ( 6 mil )
    Blue Gel Thickness 0.2 – 1.5MM
    Blue Gel Tolerance ±0.15MM
    Carbon Print Thickness 5 – 25UM
    Carbon Print Min Space 0.25MM
    Carbon Print Impedance 200Ω
    Blind/Burried/Half Via PCB Capability
    Parameters (1+1)e.g.(4-layer)blind via:1-2,2-4

    (6-layer)buried via:2-3,3-4

    (8-layer)blind/buried:1-3,4-5,6-8

    Min Via Laser 0.1MM, Machine 0.2MM
    Half Via Min: 0.6MM
    Impedance Capability
    Resistance Value Single-ended 50 – 75Ω, Difference 100Ω, Coplanar 50 – 75Ω

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